公开(公告)号：US07404613B2

公开(公告)日：2008-07-29

申请号：US11169905

申请日：2005-06-29

申请人： Kin Ming Kwan ,  James Michael Mrvos ,  Jeanne Marie Saldanha Singh ,  Mary Claire Smoot

发明人： Kin Ming Kwan ,  James Michael Mrvos ,  Jeanne Marie Saldanha Singh ,  Mary Claire Smoot

IPC分类号： B41J2/015 ,  B41J2/175

CPC分类号： B41J2/17559

摘要： A method for manufacturing an inkjet print cartridge and an inkjet cartridge produced thereby are disclosed. An inkjet print cartridge in accordance with one aspect includes a component of the inkjet print cartridge and an applied adhesive on at least a portion of the component, wherein the applied adhesive is formed from an adhesive having a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1. The method in accordance with one aspect includes applying an adhesive onto at least a portion of a component of an inkjet print cartridge at an application temperature, Tα, and heating the adhesive from an initial temperature, Ti, to a cure temperature for the adhesive, Tc. The adhesive has a rheology cure profile characterized by at least one of the following parameters: a) a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1, b) a temperature of the adhesive is approximately equal to a minimum viscosity temperature for the adhesive, Tηmin, within less than about 10 minutes from the start of the cure cycle, and c) viscosity of the adhesive increases within less than about 5 minutes from the start of the cure cycle.

摘要翻译： 公开了一种用于制造由此制造的喷墨打印墨盒和喷墨墨盒的方法。 根据一个方面的喷墨打印墨盒包括喷墨打印墨盒的组件和在组件的至少一部分上的涂布的粘合剂，其中涂布的粘合剂由具有流变粘度比η的粘合剂形成， /小于/小于2.1。 根据一个方面的方法包括在施加温度Tαα下将粘合剂施加到喷墨打印盒的部件的至少一部分上，并从初始温度T 1加热粘合剂， 将粘合剂的固化温度提高到粘合剂的固化温度。 粘合剂具有流变学固化分布，其特征在于以下参数中的至少一个：a）1.0至小于2.1的流变粘度比ηη/ηmin / b）粘合剂的温度近似等于粘合剂T et et在从固化循环开始后不到约10分钟内的最低粘度温度，c）粘合剂的粘度 在治愈周期开始后不到5分钟内就会增加。

公开(公告)号：US07600850B2

公开(公告)日：2009-10-13

申请号：US11365193

申请日：2006-03-01

申请人： Jonathan Michael Blackburn ,  Edgar Colin Diaz ,  Thomas Ray Romine, Jr. ,  Jeanne Marie Saldanha Singh ,  Mary Claire Smoot ,  Jason Joseph Stokesbary

发明人： Jonathan Michael Blackburn ,  Edgar Colin Diaz ,  Thomas Ray Romine, Jr. ,  Jeanne Marie Saldanha Singh ,  Mary Claire Smoot ,  Jason Joseph Stokesbary

IPC分类号： B41J2/015

CPC分类号： B41J2/1753

摘要： Fluid ejection head assemblies, fluid ejection devices, and methods for improving fluid sealing of fluid ejection head assemblies. One such fluid ejection head assembly includes a substrate cavity and a substantially planar surface surrounding the substrate cavity. The substantially planar surface contains at least one external vent, at least one internal vent channel, and a plurality of vents in fluid flow communication with the substrate cavity and providing fluid flow communication between the internal vent channel and the external vent. The plurality of vents, the at least one external vent and the at least one internal vent channel are disposed in fluid flow communication with an environment external to the substrate cavity for flow of a gas associated with an adhesive at least partially disposed in the substrate cavity, to the environment during the curing of the adhesive.

摘要翻译： 流体喷射头组件，流体喷射装置和用于改善流体喷射头组件的流体密封的方法。 一个这样的流体喷射头组件包括衬底空腔和围绕衬底空腔的基本平坦的表面。 基本平坦的表面包含至少一个外部通气口，至少一个内部通气通道和与衬底空腔流体连通的多个通气口，并且在内部通气通道和外部通风口之间提供流体流动连通。 多个通气口，至少一个外部通气口和至少一个内部通气通道设置成与衬底空腔外部的环境流体流动连通，用于与至少部分地设置在衬底空腔中的粘合剂相关联的气体流动 ，在粘合剂固化期间的环境。

公开(公告)号：US20070232055A1

公开(公告)日：2007-10-04

申请号：US11423720

申请日：2006-06-13

申请人： Richard Earl Corley ,  Shelby Wayne Dennis ,  Edgar Colin Diaz ,  Richard Leo Hubert ,  Jonathan Harold Laurer ,  Tu Phan ,  George Allan Ping ,  Jeanne Marie Saldanha Singh ,  Mary Claire Smoot ,  Paul Timothy Spivey

发明人： Richard Earl Corley ,  Shelby Wayne Dennis ,  Edgar Colin Diaz ,  Richard Leo Hubert ,  Jonathan Harold Laurer ,  Tu Phan ,  George Allan Ping ,  Jeanne Marie Saldanha Singh ,  Mary Claire Smoot ,  Paul Timothy Spivey

IPC分类号： H01L21/4763

CPC分类号： H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and apparatuses for applying a protective material to an interconnect associated with a component. One such method involves placing a stencil in close proximity to an interconnect that extends over a cavity. An amount of protective material is placed on the stencil. A wiper is passed across the stencil. The wiper has an angle of attack of less than 50 degrees. At least a desired thickness of protective material is applied to the interconnect.

摘要翻译： 将保护材料施加到与部件相关联的互连的方法和装置。 一种这样的方法包括将模板放置在靠近空腔上延伸的互连件附近。 将一定量的保护材料放在模板上。 刮水器穿过模板。 刮水器的冲击角小于50度。 至少所需的保护材料厚度被施加到互连。

公开(公告)号：US07766455B2

公开(公告)日：2010-08-03

申请号：US11556246

申请日：2006-11-03

申请人： David Christopher Graham ,  Brian Christopher Hart ,  Gary Anthony Holt, Jr. ,  John William Krawczyk ,  Sean Terrence Weaver ,  Mary Claire Smoot

发明人： David Christopher Graham ,  Brian Christopher Hart ,  Gary Anthony Holt, Jr. ,  John William Krawczyk ,  Sean Terrence Weaver ,  Mary Claire Smoot

IPC分类号： B41J2/14 ,  B41J2/16

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/14072 ,  B41J2/1601

摘要： Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.

摘要翻译： 提供微流体喷射头结构，制造具有改进的可操作性的微流体喷射头结构的方法，以及用于提高微流体喷射头结构的耐久性的方法。 一种这样的微流体喷射头结构包括具有基板的微流体喷射头和使用基底粘合剂与基底支撑件附近粘附地附接的喷嘴板组件。 喷嘴板用喷嘴板粘合剂粘附在基板附近。 热，UV或其它固化机构的密封剂材料邻近喷射头和基底支撑附着。 每个基底粘合剂和密封剂材料在固化后具有小于约2000MPa的杨氏模量，25℃下的剪切模量小于约15MPa，玻璃化转变温度低于约90MPa C。