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    Lathe head for nano/micro machining of materials
    2.
    发明授权
    Lathe head for nano/micro machining of materials 有权
    车床用于纳米/微加工材料

    公开(公告)号：US09370824B2

    公开(公告)日：2016-06-21

    申请号：US13842899

    申请日：2013-03-15

    申请人： Patrick J Deshaye

    发明人： Patrick J Deshaye

    IPC分类号： B23K26/08 ,  B23K26/36 ,  B23B5/00 ,  B81C99/00 ,  B23K26/00 ,  H01J37/305

    CPC分类号： H01J37/3056 ,  B23B5/00 ,  B23K26/08 ,  B23K26/0823 ,  B23K26/352 ,  B23K26/3568 ,  B23K26/3576 ,  B23K26/36 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K2103/50 ,  B81C99/001 ,  H01J2237/2007 ,  H01J2237/20214 ,  H01J2237/31749 ,  Y10T82/10 ,  Y10T82/2552

    摘要： Apparatus, methods and systems for nano/micro machining. A lathe head has a microscopic pivot aperture for seating a conical tip. The conical tip is carried on a turnable part at one end thereof and is polished down to a microscopic apex. The microscopic pivot aperture is dimensioned for seating the concentric tip in the pivot aperture such that an apex of the conical tip protrudes through and beyond the aperture to a position in close proximity with the aperture. A driver system can comprise a rotator for axially rotating the turnable part, including the conical tip seated in the pivot aperture, and a forward pressure applicator for concurrently applying forward pressure to the conical tip in the direction of the pivot aperture. A light/particle beam system can be utilized to machine the rotating conical tip and the rotating turnable part, including the tip, can be easily removed after machining.

    摘要翻译： 用于纳米/微加工的装置，方法和系统。 车床头具有用于安置锥形尖端的微观枢轴孔。 锥形尖端在其一端承载在可转动部分上，并被抛光到微观顶点。 微小枢轴孔的尺寸被设计成用于将同心尖端放置在枢转孔中，使得锥形尖端的顶点突出并穿过孔到达与孔近距离的位置。 驱动器系统可以包括用于轴向旋转可转动部件的旋转器，包括安装在枢转孔中的锥形末端，以及向前压力施加器，用于同时向枢转孔的方向向锥形尖端施加向前的压力。 可以使用光/粒子束系统来加工旋转的锥形尖端，并且包括尖端的旋转可转动部件可以在加工后容易地移除。

    ELECTROSTATIC CHUCK TABLE USING METHOD
    5.
    发明申请
    ELECTROSTATIC CHUCK TABLE USING METHOD 审中-公开

    公开(公告)号：US20180247853A1

    公开(公告)日：2018-08-30

    申请号：US15905126

    申请日：2018-02-26

    申请人： DISCO CORPORATION

    发明人： Kenji Furuta ,  Yuriko Sato ,  Sakae Matsuzaki

    IPC分类号： H01L21/683 ,  B81C99/00 ,  B23K26/53

    CPC分类号： H01L21/6833 ,  B23K26/009 ,  B23K26/037 ,  B23K26/53 ,  B23K2103/56 ,  B81C99/001

    摘要： An electrostatic chuck table includes a plate-shaped base portion capable of transmitting a laser beam to be applied to a workpiece and an electrostatic attraction electrode portion capable of transmitting the laser beam. The laser beam has a transmission wavelength to the workpiece. The base portion has a first surface and a second surface opposite to the first surface. The electrode portion is formed on the first surface of the base portion. A method for using the electrostatic chuck table includes a workpiece holding step of applying a voltage to the electrode portion formed on the first surface to thereby electrostatically hold the workpiece on the second surface, and a modified layer forming step of applying the laser beam through the first surface to a predetermined position inside the workpiece held on the second surface to thereby form a modified layer inside the workpiece.

    SYSTEMS AND METHODS FOR CONTROLLING WAFER-BREAKER DEVICES
    7.
    发明申请
    SYSTEMS AND METHODS FOR CONTROLLING WAFER-BREAKER DEVICES 有权
    用于控制断路器装置的系统和方法

    公开(公告)号：US20150346712A1

    公开(公告)日：2015-12-03

    申请号：US14291397

    申请日：2014-05-30

    申请人： SKYWORKS SOLUTIONS, INC.

    发明人： Cesar D. LARA

    IPC分类号： G05B19/418 ,  H01L21/67

    CPC分类号： H01L21/67092 ,  B23K2101/40 ,  B81C1/00888 ,  B81C99/001 ,  B81C99/004 ,  G05B2219/45031 ,  H01L21/304 ,  H01L21/67253 ,  H01L22/34 ,  H01L2924/1461 ,  Y10T225/30

    摘要： Systems and methods for controlling wafer-breaker devices. In some embodiments, a controller for a semiconductor wafer singulation apparatus can be configured to receive an input signal having information about at least one singulation parameter. The controller can be further configured to generate an output signal based on the input signal to effectuate an operation associated with the singulation parameter. The controller can be further configured to disable manual control of the singulation parameter. In some embodiments, such a controller can be implemented, for example, in a control module, in a kit for modifying an existing singulation apparatus, as an integral part of a singulation apparatus, or any combination thereof.

    摘要翻译： 用于控制晶片断路器装置的系统和方法。 在一些实施例中，用于半导体晶片单片化装置的控制器可被配置为接收具有关于至少一个单独参数的信息的输入信号。 控制器还可以被配置为基于输入信号产生输出信号，以实现与分割参数相关联的操作。 控制器还可以被配置为禁止手动控制单个参数。 在一些实施例中，这样的控制器可以例如在控制模块中，在用于修改现有的分离设备的套件中，作为分割设备的组成部分或其任何组合来实现。

    Bonded Wafer Assembly System and Method
    8.
    发明申请
    Bonded Wafer Assembly System and Method 有权
    粘合晶片装配系统和方法

    公开(公告)号：US20100075482A1

    公开(公告)日：2010-03-25

    申请号：US12238038

    申请日：2008-09-25

    申请人： Daryl Ross Koehl ,  Braden Peter D'Andrea

    发明人： Daryl Ross Koehl ,  Braden Peter D'Andrea

    IPC分类号： H01L21/302 ,  B26F3/00 ,  B26D9/00

    CPC分类号： B26F3/002 ,  B81C1/00484 ,  B81C1/00888 ,  B81C99/001 ,  B81C99/004 ,  B81C2203/051 ,  Y10T83/0341 ,  Y10T225/307 ,  Y10T225/321 ,  Y10T225/325 ,  Y10T225/329

    摘要： A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.

    摘要翻译： 一种用于在接合晶片组件中去除多余材料的系统和方法。 该方法包括切割顶部晶片中的多个平行切口，多个切口限定经由突片附接到顶部晶片的另一部分的顶部晶片的段，将楔形断路器条插入到至少一个切口中 所述多个切口对所述断路器杆施加力以使所述突片断裂，以及从所述接合的晶片组件移除所述顶部晶片的所述段，其中在所述移除之后，底部晶片保持未起伏。

    Systems and methods for controlling wafer-breaker devices
    9.
    发明授权
    Systems and methods for controlling wafer-breaker devices 有权
    用于控制晶片断路器装置的系统和方法

    公开(公告)号：US09576826B2

    公开(公告)日：2017-02-21

    申请号：US14291397

    申请日：2014-05-30

    申请人： SKYWORKS SOLUTIONS, INC.

    发明人： Cesar D. Lara

    IPC分类号： H01L21/67 ,  H01L21/304 ,  H01L21/66 ,  B81C1/00 ,  B81C99/00

    CPC分类号： H01L21/67092 ,  B23K2101/40 ,  B81C1/00888 ,  B81C99/001 ,  B81C99/004 ,  G05B2219/45031 ,  H01L21/304 ,  H01L21/67253 ,  H01L22/34 ,  H01L2924/1461 ,  Y10T225/30

    摘要： Systems and methods for controlling wafer-breaker devices. In some embodiments, a controller for a semiconductor wafer singulation apparatus can be configured to receive an input signal having information about at least one singulation parameter. The controller can be further configured to generate an output signal based on the input signal to effectuate an operation associated with the singulation parameter. The controller can be further configured to disable manual control of the singulation parameter. In some embodiments, such a controller can be implemented, for example, in a control module, in a kit for modifying an existing singulation apparatus, as an integral part of a singulation apparatus, or any combination thereof.

    摘要翻译： 用于控制晶片断路器装置的系统和方法。 在一些实施例中，用于半导体晶片单片化装置的控制器可被配置为接收具有关于至少一个单独参数的信息的输入信号。 控制器还可以被配置为基于输入信号产生输出信号，以实现与分割参数相关联的操作。 控制器还可以被配置为禁止手动控制单个参数。 在一些实施例中，这样的控制器可以例如在控制模块中，在用于修改现有的分离设备的套件中，作为分割设备的整体部分或其任何组合来实现。