METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
    1.
    发明申请
    METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE 失效
    制造半导体器件的方法

    公开(公告)号:US20090162795A1

    公开(公告)日:2009-06-25

    申请号:US12266459

    申请日:2008-11-06

    IPC分类号: G03F7/20

    CPC分类号: H01L21/308 H01L21/0337

    摘要: A method for manufacturing a semiconductor device includes forming an etch-target layer over a semiconductor substrate having a lower structure, forming a first mask pattern over the etch-target layer, forming a spacer material layer with a uniform thickness over the etch-target layer including the first mask pattern, forming a second mask pattern on an indented region of the space material layer, and etching the etch-target layer with the first mask pattern and the second mask pattern as an etch mask to form a fine pattern.

    摘要翻译: 一种用于制造半导体器件的方法包括在具有较低结构的半导体衬底上形成蚀刻目标层,在蚀刻靶层上形成第一掩模图案,在蚀刻靶层上形成均匀厚度的间隔物材料层 包括第一掩模图案,在空间材料层的凹入区域上形成第二掩模图案,并且用第一掩模图案和第二掩模图案蚀刻蚀刻目标层作为蚀刻掩模以形成精细图案。

    METHOD FOR FORMING PATTERN OF SEMICONDUCTOR DEVICE
    2.
    发明申请
    METHOD FOR FORMING PATTERN OF SEMICONDUCTOR DEVICE 审中-公开
    形成半导体器件图案的方法

    公开(公告)号:US20090075485A1

    公开(公告)日:2009-03-19

    申请号:US12163864

    申请日:2008-06-27

    IPC分类号: H01L21/308

    摘要: A method for forming a fine pattern of a semiconductor device comprises: forming a first hard mask film and an etch barrier film over a semiconductor substrate; forming a sacrificial pattern over the etch barrier film; forming a spacer on sidewalls of the sacrificial pattern; removing the sacrificial pattern; etching the etch barrier film and the hard mask film with the spacer as an etch mask to form an etch barrier pattern and a hard mask pattern; and removing the spacer and the etch barrier pattern, thereby improving yield and reliability of the device.

    摘要翻译: 用于形成半导体器件的精细图案的方法包括:在半导体衬底上形成第一硬掩模膜和蚀刻阻挡膜; 在蚀刻阻挡膜上形成牺牲图案; 在所述牺牲图案的侧壁上形成间隔物; 去除牺牲图案; 用间隔物作为蚀刻掩模蚀刻蚀刻阻挡膜和硬掩模膜以形成蚀刻阻挡图案和硬掩模图案; 并去除间隔物和蚀刻阻挡图案,从而提高装置的产量和可靠性。

    METHOD FOR FORMING A PATTERN OF A SEMICONDUCTOR DEVICE
    3.
    发明申请
    METHOD FOR FORMING A PATTERN OF A SEMICONDUCTOR DEVICE 有权
    形成半导体器件图案的方法

    公开(公告)号:US20090087959A1

    公开(公告)日:2009-04-02

    申请号:US12165388

    申请日:2008-06-30

    申请人: Keun Do BAN

    发明人: Keun Do BAN

    IPC分类号: H01L21/302

    摘要: In a method for forming a fine pattern of a semiconductor device, forming a spacer for double patterning of a cell region is performed separate from forming a mask pattern that defines a dummy pattern for a pad of a peripheral circuit region.

    摘要翻译: 在形成半导体器件的精细图案的方法中,形成用于单元区域的双重图案化的间隔物与形成限定用于外围电路区域的焊盘的虚拟图案的掩模图案分离地执行。