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    Electronic apparatus
    1.
    发明授权
    Electronic apparatus 有权
    电子仪器

    公开(公告)号：US08400769B2

    公开(公告)日：2013-03-19

    申请号：US12895473

    申请日：2010-09-30

    申请人： Kentaro Tomioka ,  Takeshi Hongo ,  Yukihiko Hata

    发明人： Kentaro Tomioka ,  Takeshi Hongo ,  Yukihiko Hata

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20336

    摘要： According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.

    摘要翻译： 根据一个实施例，一种电子设备包括：壳体，其具有进气孔，容纳在壳体中的电路板，安装在电路板上的发热部件，容纳在壳体中的散热器和发送冷却的风扇 空气到壳体中的散热器，并且包括容纳在风扇壳体中的风扇壳体和叶轮。 所述风扇壳体包括第一吸入口和第二吸入口，所述第一吸入口和第二吸入口在所述叶片插入其间彼此面对，以及与所述散热器相对的排气口。 第一吸入口与壳体的进气孔连通。 第二吸入口包括面对壳体中的发热部件的开口区域和在偏离电路板的位置处对壳体内部开口的另一开口区域。

    ELECTRONIC APPARATUS
    2.
    发明申请
    ELECTRONIC APPARATUS 审中-公开
    电子设备

    公开(公告)号：US20110075360A1

    公开(公告)日：2011-03-31

    申请号：US12837846

    申请日：2010-07-16

    申请人： Kentaro Tomioka ,  Takeshi Hongo ,  Yukihiko Hata

    发明人： Kentaro Tomioka ,  Takeshi Hongo ,  Yukihiko Hata

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/4006 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20336 ,  H01L2924/00

    摘要： According to one embodiment, an electronic apparatus includes a housing, a heat dissipating member disposed inside the housing, a first heat generating element mounted on the circuit board, a second heat generating element mounted on the circuit board, a first heat pipe, and a second heat pipe. The first heat pipe includes a first heat receiving portion thermally connected to the first heat generating element, and a first heat releasing portion thermally connected to the heat dissipating member. The second heat pipe includes a second heat receiving portion thermally connected to the second heat generating element, a second heat releasing portion thermally connected to the heat dissipating member, and a fluid capturing structure configured to temporarily hold a working fluid enclosed inside the second heat pipe.

    摘要翻译： 根据一个实施例，电子设备包括壳体，设置在壳体内部的散热构件，安装在电路板上的第一发热元件，安装在电路板上的第二发热元件，第一热管和 第二热管。 第一热管包括热连接到第一发热元件的第一热接收部分和热连接到散热部件的第一热释放部分。 第二热管包括热连接到第二发热元件的第二热接收部分，与散热部件热连接的第二热释放部分，以及流体捕获结构，其被配置为暂时保持封闭在第二热管内的工作流体 。

    ELECTRONIC APPARATUS
    3.
    发明申请
    ELECTRONIC APPARATUS 有权
    电子设备

    公开(公告)号：US20110075366A1

    公开(公告)日：2011-03-31

    申请号：US12895473

    申请日：2010-09-30

    申请人： Kentaro Tomioka ,  Takeshi Hongo ,  Yukihiko Hata

    发明人： Kentaro Tomioka ,  Takeshi Hongo ,  Yukihiko Hata

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20336

    摘要： According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.

    摘要翻译： 根据一个实施例，一种电子设备包括：壳体，其具有进气孔，容纳在壳体中的电路板，安装在电路板上的发热部件，容纳在壳体中的散热器和发送冷却的风扇 空气到壳体中的散热器，并且包括容纳在风扇壳体中的风扇壳体和叶轮。 所述风扇壳体包括第一吸入口和第二吸入口，所述第一吸入口和第二吸入口在所述叶片插入其间彼此面对，以及与所述散热器相对的排气口。 第一吸入口与壳体的进气孔连通。 第二吸入口包括面对壳体中的发热部件的开口区域和在偏离电路板的位置处对壳体内部开口的另一开口区域。

    Electronic device
    4.
    发明授权
    Electronic device 有权
    电子设备

    公开(公告)号：US08199503B2

    公开(公告)日：2012-06-12

    申请号：US12845609

    申请日：2010-07-28

    申请人： Kentaro Tomioka ,  Takeshi Hongo

    发明人： Kentaro Tomioka ,  Takeshi Hongo

    IPC分类号： H05K7/20 ,  F28D15/00

    CPC分类号： H05K7/20336 ,  H01L2924/0002 ,  H05K7/2049 ,  H01L2924/00

    摘要： According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.

    摘要翻译： 根据一个实施例，电子设备包括壳体，电路板，热辐射部分，第一热发生器，第二热发生器，第一热接收块，第二热接收块，至少一个热管，包括 第一端和第二端，包括第三端，第四端和中间部分的第二热管，以及设置在第一热接收块上的切口部。 第二热发生器安装在比第一热发生器更远离热辐射部分的位置处的电路板上。 第一热接收块设置有切口部，并与第一热发生器热连接。 第二热接收块热连接到第二热发生器。 第二热管的中间部分穿过切口部分。

    ELECTRONIC DEVICE
    5.
    发明申请
    ELECTRONIC DEVICE 有权
    电子设备

    公开(公告)号：US20110075371A1

    公开(公告)日：2011-03-31

    申请号：US12845609

    申请日：2010-07-28

    申请人： Kentaro Tomioka ,  Takeshi Hongo

    发明人： Kentaro Tomioka ,  Takeshi Hongo

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20336 ,  H01L2924/0002 ,  H05K7/2049 ,  H01L2924/00

    摘要： According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.

    摘要翻译： 根据一个实施例，电子设备包括壳体，电路板，热辐射部分，第一热发生器，第二热发生器，第一热接收块，第二热接收块，至少一个热管，包括 第一端和第二端，包括第三端，第四端和中间部分的第二热管，以及设置在第一热接收块上的切口部。 第二热发生器安装在比第一热发生器更远离热辐射部分的位置处的电路板上。 第一热接收块设置有切口部，并与第一热发生器热连接。 第二热接收块热连接到第二热发生器。 第二热管的中间部分穿过切口部分。

    Electronic device
    6.
    发明授权
    Electronic device 失效
    电子设备

    公开(公告)号：US08031469B2

    公开(公告)日：2011-10-04

    申请号：US12787305

    申请日：2010-05-25

    申请人： Kentaro Tomioka ,  Takeshi Hongo

    发明人： Kentaro Tomioka ,  Takeshi Hongo

    IPC分类号： H05K7/20 ,  F28D15/00

    CPC分类号： H05K7/20172

    摘要： According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.

    摘要翻译： 根据一个实施例，电子设备包括壳体，第一至第三印刷电路板以及风扇单元。 第一印刷电路板包括固定到第一布线板的第一发热部。 第二印刷电路板包括第二和第三发热部件，其发热量大于第一印刷电路板的发热量，并且位于第一印刷电路板和第二壁之间。 第三印刷电路板包括第四发热部分，其发热量小于第一印刷电路板的发热量，并且位于第一印刷电路板和第一壁之间。

    Electronic apparatus
    7.
    发明授权
    Electronic apparatus 失效
    电子仪器

    公开(公告)号：US08045327B2

    公开(公告)日：2011-10-25

    申请号：US12860360

    申请日：2010-08-20

    申请人： Kentaro Tomioka ,  Takeshi Hongo

    发明人： Kentaro Tomioka ,  Takeshi Hongo

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20136 ,  H05K7/20518

    摘要： According to one embodiment, an electronic apparatus includes a housing, a partition, a first cooling fan, and a second cooling fan. The partition partitions an inside of the housing into a first chamber and a second chamber. The first chamber communicates with a first inlet, a third inlet, and a first outlet. The second chamber communicates with a second inlet and a second outlet. The first cooling fan locates above the third inlet in the first chamber, and includes a first intake configured to draw air in the first chamber, and a second intake configured to draw air outside the housing through the third inlet, the first cooling fan being configured to discharge the air to a heat sink. The second cooling fan locates in the second chamber and is configured to draw air in the second chamber, and to discharge the air to the second outlet.

    摘要翻译： 根据一个实施例，电子设备包括壳体，隔板，第一冷却风扇和第二冷却风扇。 隔板将壳体的内部分隔成第一室和第二室。 第一室与第一入口，第三入口和第一出口连通。 第二室与第二入口和第二出口连通。 第一冷却风扇位于第一室中的第三入口的上方，并且包括构造成在第一室中抽取空气的第一进气口和构造成通过第三入口将空气抽吸到壳体外部的第二进气口，第一冷却风扇被配置 将空气排放到散热器。 第二冷却风扇位于第二室中，并被构造成在第二室中抽取空气，并将空气排出到第二出口。

    ELECTRONIC APPARATUS
    9.
    发明申请
    ELECTRONIC APPARATUS 失效
    电子设备

    公开(公告)号：US20090195988A1

    公开(公告)日：2009-08-06

    申请号：US12356413

    申请日：2009-01-20

    申请人： Takeshi Hongo

    发明人： Takeshi Hongo

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0266 ,  F28F1/24 ,  G06F1/203 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

    摘要： According to one embodiment, a heat sink includes first and second fin units. Fins of the first fin unit are provided with a through-hole part in which a heat pipe is inserted. Fins of the second fin unit are provided with a cutout part cut out to avoid the peat pipe. The fins of the second fin unit are inserted in spaces between the fins of the first fin unit. The fins of the second fin unit reach to a region in which the fins of the second fin unit overlap the heat pipe in the first fin unit.

    摘要翻译： 根据一个实施例，散热器包括第一和第二鳍单元。 第一翅片单元的叶片设置有插入热管的通孔部。 第二翅片单元的叶片设置有切除部分，以避免泥炭管。 第二翅片单元的翅片插入在第一翅片单元的翅片之间的空间中。 第二翅片单元的翅片到达第二翅片单元的翅片与第一翅片单元中的热管重叠的区域。