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1.发明授权公开(公告)号：US08588952B2
公开(公告)日：2013-11-19
申请号：US13008196
申请日：2011-01-18
IPC分类号： G06F19/00
CPC分类号： H01L21/67178 , H01L21/67173 , H01L21/67745
摘要： A substrate processing system, which repeats a carrying cycle in which a substrate is carried sequentially in a carrying order indicated by module numbers assigned to the modules, respectively, from the module of a lower module number to that of a higher module number, and is capable of processing substrates at a high throughput even if some modules become unusable and, thereafter, become usable. A controller controls a carrier such that the carrier carries a substrate taken out from the module preceding a multimodule unit including a plurality of modules to the module nest in the carrying order to the module of the multimodule unit from which a substrate is carried out at time nearest to time when the substrate was carried out from the module preceding the multimodule.
摘要翻译： 一种基板处理系统，其重复进行循环，其中分别以较低模块号的模块与较高模块编号的模块分别以由模块分配的模块号指示的承载顺序顺序地承载基板，并且是 能够以高产量处理基板，即使一些模块变得不可用，并且之后变得可用。 控制器控制载体，使得载体承载从包括多个模块的多模块单元之前的模块取出的基板到模块嵌套到载体序列到多模单元的模块，在该模块上，时间 最接近基板从多模块前面的模块执行的时间。
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公开(公告)号：US08560108B2
公开(公告)日：2013-10-15
申请号：US12971171
申请日：2010-12-17
CPC分类号： H01L21/67225 , H01L21/67196
摘要： Even when a module constituting a multi-module becomes an unavailable module, transfer of substrates can be promptly performed, while restricting generation of inferior products. When a destination module of a multi-module becomes unavailable before a substrate is transferred to the destination module, a destination of the substrate is changed to a module to which a substrate subsequent to the substrate is to be loaded. Upon generation of an unavailable module, before the transfer unit accesses the module on an upstream end of the transfer cycle, the transfer cycle proceeds until a precedent substrate becomes ready to be unloaded from the changed destination module. Alternatively, upon generation of an unavailable module, when the transfer unit is located on an upstream side of the unavailable module in the transfer cycle, the transfer operation of the transfer unit is made standby until a precedent substrate becomes ready to be unloaded in the changed destination module.
摘要翻译： 即使构成多模块的模块成为不可用模块，也可以迅速地进行基板的转印，同时限制劣质产品的产生。 当在将基板传送到目的地模块之前，多模块的目的地模块变得不可用时，将基板的目的地改变为要在基板之后的基板被加载到的模块。 在生成不可用模块之前，在传送单元在传送周期的上游端访问模块之前，传送周期继续进行，直到先前的基板准备好从改变的目的地模块卸载。 或者，当生成不可用模块时，当传送单元位于传送周期中的不可用模块的上游侧时，传送单元的传送操作被备用直到先前的基板准备好在改变后的装载中被卸载 目的地模块。
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公开(公告)号：US08916229B2
公开(公告)日：2014-12-23
申请号：US13215842
申请日：2011-08-23
申请人： Akira Miyata , Kenichirou Matsuyama , Kunie Ogata
发明人： Akira Miyata , Kenichirou Matsuyama , Kunie Ogata
CPC分类号： H01L21/67126 , B05D5/12 , H01L21/6715 , H01L21/67225 , H01L21/6723
摘要： Provided is a substrate processing apparatus in which after a module is disabled, a substrate is provided to a carry-in module capable of placing the wafers most rapidly in the plurality of unit blocks and the substrates are sequentially transported to the module group by the transportation means to be delivered to the carry-out module according to a providing sequence of the substrate to the carry-in module in each of the plurality of unit blocks. In particular, the substrates are extracted from the carry-out module according to a providing sequence of the substrate to the carry-in module and transported to a rear module or a substrate placing part. Thereafter, the substrates are transported to the rear module from the carry-out module or the substrate placing part according to a predetermined sequence in which the substrate is provided to the carry-in module in a normal state.
摘要翻译： 提供了一种基板处理装置，其中在禁用模块之后，将基板设置到能够将晶片最快地放置在多个单位块中的载入模块，并且基板通过运输顺序地传送到模块组 用于根据向多个单元块中的每个单元块中的进位模块提供的基板的顺序将其输送到进出模块的装置。 特别地，根据向基座的提供顺序，从进出模块中取出基板，并将其输送到后模块或基板放置部。 之后，将基板按照规定的顺序从进出模块或基板放置部件输送到后模块，其中基板在正常状态下被提供给输入模块。
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公开(公告)号：US20120058253A1
公开(公告)日：2012-03-08
申请号：US13215842
申请日：2011-08-23
申请人： Akira Miyata , Kenichirou Matsuyama , Kunie Ogata
发明人： Akira Miyata , Kenichirou Matsuyama , Kunie Ogata
CPC分类号： H01L21/67126 , B05D5/12 , H01L21/6715 , H01L21/67225 , H01L21/6723
摘要： Provided is a substrate processing apparatus in which after a module is disabled, a substrate is provided to a carry-in module capable of placing the wafers most rapidly in the plurality of unit blocks and the substrates are sequentially transported to the module group by the transportation means to be delivered to the carry-out module according to a providing sequence of the substrate to the carry-in module in each of the plurality of unit blocks. In particular, the substrates are extracted from the carry-out module according to a providing sequence of the substrate to the carry-in module and transported to a rear module or a substrate placing part. Thereafter, the substrates are transported to the rear module from the carry-out module or the substrate placing part according to a predetermined sequence in which the substrate is provided to the carry-in module in a normal state.
摘要翻译： 提供了一种基板处理装置，其中在禁用模块之后，将基板设置到能够将晶片最快地放置在多个单位块中的载入模块，并且基板通过运输顺序地传送到模块组 用于根据向多个单元块中的每个单元块中的进位模块提供的基板的顺序将输送到输出模块的装置。 特别地，根据向基座的提供顺序，从进出模块中取出基板，并将其输送到后模块或基板放置部。 之后，将基板按照规定的顺序从进出模块或基板放置部件输送到后模块，其中基板在正常状态下被提供给输入模块。
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公开(公告)号：US08448600B2
公开(公告)日：2013-05-28
申请号：US12796160
申请日：2010-06-08
CPC分类号： G03F7/20 , H01L21/6715 , H01L21/67178 , H01L21/67276 , H01L21/67745 , H01L21/67769
摘要： A substrate processing apparatus is disclosed equipped with a transfer mechanism that transfers a substrate processed at a processing block to a carrier so that the increase of the number of transfer process is suppressed, improving the processing efficiency. The substrate processing apparatus is configured in such a way that, when a second-transfer module houses at least one substrate and a carrier that can house the at least one substrate is not placed in a carrier-placement unit, the at least one substrate is transferred to a buffer module. When the second transfer module houses at least one substrate and the carrier that can house the at least one substrate is placed in the carrier-placement unit, the at least one substrate is transferred to the carrier, regardless of whether or not a substrate is being transferred from the buffer module to the carrier.
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