摘要:
A method and apparatus for modeling and cross correlation of design predicted criticalities include a feedback loop where information from the manufacturing process is provided to cross correlation engine for optimization of semiconductor manufacturing. The information may include parametric information, functional information, and hot spots determination. The sharing of information allows for design intent to be reflected in manufacturing metrology space; thus, allowing for more intelligent metrology and reduces cycle time.
摘要:
A method and apparatus for mask optimization is provided. Mask design and production is optimized by providing proper weighting parameters for critical features. The parameters may include information such as parametric information, functional information, and hot spots determination.
摘要:
A method and apparatus for modeling and cross correlation of design predicted criticalities include a feedback loop where information from the manufacturing process is provided to cross correlation engine for optimization of semiconductor manufacturing. The information may include parametric information, functional information, and hot spots determination. The sharing of information allows for design intent to be reflected in manufacturing metrology space; thus, allowing for more intelligent metrology and reduces cycle time.
摘要:
A method and apparatus for process optimization is provided. Process optimization improves parametric and functional yield post mask manufacturing.
摘要:
A method and apparatus for mask optimization is provided. Mask design and production is optimized by providing proper weighting parameters for critical features. The parameters may include information such as parametric information, functional information, and hot spots determination.
摘要:
A method and apparatus for process optimization is provided. Process optimization improves parametric and functional yield post mask manufacturing.
摘要:
A method and apparatus for inspection optimization is provided. Inspection optimization improves the parametric and functional yield using optimized inspection lists for in-line semiconductor manufacturing metrology and inspection equipment.
摘要:
A method and apparatus for inspection optimization is provided. Inspection optimization improves the parametric and functional yield using optimized inspection lists for in-line semiconductor manufacturing metrology and inspection equipment.
摘要:
A method and apparatus for modeling and cross correlation of design predicted criticalities include a feedback loop where information from the manufacturing process is provided to cross correlation engine for optimization of semiconductor manufacturing. The information may include parametric information, functional information, and hot spots determination. The sharing of information allows for design intent to be reflected in manufacturing metrology space; thus, allowing for more intelligent metrology and reduces cycle time.
摘要:
Disclosed are a method, a system, and a computer program product for implementing compact manufacturing model during various stages of electronic circuit designs. In some embodiments, the method or the system receives or identifies physics based data. In some embodiments, the method or the system receives or identifies the physics based data for the corresponding manufacturing process by using the golden manufacturing process model. In some embodiments, the method or the system uses the physics based data to fine tune, modify, or adjust the golden manufacturing process model. In some embodiments, the method or the system invokes the just-right module. In some embodiments, the method or the system implements the compact manufacturing model and the correct-by-design module and provides guidelines for the various stages of the electronic circuit design.