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公开(公告)号：US08354595B2
公开(公告)日：2013-01-15
申请号：US12764854
申请日：2010-04-21
IPC分类号： H05K1/00
CPC分类号： H05K3/361 , H05K1/118 , H05K3/321 , H05K3/4635 , H05K2201/10666 , H05K2203/0455
摘要： A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.
摘要翻译： 一种用于将第一柔性印刷电路板（PCB）与第二柔性PCB互连的方法。 该方法包括：在电耦合到第二柔性PCB的接触位置处提供第一柔性PCB; 向所述第二柔性PCB提供与所述接触位置处的所述孔相对应的电垫; 在第一PCB和第二PCB之间施加不导电材料，其中每个电焊盘具有间隙; 将第一PCB与第二PCB对准，使得第一PCB中的孔与第二PCB上的相应电焊盘对齐; 将第一和第二PCB上的一部分平坦区域结合在一起; 将导电粘合剂分配到孔中以填充由孔产生的空间，非导电材料的相应间隙和相应的电焊盘; 并固化导电粘合剂。
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公开(公告)号：US20110261539A1
公开(公告)日：2011-10-27
申请号：US12764854
申请日：2010-04-21
CPC分类号： H05K3/361 , H05K1/118 , H05K3/321 , H05K3/4635 , H05K2201/10666 , H05K2203/0455
摘要： A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.
摘要翻译： 一种用于将第一柔性印刷电路板（PCB）与第二柔性PCB互连的方法。 该方法包括：在电耦合到第二柔性PCB的接触位置处提供第一柔性PCB; 向所述第二柔性PCB提供与所述接触位置处的所述孔相对应的电垫; 在第一PCB和第二PCB之间施加不导电材料，其中每个电焊盘具有间隙; 将第一PCB与第二PCB对准，使得第一PCB中的孔与第二PCB上的相应电焊盘对齐; 将第一和第二PCB上的一部分平坦区域结合在一起; 将导电粘合剂分配到孔中以填充由孔产生的空间，非导电材料的相应间隙和相应的电焊盘; 并固化导电粘合剂。
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公开(公告)号：US20100255312A1
公开(公告)日：2010-10-07
申请号：US12620001
申请日：2009-11-17
申请人： Thomas K. Dougherty , Christopher T. Snively , Steven E. Lau , William J. Wolfgong , Cindy W. Ma , Stephen L. Schrader
发明人： Thomas K. Dougherty , Christopher T. Snively , Steven E. Lau , William J. Wolfgong , Cindy W. Ma , Stephen L. Schrader
IPC分类号： B32B27/38 , C09D163/00
CPC分类号： H01L23/552 , C08G59/063 , C08G59/226 , C08G59/30 , C08G59/3254 , C09D163/00 , H01L23/573 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/19105 , H01L2924/3025 , Y10T428/31511 , H01L2924/00012 , H01L2924/00
摘要： The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodophenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at least one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.
摘要翻译： 本公开涉及含有包含共价结合到缩水甘油醚的碘化苯酚的环氧树脂的X射线不透明涂层。 共价键合到缩水甘油醚的碘化苯酚可以包括碘化双酚A，例如四碘双酚A，单碘苯酚的缩水甘油醚，双碘苯酚，三碘苯酚或其组合。 涂层可以包括X射线不透明的无机填料。 本公开还涉及一种电子部件，其包括衬底和耦合到衬底的至少一个器件，其中设置在衬底上的混淆层用于使器件从X射线源模糊。 混淆层可以包括X射线不透明涂层。 本公开还涉及通过沉积可包括X射线不透明涂层的混淆层和形成X射线不透明涂层的方法来模糊电子部件的至少一部分的方法。
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