摘要:
A method of brazing brass parts without oxidation of zinc, which is contained in the parts, during brazing of the parts with phosphorous bronze solder at relatively low temperature of 630-700° C., the brazing being made by making the wall of brazing furnace or muffle of carbon material, like graphite etc., making an inert nitrogen gas or mixture of nitrogen and hydrogen in the furnace atmosphere contact with the carbon material above, producing CO less the P co=10−3 atm. in the furnace, and making the furnace atmosphere reductive against zinc in the brass parts and/or flux in the solder.
摘要翻译:在较低温度为630-700℃的铜青铜焊料的钎焊过程中,不含氧化锌的黄铜零件钎焊的方法,钎焊是通过制作钎焊炉壁 或诸如石墨等的碳材料的马弗,使得惰性氮气或氮气和氢气在炉气氛中的混合物与上述碳材料接触,产生较少的P co = 10 -3 atm。 在炉中,并使炉气氛对锌中的黄铜部分和/或焊料中的焊剂进行还原。
摘要:
The method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into an agitated mixture of the molding material and the solid powder.
摘要:
The exemplary embodiment provides a method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder. The method includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into the agitated mixture of the molding material and the solid powder while vibrating at least one of the component and the molding die.
摘要:
An ultrasonic cleaning device (50) comprises: an ultrasonic oscillation plate (2) having a plurality of ultrasonic oscillators (1); an ultrasonic wave guide chamber (3) for collecting an ultrasonic wave force generated by the ultrasonic oscillation plate; and a cleaning tank (4) in which a cleaning solution (20) is stored, wherein an object (5) to be cleaned is cleaned when it is dipped in the cleaning tank. Since an upper portion of the ultrasonic wave guide chamber is airtightly closed with the upper face (31) and formed into a bowl shape, an air layer (10) is formed between a liquid level of the cleaning solution in the ultrasonic wave guide chamber and the upper face (31). The cleaning tank is joined to the ultrasonic wave guide chamber, and an ultrasonic oscillation plate is arranged so that it can be opposed to the ultrasonic wave guide chamber.
摘要:
The method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into an agitated mixture of the molding material and the solid powder.
摘要:
An ultrasonic cleaning device (50) comprises: an ultrasonic oscillation plate (2) having a plurality of ultrasonic oscillators (1); an ultrasonic wave guide chamber (3) for collecting an ultrasonic wave force generated by the ultrasonic oscillation plate; and a cleaning tank (4) in which a cleaning solution (20) is stored, wherein an object (5) to be cleaned is cleaned when it is dipped in the cleaning tank. Since an upper portion of the ultrasonic wave guide chamber is airtightly closed with the upper face (31) and formed into a bowl shape, an air layer (10) is formed between a liquid level of the cleaning solution in the ultrasonic wave guide chamber and the upper face (31). The cleaning tank is joined to the ultrasonic wave guide chamber, and an ultrasonic oscillation plate is arranged so that it can be opposed to the ultrasonic wave guide chamber.