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    System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers
    1.
    发明申请
    System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers 有权
    在三维基础设施中为大规模可扩展的计算机提供冷却的系统和方法

    公开(公告)号：US20050152114A1

    公开(公告)日：2005-07-14

    申请号：US10754971

    申请日：2004-01-09

    申请人： Kenneth Fernandez ,  Claudio Fleiner ,  Robert Garner ,  Harald Huels ,  Manfred Ries ,  Winfried Wilcke

    发明人： Kenneth Fernandez ,  Claudio Fleiner ,  Robert Garner ,  Harald Huels ,  Manfred Ries ,  Winfried Wilcke

    IPC分类号： G06F1/20

    CPC分类号： G06F1/20 ,  G06F2200/201 ,  Y10T29/49169

    摘要： A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldrail to facilitate the removal of heat from the at least one compute, storage, or communications brick. Also, the three-dimensional computer infrastructure includes a brick-internal carrier within the at least one compute, storage, communications brick, wherein the brick-internal carrier is attached to the at least one coldrail. Moreover, the three-dimensional computer infrastructure includes a power dissipating electronic element within the at-least-one compute, storage, or communications brick, wherein the power dissipating element is attached to the brick-internal carrier.

    摘要翻译： 提供三维计算机基础设施冷却系统。 三维计算机基础设施冷却系统包括至少一个计算，存储或通信砖。 此外，三维计算机基础设施冷却系统包括至少一个冷轨，以便于从至少一个计算，存储或通信砖去除热量。 此外，三维计算机基础设施包括在至少一个计算，存储，通信砖内的砖内部载体，其中砖内部载体附接到至少一个冷轨。 此外，三维计算机基础设施包括在至少一个计算，存储或通信砖内的功率消耗电子元件，其中功率耗散元件附接到砖内部载体。

    Mechanism for self-alignment of communications elements in a modular electronic system
    3.
    发明申请
    Mechanism for self-alignment of communications elements in a modular electronic system 失效
    模块化电子系统中通信元件自对准的机制

    公开(公告)号：US20060104011A1

    公开(公告)日：2006-05-18

    申请号：US10987901

    申请日：2004-11-12

    申请人： Robert Garner ,  Winfried Wilcke ,  Richard Williams

    发明人： Robert Garner ,  Winfried Wilcke ,  Richard Williams

    IPC分类号： H05K5/00

    CPC分类号： H04Q1/03 ,  G06F1/181 ,  H04Q1/023 ,  H04Q1/035 ,  H04Q2201/02

    摘要： A mechanism that automatically achieves alignment of the communications elements during assembly of a modular computer system, without the need for human intervention. The mechanism comprises an alignment frame provided with bumps and depressions. The bumps in the alignment frames mate with the depressions on adjacent alignment frames. Each depression comprises an entrance opening that is wider than the diameter of the bumps. The diameter of the entrance opening is determined by the expected accuracy of the alignment of subsystems or bricks within the modular electronic system. When it is desired to align the communication elements, the alignment frames are brought into engagement by causing alignment guides to slide past each other, and to guide the bumps in the alignment frames into the depressions in the adjacent alignment frames. The mechanism further comprises a set of springs that force the allow the alignment frames to be retained securely by the communications elements.

    摘要翻译： 在组装模块化计算机系统期间自动实现通信元件对准的机制，而不需要人为干预。 该机构包括具有凸起和凹陷的对准框架。 对准框架中的凸起与相邻对准框架上的凹陷配合。 每个凹陷包括比凸起的直径更宽的入口开口。 入口的直径由模块化电子系统内子系统或砖块对准的预期精度确定。 当需要对准通信元件时，通过使对准引导件彼此滑动而使对准框架接合，并且将对准框架中的凸块引导到相邻对准框架中的凹部中。 该机构还包括一组弹簧，其强制允许对准框架被通信元件牢固地保持。