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    Molding method for curable poly(arylene ether) composition and article thereby
    5.
    发明申请
    Molding method for curable poly(arylene ether) composition and article thereby 审中-公开
    可固化聚（亚芳基醚）组合物和制品的成型方法

    公开(公告)号：US20060038324A1

    公开(公告)日：2006-02-23

    申请号：US10923518

    申请日：2004-08-20

    申请人： Gary Yeager ,  Bryan Duffey ,  Hua Guo ,  Zhiqing Lin ,  Nitin Vaish

    发明人： Gary Yeager ,  Bryan Duffey ,  Hua Guo ,  Zhiqing Lin ,  Nitin Vaish

    IPC分类号： B29C43/02

    CPC分类号： B29C43/003 ,  C08G65/48 ,  C08L71/10 ,  C08L71/126 ,  H01L21/565 ,  H01L23/293 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K3/0014 ,  H01L2924/00

    摘要： A curable composition containing a functionalized poly(arylene ether), an acryloyl monomer, and a filler is compression molded by a method that includes introducing the composition to a mold, closing the mold and applying a first temperature of about 120 to about 200° C. and a first pressure of about 1,000 to about 40,000 kilopascals for about 1 to about 100 seconds; opening the mold for about 0.005 to about 10 seconds; and closing the mold a second time and applying a second temperature of about 120 to about 200° C. and a second pressure of about 1,000 to about 40,000 kilopascals for about 20 to about 100 seconds. Molded articles formed by the method exhibit improved dielectric properties.

    摘要翻译： 含有官能化聚（亚芳基醚），丙烯酰基单体和填料的可固化组合物通过包括将组合物引入模具，封闭模具并施加约120至约200℃的第一温度的方法进行压塑 约1000至约40,000千帕斯卡的第一压力约1至约100秒; 打开模具约0.005至约10秒; 并且第二次关闭模具并施加约120至约200℃的第二温度和约1,000至约40,000千帕斯卡的第二压力约20至约100秒。 通过该方法形成的模制品表现出改进的介电性能。