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公开(公告)号：US08247778B2
公开(公告)日：2012-08-21
申请号：US12826808
申请日：2010-06-30
申请人： Kevin Paul McEvoy , James Wilson Rose , Andrea Jeanne Howard , Michael James Palleschi , Jonathan David Short
发明人： Kevin Paul McEvoy , James Wilson Rose , Andrea Jeanne Howard , Michael James Palleschi , Jonathan David Short
CPC分类号： G01T1/2002
摘要： A scintillator array and method for making the same are provided. The array comprises a bi-layer reflector further comprising a conformal smoothing layer and a mirror layer. The bi-layer reflector does not comprise an intervening reducing agent or adhesion layer and/or comprises aluminum. Further, the mirror layer may be deposited via gas phase metallization, allowing application to tightly confined spaces. A detector array comprising the scintillator array is also provided.
摘要翻译： 提供闪烁体阵列及其制造方法。 阵列包括还包括保形平滑层和镜层的双层反射器。 双层反射器不包括中间还原剂或粘合层和/或包括铝。 此外，可以通过气相金属化沉积镜面层，从而允许施加到紧密限制的空间。 还提供了包括闪烁体阵列的检测器阵列。
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公开(公告)号：US20120001078A1
公开(公告)日：2012-01-05
申请号：US12826808
申请日：2010-06-30
申请人： Kevin Paul McEvoy , James Wilson Rose , Andrea Jeanne Howard , Michael James Palleschi , Jonathan David Short
发明人： Kevin Paul McEvoy , James Wilson Rose , Andrea Jeanne Howard , Michael James Palleschi , Jonathan David Short
CPC分类号： G01T1/2002
摘要： A scintillator array and method for making the same are provided. The array comprises a bi-layer reflector further comprising a conformal smoothing layer and a mirror layer. The bi-layer reflector does not comprise an intervening reducing agent or adhesion layer and/or comprises aluminum. Further, the mirror layer may be deposited via gas phase metallization, allowing application to tightly confined spaces. A detector array comprising the scintillator array is also provided.
摘要翻译： 提供闪烁体阵列及其制造方法。 阵列包括还包括保形平滑层和镜层的双层反射器。 双层反射器不包括中间还原剂或粘合层和/或包括铝。 此外，可以通过气相金属化沉积镜面层，从而允许施加到紧密限制的空间。 还提供了包括闪烁体阵列的检测器阵列。
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公开(公告)号：US07450683B2
公开(公告)日：2008-11-11
申请号：US11516852
申请日：2006-09-07
IPC分类号： A61B6/00
CPC分类号： G01T1/2985 , A61B6/032
摘要： A detector assembly is presented. The detector assembly includes a first detector layer having a top side and a bottom side, where the first detector layer includes a plurality of first coupling gaps. Additionally, the detector assembly includes a first interconnect structure operationally coupled to the first detector layer and configured to facilitate transfer of a first set of image data from the first detector layer to backplane electronics. The detector assembly also includes a second detector layer having a top side and a bottom side and disposed adjacent the bottom side of the first detector layer, where the second detector layer includes a plurality of second coupling gaps configured to facilitate passage of the first interconnect structure from the first detector layer to the backplane electronics. Also, the detector assembly includes a second interconnect structure operationally coupled to the second detector layer and configured to facilitate transfer of a second set of image data from the second detector layer to the backplane electronics.
摘要翻译： 提出了一种检测器组件。 检测器组件包括具有顶侧和底侧的第一检测器层，其中第一检测器层包括多个第一耦合间隙。 另外，检测器组件包括第一互连结构，其可操作地耦合到第一检测器层并且被配置为便于将第一组图像数据从第一检测器层传送到背板电子器件。 检测器组件还包括具有顶侧和底侧并且邻近第一检测器层的底侧设置的第二检测器层，其中第二检测器层包括多个第二耦合间隙，其被配置为便于第一互连结构的通过 从第一检测器层到背板电子设备。 此外，检测器组件包括第二互连结构，其可操作地耦合到第二检测器层并且被配置为便于将第二组图像数据从第二检测器层传送到背板电子器件。
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公开(公告)号：US08575558B2
公开(公告)日：2013-11-05
申请号：US12956139
申请日：2010-11-30
IPC分类号： G01T1/24
CPC分类号： H01L31/085 , A61B6/4233 , G01T1/243 , H01L24/48 , H01L24/49 , H01L27/14636 , H01L27/14661 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array. Furthermore, the method includes disposing an interposer having one or more interposer elements and one or more through vias disposed therethrough between the one or more sensor elements of the sensor array and the integrated circuit to raise the sensor array away from the first side of the integrated circuit such that a plane of the one or more sensor elements is locally normal to a sensor stack normal, wherein the interposer is configured to operationally couple the second side of the sensor elements in the sensor array to the first side of the integrated circuit. In addition, the method includes operationally coupling the first plurality of contact pads on the first side of the integrated circuit to a second plurality of contact pads on the second side of the sensor array to form a tileable sensor stack.
摘要翻译： 提出了一种形成传感器堆叠的方法。 该方法包括提供具有第一侧和第二侧的衬底。 此外，该方法包括在衬底的第一侧上设置具有第一侧和第二侧的集成电路，其中集成电路包括设置在集成电路的第一侧上的第一多个接触焊盘。 该方法还包括提供具有多个传感器元件的传感器阵列，其中每个传感器元件具有第一侧和第二侧，并且其中传感器阵列包括设置在传感器的第二侧上的第二多个接触垫 数组。 此外，该方法包括设置具有一个或多个中介层元件和一个或多个通孔的插入件，该通孔设置在传感器阵列的一个或多个传感器元件与集成电路之间，以将传感器阵列远离集成的第一侧 电路，使得所述一个或多个传感器元件的平面在局部垂直于传感器堆叠法线，其中所述插入器被配置为将所述传感器阵列中的所述传感器元件的第二侧可操作地耦合到所述集成电路的第一侧。 此外，该方法包括将集成电路的第一侧上的第一多个接触焊盘操作地耦合到传感器阵列的第二侧上的第二多个接触焊盘，以形成可瓦片传感器堆叠。
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公开(公告)号：US20120133054A1
公开(公告)日：2012-05-31
申请号：US12956139
申请日：2010-11-30
CPC分类号： H01L31/085 , A61B6/4233 , G01T1/243 , H01L24/48 , H01L24/49 , H01L27/14636 , H01L27/14661 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array. Furthermore, the method includes disposing an interposer having one or more interposer elements and one or more through vias disposed therethrough between the one or more sensor elements of the sensor array and the integrated circuit to raise the sensor array away from the first side of the integrated circuit such that a plane of the one or more sensor elements is locally normal to a sensor stack normal, wherein the interposer is configured to operationally couple the second side of the sensor elements in the sensor array to the first side of the integrated circuit. In addition, the method includes operationally coupling the first plurality of contact pads on the first side of the integrated circuit to a second plurality of contact pads on the second side of the sensor array to form a tileable sensor stack.
摘要翻译： 提出了一种形成传感器堆叠的方法。 该方法包括提供具有第一侧和第二侧的衬底。 此外，该方法包括在衬底的第一侧上设置具有第一侧和第二侧的集成电路，其中集成电路包括设置在集成电路的第一侧上的第一多个接触焊盘。 该方法还包括提供具有多个传感器元件的传感器阵列，其中每个传感器元件具有第一侧和第二侧，并且其中传感器阵列包括设置在传感器的第二侧上的第二多个接触垫 数组。 此外，该方法包括设置具有一个或多个中介层元件和一个或多个通孔的插入件，该通孔设置在传感器阵列的一个或多个传感器元件与集成电路之间，以将传感器阵列远离集成的第一侧 电路，使得所述一个或多个传感器元件的平面在局部垂直于传感器堆叠法线，其中所述插入器被配置为将所述传感器阵列中的所述传感器元件的第二侧可操作地耦合到所述集成电路的第一侧。 此外，该方法包括将集成电路的第一侧上的第一多个接触焊盘操作地耦合到传感器阵列的第二侧上的第二多个接触焊盘，以形成可瓦片传感器堆叠。
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6.发明授权Interface assembly for thermally coupling a data acquisition system to a sensor array 有权用于将数据采集系统热耦合到传感器阵列的接口组件公开(公告)号：US07586096B2
公开(公告)日：2009-09-08
申请号：US11560873
申请日：2006-11-17
申请人： Oliver Richard Astley , James Wilson Rose , Joe James Lacey , Jonathan David Short , Ashutosh Joshi
发明人： Oliver Richard Astley , James Wilson Rose , Joe James Lacey , Jonathan David Short , Ashutosh Joshi
IPC分类号： G01T1/24
CPC分类号： G01T1/17 , G01T1/2985
摘要： An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.
摘要翻译： 提供了一种用于传感器阵列的接口组件。 接口组件可以由热耦合到传感器阵列的集成电路封装构成。 接口组件可以包括用于控制传感器阵列的温度的温度控制系统。 温度控制系统包括温度传感器，用于感测传感器阵列的每个传感器的温度变化从初始温度超过预定阈值。 温度控制器耦合到每个温度传感器，并且在传感器温度变化超过预定阈值时从温度传感器接收输出信号。 温度校正装置耦合到每个温度控制器，并且在从温度控制器接收到控制信号时使传感器温度变化落在预定阈值内。
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7.发明申请Interface Assembly For Thermally Coupling A Data Acquisition System To A Sensor Array 有权用于将数据采集系统热耦合到传感器阵列的接口组件公开(公告)号：US20080116387A1
公开(公告)日：2008-05-22
申请号：US11560873
申请日：2006-11-17
申请人： Oliver Richard Astley , James Wilson Rose , Joseph James Lacey , Jonathan David Short , Ashutosh Joshi
发明人： Oliver Richard Astley , James Wilson Rose , Joseph James Lacey , Jonathan David Short , Ashutosh Joshi
IPC分类号： G01T1/24
CPC分类号： G01T1/17 , G01T1/2985
摘要： An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.
摘要翻译： 提供了一种用于传感器阵列的接口组件。 接口组件可以由热耦合到传感器阵列的集成电路封装构成。 接口组件可以包括用于控制传感器阵列的温度的温度控制系统。 温度控制系统包括温度传感器，用于感测传感器阵列的每个传感器的温度变化从初始温度超过预定阈值。 温度控制器耦合到每个温度传感器，并且在传感器温度变化超过预定阈值时从温度传感器接收输出信号。 温度校正装置耦合到每个温度控制器，并且在从温度控制器接收到控制信号时使传感器温度变化落在预定阈值内。
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公开(公告)号：US20080061395A1
公开(公告)日：2008-03-13
申请号：US11516852
申请日：2006-09-07
IPC分类号： H01L31/00
CPC分类号： G01T1/2985 , A61B6/032
摘要： A detector assembly is presented. The detector assembly includes a first detector layer having a top side and a bottom side, where the first detector layer includes a plurality of first coupling gaps. Additionally, the detector assembly includes a first interconnect structure operationally coupled to the first detector layer and configured to facilitate transfer of a first set of image data from the first detector layer to backplane electronics. The detector assembly also includes a second detector layer having a top side and a bottom side and disposed adjacent the bottom side of the first detector layer, where the second detector layer includes a plurality of second coupling gaps configured to facilitate passage of the first interconnect structure from the first detector layer to the backplane electronics. Also, the detector assembly includes a second interconnect structure operationally coupled to the second detector layer and configured to facilitate transfer of a second set of image data from the second detector layer to the backplane electronics.
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公开(公告)号：US07885372B2
公开(公告)日：2011-02-08
申请号：US11952494
申请日：2007-12-07
CPC分类号： G01N23/046 , A61B6/032 , A61B6/4035 , A61B6/4042 , A61B6/4241 , A61B6/482 , G01N2223/419
摘要： An energy-sensitive computed tomography system is provided. The energy-sensitive computed tomography system includes an X-ray source configured to emit an X-ray beam resulting from electrons impinging upon a target material. The energy-sensitive computed tomography system also includes an object positioned within the X-ray beam. The energy-sensitive computed tomography system further includes a detector configured to receive a transmitted beam of the X-rays through the object. The energy-sensitive computed tomography system also includes a filter having an alternating pattern disposed between the X-ray source and the detector, the filter configured to facilitate measuring projection data that can be used to generate low-energy and high-energy spectral information.
摘要翻译： 提供了一种能量敏感的计算机断层摄影系统。 能量敏感的计算机断层摄影系统包括被配置为发射由撞击在目标材料上的电子产生的X射线束的X射线源。 能量敏感的计算机断层摄影系统还包括位于X射线束内的物体。 能量敏感的计算机断层摄影系统还包括检测器，其被配置为接收通过物体的X射线的透射束。 能量敏感的计算机断层摄影系统还包括具有设置在X射线源和检测器之间的交替图案的滤光器，滤光器被配置为便于测量可用于产生低能量和高能量光谱信息的投影数据。
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公开(公告)号：US20090147910A1
公开(公告)日：2009-06-11
申请号：US11952494
申请日：2007-12-07
IPC分类号： G01N23/087
CPC分类号： G01N23/046 , A61B6/032 , A61B6/4035 , A61B6/4042 , A61B6/4241 , A61B6/482 , G01N2223/419
摘要： An energy-sensitive computed tomography system is provided. The energy-sensitive computed tomography system includes an X-ray source configured to emit an X-ray beam resulting from electrons impinging upon a target material. The energy-sensitive computed tomography system also includes an object positioned within the X-ray beam. The energy-sensitive computed tomography system further includes a detector configured to receive a transmitted beam of the X-rays through the object. The energy-sensitive computed tomography system also includes a filter having an alternating pattern disposed between the X-ray source and the detector, the filter configured to facilitate measuring projection data that can be used to generate low-energy and high-energy spectral information.
摘要翻译： 提供了一种能量敏感的计算机断层摄影系统。 能量敏感的计算机断层摄影系统包括被配置为发射由撞击在目标材料上的电子产生的X射线束的X射线源。 能量敏感的计算机断层摄影系统还包括位于X射线束内的物体。 能量敏感的计算机断层摄影系统还包括检测器，其被配置为接收通过物体的X射线的透射束。 能量敏感的计算机断层摄影系统还包括具有设置在X射线源和检测器之间的交替图案的滤光器，滤光器被配置为便于测量可用于产生低能量和高能量光谱信息的投影数据。
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