摘要:
A curable resin composition includes an unsaturated polyester, an alkenyl aromatic compound, and a capped poly(arylene ether). The composition is suitable for low temperature curing and exhibits reduced curing shrinkage and reduced brittleness.
摘要:
A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.
摘要:
A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.
摘要:
The invention relates to a polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, bismaleiimides, silicones, and allylics, and thermoplastics such as polyolefins, styrenics, rubbers, etc.
摘要:
Thermosetting polymers and the electrical laminates made therefrom are disclosed. The laminate comprises a cross-linked product of: a) one or more ethylenically unsaturated aromatic monomers, with fire retardation being optionally contributed by one halogenated monomer, b) a vinyl-terminated polybutadiene or butadiene-styrene copolymer containing either a urethane or an ester group, and c) a chemically modified polyphenylene ether resin, preferably low molecular weight chemically modified polyphenylene ether resin. It has been discovered that an unexpected combination of thermal, electrical, and mechanical properties are obtained from the composition recited herein. Therefore, the composition is ideally suited as a matrix polymer for electrical substrate applications.
摘要:
The invention relates to a polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, bismaleiimides, silicones, and allylics, and thermoplastics such as polyolefins, styrenics, rubbers, etc.
摘要:
The invention relates to a novel process for the manufacture of polyphenylene ether resin containing residual aliphatic unsaturation. The invention also relates to the polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, and thermoplastics such as polyolefins.
摘要:
The invention relates to a polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, bismaleiimides, silicones, and allylics, and thermoplastics such as polyolefins, styrenics, rubbers, etc.
摘要:
This invention is directed to a tie layer for improving the adhesion of a layer of a fluoride-based polymeric material to a layer of a polyphenylene ether- or polystyrene-based material. The tie layer comprises a copolymer of a styrenic material like high impact polystyrene, and an acrylic material such as poly(methyl methacrylate) (PMMA). The tie layer composition may further include at least one flexibilizing agent which is compatible with one of the materials in the other layers. Exemplary flexibilizing agents are blends or copolymers which comprise rubber and polystyrene, or core-shell impact modifiers, or combinations of these types of materials. The layers can be coextruded or laminated, using conventional techniques.
摘要:
A composition and method for promoting improved adhesion between a thermoplastic resinous substrate and polyurethane foam is provided. In one aspect of this invention, the composition comprises a thermoplastic mixture of at least one polyphenylene ether and at least one poly(alkenylaromatic) compound; and at least one primary amine-containing material or secondary amine-containing material.