-
1.发明授权System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers 有权在三维基础设施中为大规模可扩展的计算机提供冷却的系统和方法公开(公告)号：US07242579B2
公开(公告)日：2007-07-10
申请号：US10754971
申请日：2004-01-09
申请人： Kenneth Richard Fernandez , Claudio Matthias Fleiner , Robert Barton Garner , Harald Huels , Manfred Ries , Winfried Wolfgang Wilcke
发明人： Kenneth Richard Fernandez , Claudio Matthias Fleiner , Robert Barton Garner , Harald Huels , Manfred Ries , Winfried Wolfgang Wilcke
CPC分类号： G06F1/20 , G06F2200/201 , Y10T29/49169
摘要： A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldrail to facilitate the removal of heat from the at least one compute, storage, or communications brick. Also, the three-dimensional computer infrastructure includes a brick-internal carrier within the at least one compute, storage, communications brick, wherein the brick-internal carrier is attached to the at least one coldrail. Moreover, the three-dimensional computer infrastructure includes a power dissipating electronic element within the at-least-one compute, storage, or communications brick, wherein the power dissipating element is attached to the brick-internal carrier.
摘要翻译： 提供三维计算机基础设施冷却系统。 三维计算机基础设施冷却系统包括至少一个计算，存储或通信砖。 此外，三维计算机基础设施冷却系统包括至少一个冷轨，以便于从至少一个计算，存储或通信砖去除热量。 此外，三维计算机基础设施包括在至少一个计算，存储，通信砖内的砖内部载体，其中砖内部载体附接到至少一个冷轨。 此外，三维计算机基础设施包括在至少一个计算，存储或通信砖内的功率消耗电子元件，其中功率耗散元件附接到砖内部载体。
-
2.发明授权Scalable computer system having surface-mounted capacitive couplers for intercommunication 失效可扩展的计算机系统具有用于相互通信的表面安装电容耦合器公开(公告)号：US07038553B2
公开(公告)日：2006-05-02
申请号：US10264893
申请日：2002-10-03
IPC分类号： H01P1/00
CPC分类号： G06F1/18 , H01L23/48 , H01L25/105 , H01L2225/1005 , H01L2924/0002 , H01L2924/3011 , Y10S439/95 , H01L2924/00
摘要： A scalable and compact computer system of three-dimensional subsystems each having capacitive couplers on its external surfaces for transmitting and receiving electrical signals to and from adjacent subsystems. Each surface having an electrically non-conducting substrate, one or more electrically conducting pads on the substrate, and electrical leads for coupling the pads to the subsystem's circuits. Two adjacent pads, each from a different subsystem, form a capacitive coupler to carry the signals between the subsystems. The pads are covered by a low-loss dielectric material having a large dielectric constant for improved signal transmission. A differential signal may be supported using two capacitive couplers to respectively carry the positive and negative signals of the differential signal. The subsystems might be replaced or left in place when they failed. Additional subsystems might be added to the system to expand its capacity.
摘要翻译： 三维子系统的可扩展和紧凑的计算机系统，每个子系统在其外表面上具有电容耦合器，用于向相邻子系统发送和接收电信号。 每个表面具有非导电衬底，衬底上的一个或多个导电焊盘，以及用于将焊盘耦合到子系统电路的电引线。 两个相邻的焊盘，每个来自不同的子系统，形成电容耦合器以在子系统之间传送信号。 焊盘由具有大介电常数的低损耗介电材料覆盖以改善信号传输。 可以使用两个电容耦合器来分别承载差分信号的正和负信号来支持差分信号。 子系统出现故障时可能会更换或保留在原位。 可能会向系统添加其他子系统以扩展其容量。
-
3.发明授权Method for high-density packaging and cooling of high-powered compute and storage server blades 失效高功率计算和存储服务器刀片的高密度封装和冷却方法公开(公告)号：US07552758B2
公开(公告)日：2009-06-30
申请号：US10977159
申请日：2004-10-29
IPC分类号： H05K7/20
CPC分类号： H05K7/20009 , F28F3/12
摘要： According to the present invention, there is provided a system for removing heat from server blades densely packaged in a rack of server blades. The system includes a liquid distribution manifold. In addition, the system includes a plurality of cold blades attached to the liquid distribution manifold, wherein liquid is circulated through the liquid distribution manifold and the cold blades. Moreover, the system includes at least one server blade attached to each of the cold blades.
摘要翻译： 根据本发明，提供了一种用于从密集地封装在服务器刀片架中的服务器刀片移除热量的系统。 该系统包括液体分配歧管。 此外，系统包括附接到液体分配歧管的多个冷刀片，其中液体通过液体分配歧管和冷刀片循环。 此外，该系统包括连接到每个冷叶片的至少一个服务器刀片。
-
4.发明授权Mechanism for self-alignment of communications elements in a modular electronic system 失效模块化电子系统中通信元件自对准的机制公开(公告)号：US07206194B2
公开(公告)日：2007-04-17
申请号：US10987901
申请日：2004-11-12
IPC分类号： H05K5/00
CPC分类号： H04Q1/03 , G06F1/181 , H04Q1/023 , H04Q1/035 , H04Q2201/02
摘要： A mechanism that automatically achieves alignment of the communications elements during assembly of a modular computer system, without the need for human intervention. The mechanism comprises an alignment frame provided with bumps and depressions. The bumps in the alignment frames mate with the depressions on adjacent alignment frames. Each depression comprises an entrance opening that is wider than the diameter of the bumps. The diameter of the entrance opening is determined by the expected accuracy of the alignment of subsystems or bricks within the modular electronic system. When it is desired to align the communication elements, the alignment frames are brought into engagement by causing alignment guides to slide past each other, and to guide the bumps in the alignment frames into the depressions in the adjacent alignment frames. The mechanism further comprises a set of springs that force the allow the alignment frames to be retained securely by the communications elements.
摘要翻译： 在组装模块化计算机系统期间自动实现通信元件对准的机制，而不需要人为干预。 该机构包括具有凸起和凹陷的对准框架。 对准框架中的凸起与相邻对准框架上的凹陷配合。 每个凹陷包括比凸起的直径更宽的入口开口。 入口的直径由模块化电子系统内子系统或砖块对准的预期精度确定。 当需要对准通信元件时，通过使对准引导件彼此滑动而使对准框架接合，并且将对准框架中的凸块引导到相邻对准框架中的凹部中。 该机构还包括一组弹簧，其强制允许对准框架被通信元件牢固地保持。
-
公开(公告)号：USD514102S1
公开(公告)日：2006-01-31
申请号：US29192062
申请日：2003-10-17
-
-
-
-
搜索结果
5 条记录 (耗时 0.03 秒)
