公开(公告)号：US20070298534A1

公开(公告)日：2007-12-27

申请号：US11838937

申请日：2007-08-15

申请人： Kimiya IKUSHIMA ,  Hiroyoshi KOMOBUCHI ,  Asako BABA ,  Mikiya UCHIDA

发明人： Kimiya IKUSHIMA ,  Hiroyoshi KOMOBUCHI ,  Asako BABA ,  Mikiya UCHIDA

IPC分类号： H01L21/00

CPC分类号： H01L37/00 ,  G01J5/045 ,  H01L37/02

摘要： In the present invention, an etching hole 21 is formed in a polysilicon film 14 as a cavity-wall member. Through the etching hole 21, hydrofluoric acid is injected, so as to dissolve a silicon oxide film 13, thereby forming a cavity 22. In the cavity 22, a detecting unit 12 of a sensor is in an exposed condition. Next, by sputtering, an Al film 16 is deposited in the etching hole 21 and on an upper face of a substrate. Thereafter, a portion of the Al film 16 positioned on the polysilicon film 14 is removed by etching back, thereby leaving only a metal closure 16a of Al which closes the etching hole. The sputtering step is performed under a pressure of 5 Pa or less, so that the pressure in the cavity can be held to be low.

摘要翻译： 在本发明中，在作为空腔壁构件的多晶硅膜14中形成蚀刻孔21。 通过蚀刻孔21注入氢氟酸，以溶解氧化硅膜13，从而形成空腔22。 在空腔22中，传感器的检测单元12处于暴露状态。 接下来，通过溅射，在蚀刻孔21中和基板的上表面上沉积Al膜16。 此后，通过蚀刻去除位于多晶硅膜14上的Al膜16的一部分，从而仅留下关闭蚀刻孔的Al的金属封闭体16a。 在5Pa以下的压力下进行溅射工序，能够将空腔内的压力保持为低。

公开(公告)号：US20080179525A1

公开(公告)日：2008-07-31

申请号：US11872934

申请日：2007-10-16

申请人： Kimiya IKUSHIMA ,  Asako Baba

发明人： Kimiya IKUSHIMA ,  Asako Baba

IPC分类号： G01J5/00 ,  H01S4/00

CPC分类号： G01J5/10 ,  G01J5/02 ,  G01J5/024 ,  G01J5/0245 ,  G01J5/20 ,  G01J5/34 ,  H01L27/14669 ,  H01L31/02016 ,  H01L31/09 ,  Y10T29/49002

摘要： An electronic device according to the present invention includes: at least one heat sensing section (13), which includes a first contact portion (24) and of which a physical property varies responsive to an incoming infrared ray; a detector circuit section, which includes a second contact portion (42) and which senses the variation in the physical property of the heat sensing section (13); and a driving section (112), which is able to change a first state, in which the first and second contact portions (24, 42) are in contact with each other and electrically connected to each other, into a second state, in which the first and second contact portions (24, 42) are out of contact with each other and electrically disconnected from each other, and vice versa.

摘要翻译： 根据本发明的电子设备包括：至少一个热感测部分（13），其包括第一接触部分（24），其物理特性响应于入射的红外线而变化; 检测器电路部分，其包括第二接触部分（42）并且感测热传感部分（13）的物理性质的变化; 以及能够改变第一和第二接触部分（24,42）彼此接触并彼此电连接的第一状态的驱动部分（112），其中第二状态 第一和第二接触部分（24,42）彼此不接触并且彼此电断开，反之亦然。