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公开(公告)号：US08354595B2
公开(公告)日：2013-01-15
申请号：US12764854
申请日：2010-04-21
IPC分类号： H05K1/00
CPC分类号： H05K3/361 , H05K1/118 , H05K3/321 , H05K3/4635 , H05K2201/10666 , H05K2203/0455
摘要： A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.
摘要翻译： 一种用于将第一柔性印刷电路板（PCB）与第二柔性PCB互连的方法。 该方法包括：在电耦合到第二柔性PCB的接触位置处提供第一柔性PCB; 向所述第二柔性PCB提供与所述接触位置处的所述孔相对应的电垫; 在第一PCB和第二PCB之间施加不导电材料，其中每个电焊盘具有间隙; 将第一PCB与第二PCB对准，使得第一PCB中的孔与第二PCB上的相应电焊盘对齐; 将第一和第二PCB上的一部分平坦区域结合在一起; 将导电粘合剂分配到孔中以填充由孔产生的空间，非导电材料的相应间隙和相应的电焊盘; 并固化导电粘合剂。
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公开(公告)号：US20110261539A1
公开(公告)日：2011-10-27
申请号：US12764854
申请日：2010-04-21
CPC分类号： H05K3/361 , H05K1/118 , H05K3/321 , H05K3/4635 , H05K2201/10666 , H05K2203/0455
摘要： A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.
摘要翻译： 一种用于将第一柔性印刷电路板（PCB）与第二柔性PCB互连的方法。 该方法包括：在电耦合到第二柔性PCB的接触位置处提供第一柔性PCB; 向所述第二柔性PCB提供与所述接触位置处的所述孔相对应的电垫; 在第一PCB和第二PCB之间施加不导电材料，其中每个电焊盘具有间隙; 将第一PCB与第二PCB对准，使得第一PCB中的孔与第二PCB上的相应电焊盘对齐; 将第一和第二PCB上的一部分平坦区域结合在一起; 将导电粘合剂分配到孔中以填充由孔产生的空间，非导电材料的相应间隙和相应的电焊盘; 并固化导电粘合剂。
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公开(公告)号：US20110114242A1
公开(公告)日：2011-05-19
申请号：US12620490
申请日：2009-11-17
IPC分类号： H01R4/04
CPC分类号： H01Q3/30 , H01Q1/28 , H01Q1/288 , H01Q21/0087
摘要： Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.
摘要翻译： 提供了组装轻量RF天线结构的系统和方法。 在一个实施例中，本发明涉及一种用于形成轻型天线的方法，包括用于形成用于天线的第一馈送组件的过程，用于形成第一馈送组件的过程包括提供平坦柔性电路基板，提供形成的柔性电路基板 将粘合剂施加到平坦基板或成形基板的表面上的多个位置，使用粘合剂接合平板基板和成形基板，并加热接合的平坦基板和形成的基板以结合基板。
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公开(公告)号：US08043464B2
公开(公告)日：2011-10-25
申请号：US12620490
申请日：2009-11-17
CPC分类号： H01Q3/30 , H01Q1/28 , H01Q1/288 , H01Q21/0087
摘要： Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.
摘要翻译： 提供了组装轻量RF天线结构的系统和方法。 在一个实施例中，本发明涉及一种用于形成轻型天线的方法，包括用于形成用于天线的第一馈送组件的过程，用于形成第一馈送组件的过程包括提供平坦柔性电路基板，提供形成的柔性电路基板 将粘合剂施加到平坦基板或成形基板的表面上的多个位置，使用粘合剂接合平板基板和成形基板，并加热接合的平坦基板和形成的基板以结合基板。
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公开(公告)号：US20110298687A1
公开(公告)日：2011-12-08
申请号：US12793448
申请日：2010-06-03
申请人： Kyle W. Maxhimer , David T. Winslow , Larry L. Lai , Derek Pruden
发明人： Kyle W. Maxhimer , David T. Winslow , Larry L. Lai , Derek Pruden
CPC分类号： H01Q1/1292 , Y10T156/10
摘要： The present invention relates to lightweight antenna arrays and more particularly to an attachment mechanism for attaching a lightweight antenna array to a structure. In one embodiment, an antenna structure includes a platform having a first coefficient of thermal expansion; an antenna panel having a second coefficient of thermal expansion different from the first coefficient, and having first and second opposite ends; and a support structure mounting the panel to the platform. The support structure includes a first spacer element with a first height at the first end of the panel, and a second spacer element with a second height less than the first height between the first and second ends of the panel; a first adhesive layer adhering each spacer element to the platform; and a second adhesive layer adhering each spacer element to the antenna panel. A yield strength of the adhesive layers is less than a yield strength of the spacer elements.
摘要翻译： 本发明涉及轻质天线阵列，更具体地说，涉及一种用于将轻型天线阵列附接到结构的附接机构。 在一个实施例中，天线结构包括具有第一热膨胀系数的平台; 天线面板，其具有与所述第一系数不同的第二热膨胀系数，并且具有第一和第二相对端; 以及将面板安装到平台的支撑结构。 支撑结构包括在面板的第一端处具有第一高度的第一间隔元件和具有小于面板的第一和第二端之间的第一高度的第二高度的第二间隔元件; 将每个间隔元件粘附到平台上的第一粘合剂层; 以及将每个间隔元件粘附到天线面板上的第二粘合剂层。 粘合剂层的屈服强度小于间隔元件的屈服强度。
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公开(公告)号：US08274446B2
公开(公告)日：2012-09-25
申请号：US12793448
申请日：2010-06-03
申请人： Kyle W. Maxhimer , David T. Winslow , Larry L. Lai , Derek Pruden
发明人： Kyle W. Maxhimer , David T. Winslow , Larry L. Lai , Derek Pruden
CPC分类号： H01Q1/1292 , Y10T156/10
摘要： The present invention relates to lightweight antenna arrays and more particularly to an attachment mechanism for attaching a lightweight antenna array to a structure. In one embodiment, an antenna structure includes a platform having a first coefficient of thermal expansion; an antenna panel having a second coefficient of thermal expansion different from the first coefficient, and having first and second opposite ends; and a support structure mounting the panel to the platform. The support structure includes a first spacer element with a first height at the first end of the panel, and a second spacer element with a second height less than the first height between the first and second ends of the panel; a first adhesive layer adhering each spacer element to the platform; and a second adhesive layer adhering each spacer element to the antenna panel. A yield strength of the adhesive layers is less than a yield strength of the spacer elements.
摘要翻译： 本发明涉及轻质天线阵列，更具体地说，涉及一种用于将轻型天线阵列附接到结构的附接机构。 在一个实施例中，天线结构包括具有第一热膨胀系数的平台; 天线面板，其具有与所述第一系数不同的第二热膨胀系数，并且具有第一和第二相对端; 以及将面板安装到平台的支撑结构。 支撑结构包括在面板的第一端处具有第一高度的第一间隔元件和具有小于面板的第一和第二端之间的第一高度的第二高度的第二间隔元件; 将每个间隔元件粘附到平台上的第一粘合剂层; 以及将每个间隔元件粘附到天线面板上的第二粘合剂层。 粘合剂层的屈服强度小于间隔元件的屈服强度。
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