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11 条记录 (耗时 0.037 秒)

    Method and apparatus for mounting a fluid ejection module
    7.
    发明授权
    Method and apparatus for mounting a fluid ejection module 有权
    用于安装流体喷射模块的方法和装置

    公开(公告)号：US08523323B2

    公开(公告)日：2013-09-03

    申请号：US12991758

    申请日：2009-05-06

    申请人： Kevin Von Essen ,  Stephen R. Deming ,  John A. Higginson ,  Nobuo Matsumoto ,  Andreas Bibl

    发明人： Kevin Von Essen ,  Stephen R. Deming ,  John A. Higginson ,  Nobuo Matsumoto ,  Andreas Bibl

    IPC分类号： B41J2/14 ,  B41J2/16

    CPC分类号： B41J2/14 ,  B41J2/175 ,  B41J29/393 ,  B41J2002/14362

    摘要： A system and method for mounting a fluid droplet ejection module to a frame is disclosed, where the fluid ejection module includes a mounting component having a mounting surface. A connector is configured to detachably attach to the frame and is positioned between the frame and the mounting surface of the fluid ejection module. A portion of a mating surface of the connector is positioned adjacent the mounting surface of a corresponding fluid ejection module and is in direct contact with the mounting surface. One or more recesses are formed in at least one of either the mounting surface of the fluid ejection module or the mating surface of the connector. The one or more recesses have a substantially uniform thickness and are filled with an adhesive. The adhesive is cured after aligning the fluid ejection module to the frame.

    摘要翻译： 公开了一种用于将流体液滴喷射模块安装到框架的系统和方法，其中流体喷射模块包括具有安装表面的安装部件。 连接器被构造成可拆卸地附接到框架并且被定位在框架和流体喷射模块的安装表面之间。 连接器的配合表面的一部分邻近相应的流体喷射模块的安装表面定位并且与安装表面直接接触。 一个或多个凹部形成在流体喷射模块的安装表面或连接器的配合表面中的至少一个中。 一个或多个凹部具有基本均匀的厚度并且填充有粘合剂。 粘合剂在将流体喷射模块对准框架后固化。

    METHOD AND APPARATUS FOR MOUNTING A FLUID EJECTION MODULE
    8.
    发明申请
    METHOD AND APPARATUS FOR MOUNTING A FLUID EJECTION MODULE 有权
    用于安装流体喷射模块的方法和装置

    公开(公告)号：US20110128324A1

    公开(公告)日：2011-06-02

    申请号：US12991758

    申请日：2009-05-06

    申请人： Kevin von Essen ,  Stephen R. Deming ,  John A. Higginson ,  Nobuo Matsumoto ,  Andreas Bibl

    发明人： Kevin von Essen ,  Stephen R. Deming ,  John A. Higginson ,  Nobuo Matsumoto ,  Andreas Bibl

    IPC分类号： B41J2/16

    CPC分类号： B41J2/14 ,  B41J2/175 ,  B41J29/393 ,  B41J2002/14362

    摘要： A system and method for mounting a fluid droplet ejection module to a frame is disclosed, where the fluid ejection module includes a mounting component having a mounting surface. A connector is configured to detachably attach to the frame and is positioned between the frame and the mounting surface of the fluid ejection module. A portion of a mating surface of the connector is positioned adjacent the mounting surface of a corresponding fluid ejection module and is in direct contact with the mounting surface. One or more recesses are formed in at least one of either the mounting surface of the fluid ejection module or the mating surface of the connector. The one or more recesses have a substantially uniform thickness and are filled with an adhesive. The adhesive is cured after aligning the fluid ejection module to the frame.

    摘要翻译： 公开了一种用于将流体液滴喷射模块安装到框架的系统和方法，其中流体喷射模块包括具有安装表面的安装部件。 连接器被构造成可拆卸地附接到框架并且被定位在框架和流体喷射模块的安装表面之间。 连接器的配合表面的一部分邻近相应的流体喷射模块的安装表面定位并且与安装表面直接接触。 一个或多个凹部形成在流体喷射模块的安装表面或连接器的配合表面中的至少一个中。 一个或多个凹部具有基本均匀的厚度并且填充有粘合剂。 粘合剂在将流体喷射模块对准框架后固化。

    FLEXIBLE CIRCUIT STRETCHING
    9.
    发明申请
    FLEXIBLE CIRCUIT STRETCHING 审中-公开
    柔性电路拉伸

    公开(公告)号：US20110122587A1

    公开(公告)日：2011-05-26

    申请号：US12991890

    申请日：2009-04-30

    申请人： Stephen R. Deming ,  Kevin von Essen ,  Andreas Bibl ,  John A. Higginson ,  Micheal Rocchio

    发明人： Stephen R. Deming ,  Kevin von Essen ,  Andreas Bibl ,  John A. Higginson ,  Micheal Rocchio

    IPC分类号： H05K1/18 ,  H01L21/58 ,  H05K3/00

    CPC分类号： H05K1/118 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/10674 ,  H05K2203/0271 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/5313

    摘要： A method of connecting electrical components and an electronic device formed using this method are disclosed. This method includes stretching a first substrate with a plurality of conductive traces to form a stretched substrate where at least one increased pitch (a spacing between two conductive traces plus a width of one conductive trace) is not greater than 40 microns; and electrically connecting the conductive traces on the first substrate to conductive traces on a second substrate. A device by which this method can be implemented is also disclosed, which includes a base, and platforms and stretchers mounted to the base that are configured to pull opposite ends of the first substrate to align the conductive traces thereon with the conductive traces on the second substrate.

    摘要翻译： 公开了一种连接电气部件的方法和使用该方法形成的电子设备。 该方法包括用多个导电迹线拉伸第一衬底以形成延伸的衬底，其中至少一个增加的间距（两个导电迹线之间的间隔加上一个导电迹线的宽度）不大于40微米; 以及将第一衬底上的导电迹线电连接到第二衬底上的导电迹线。 还公开了一种可以实现该方法的装置，其包括安装到基座的基座和平台和拉伸器，其被配置为拉动第一基板的相对端部，以使其上的导电迹线与第二基板上的导电迹线对准 基质。