摘要:
According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.
摘要:
According to one embodiment, an electronic apparatus includes a housing, a heat dissipating member disposed inside the housing, a first heat generating element mounted on the circuit board, a second heat generating element mounted on the circuit board, a first heat pipe, and a second heat pipe. The first heat pipe includes a first heat receiving portion thermally connected to the first heat generating element, and a first heat releasing portion thermally connected to the heat dissipating member. The second heat pipe includes a second heat receiving portion thermally connected to the second heat generating element, a second heat releasing portion thermally connected to the heat dissipating member, and a fluid capturing structure configured to temporarily hold a working fluid enclosed inside the second heat pipe.
摘要:
According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.
摘要:
The cooling unit includes a heat receiving portion, a heat radiating portion and a circulation path. The heat radiating portion has an impeller, a heat-radiating member and a case. The heat-radiating member surround the impeller that applies cooling air. The heat-radiating member has a coolant passage in which liquid coolant flows, and a plurality of heat-radiating fins which are thermally connected to the coolant passage. The case contains the impeller and the heat-radiating member and has at least one outlet port through which the cooling air is expelled.
摘要:
In one embodiment of the invention, a pump includes a pump housing, an impeller, and a motor. The pump housing has a pump chamber and a heat receiving plate to couple to a heat generating unit, such as a CPU. The impeller is provided in the pump chamber. The motor couples to the impeller to rotate it. A region of the heat receiving plate projects further outward than other regions to couple the heat receiving plate to the IC chip.
摘要:
A cooling unit includes a heat receiving portion thermally connected to a heat generating component, a heat radiating portion which radiates heat generated by the heat generating component, and a circulation path which circulates a liquid coolant between the heat receiving portion and the heat radiating portion. The heat radiating portion includes a first path portion, a second path portion, a third path portion, and a plurality of heat radiating fins. Each of the first and second path portions has a flat pipe through which the liquid coolant flows. The two pipes have cross sections which are elongated in the same direction and facing each other. The heat radiating fins are interposed between the two pipes and thermally connected to the two pipes.
摘要:
A pump includes: a housing having a heating receiving portion thermally connected to a heat generating element and a pump chamber; a stator; and a rotary member disposed in the pump chamber, and having a stirring portion which stirs a fluid in the pump chamber and a magnet contained within the rotary member.
摘要:
The present invention provides a cooling pump, an electronic apparatus, and a cooling system in which positioning between a heat generating unit and a cooling pump can be achieved easily. The cooling pump according to the invention includes: a rotor having a disk-shaped member fixed to a revolving shaft, impellers for pressurizing liquid coolant provided on the disk-shaped member, a plurality of permanent magnets disposed into a ring shape disposed on and fixed to the disk-shaped member; a case including a pump chamber for rotatably accommodating rotor, an inlet port and a discharge port for the liquid coolant, and a heat receiving portion for the a heat generating unit which corresponds to part of the side wall of the pump chamber; a cover that closes the case in a liquid-tight manner and is formed with a recess, a stator stored in the recess of the cover for generating revolving magnetic field by a plurality of electromagnets and providing torque about the revolving shaft to the rotor; and a positioning member joined to the heat receiving portion for positioning with respect to the a heat generating unit.
摘要:
An electronic apparatus includes a main unit, support unit and display unit. The main unit has a heat-receiving portion thermally connected to a heat-generating component. The support unit has first and second edges. The first edge is coupled to the main unit. The second edge is located opposite to the first edge. The display unit is coupled to the second edge of the support unit. The support unit contains a heat-radiating portion. The heat-radiating portion includes a tube to convey the medium heated at the heat-receiving portion, a plurality of heat-radiating fins coupled to the tube, and a fan to supply cooling air to the fins.
摘要:
According to one embodiment, a pump housing comprises a heat receiving plate which is thermally coupled to a CPU, and a pump chamber. An impeller to be rotated by a motor is provided in the pump chamber. At least a part of the pump housing is made of resin containing at least one of metal filler, filler of material having lower linear expansion coefficient than the resin, and filler of material having lower water-vapor transmissivity than the resin.