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公开(公告)号：US06409312B1
公开(公告)日：2002-06-25
申请号：US09818736
申请日：2001-03-27
IPC分类号： B41J204
CPC分类号： B41J2/1628 , B41J2/1433 , B41J2/162 , B41J2/1623 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645
摘要： The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a semiconductor substrate containing ink ejection devices and a dry-etched ink via therein. A first photo-imaged polymer layer is applied to the semiconductor substrate, the first photo-imaged polymer layer being patterned and developed to contain ink flow chambers and ink flow channels corresponding to the ink ejection devices on the semiconductor substrate. A second photo-imaged polymer layer is applied to the first photo-imaged polymer layer. The second photo-imaged polymer layer is patterned and developed to contain nozzle holes corresponding to the ink chambers in the first photo-imaged polymer layer and corresponding to the ink ejection devices on the semiconductor substrate. The invention provides increased printhead manufacturing accuracy and elimination of alignment and adhesive attachment of a separate nozzle plate to an ink jet heater chip.
摘要翻译： 本发明提供了一种用于喷墨打印机的打印头和一种用于制造用于喷墨打印机的打印头的方法。 打印头包括含有喷墨装置的半导体基板和其中经过干蚀刻的墨水通道。 将第一光成像聚合物层施加到半导体衬底上，第一光成像聚合物层被图案化和显影以包含对应于半导体衬底上的喷墨装置的墨流动室和墨流动通道。 将第二光成像聚合物层施加到第一光成像聚合物层。 第二光成像聚合物层被图案化和显影以包含对应于第一光成像聚合物层中的墨室的喷嘴孔，并对应于半导体衬底上的喷墨装置。 本发明提供了增加的打印头制造精度并消除了单独的喷嘴板对喷墨加热器芯片的对准和粘合附着。
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2.发明授权Tape automated bonding circuit for use with an ink jet cartridge assembly in an ink jet printer 有权用于喷墨打印机中的喷墨墨盒组件的胶带自动粘合电路公开(公告)号：US06402299B1
公开(公告)日：2002-06-11
申请号：US09425094
申请日：1999-10-22
IPC分类号： B41J214
CPC分类号： B41J2/14072 , B41J2/14016 , B41J2/14024
摘要： An ink jet cartridge assembly for use in an ink jet printer has a body with at least one inner ink chamber. A printhead is carried by the body and has a plurality of ink jetting orifices in fluid communication with the ink chamber. A tape automated bonding circuit carried by the body includes a flexible tape and a plurality of electrical traces. The flexible tape includes a chip window with a peripheral edge. The printhead is disposed within the chip window at a distance from the peripheral edge. Each electrical trace has a bottom side adjacent the body, a substrate held portion carried by the flexible tape, a free trace portion extending between the peripheral edge of the chip window and the printhead, and a printhead held portion connected with the printhead. The tape automated bonding circuit further includes a photoimagable coating which covers the bottom side of each electrical trace on all of the substrate held portion and the free trace portion, but does not cover the printhead held portion.
摘要翻译： 用于喷墨打印机的喷墨墨盒组件具有至少一个内部墨水室的主体。 打印头由主体承载并且具有与墨水室流体连通的多个喷墨孔。 由本体承载的胶带自动接合电路包括柔性带和多个电迹线。 柔性带包括具有外围边缘的芯片窗口。 打印头设置在芯片窗口内与外围边缘一段距离处。 每个电迹线具有邻近主体的底侧，由柔性带承载的基底保持部分，在芯片窗口的周边边缘和打印头之间延伸的自由迹线部分和与打印头连接的打印头保持部分。 带式自动接合电路还包括可光成像的涂层，其覆盖所有基板保持部分和自由迹线部分上的每个电迹线的底侧，但不覆盖打印头保持部分。
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公开(公告)号：US06387719B1
公开(公告)日：2002-05-14
申请号：US09795731
申请日：2001-02-28
IPC分类号： H01L2100
CPC分类号： B41J2/1645 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , H01L21/312
摘要： The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.
摘要翻译： 本发明提供了一种改善聚合物平面化膜和半导体芯片表面之间粘附性的方法。 该方法包括沉积电阻，导电和/或绝缘材料到电感器芯片表面以提供用于喷墨打印机的半导体芯片。 芯片表面在氧气氛下用干法蚀刻工艺处理一段时间并且在足以激活芯片表面的条件下进行处理。 将聚合物平面化膜施加到半导体芯片的活化表面。 作为干法蚀刻工艺的结果，在不进行芯片表面的干法蚀刻处理的情况下，平坦化膜的粘合性比平坦化膜与半导体表面之间的粘附性增加。
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4.发明授权公开(公告)号：US07404613B2
公开(公告)日：2008-07-29
申请号：US11169905
申请日：2005-06-29
CPC分类号： B41J2/17559
摘要： A method for manufacturing an inkjet print cartridge and an inkjet cartridge produced thereby are disclosed. An inkjet print cartridge in accordance with one aspect includes a component of the inkjet print cartridge and an applied adhesive on at least a portion of the component, wherein the applied adhesive is formed from an adhesive having a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1. The method in accordance with one aspect includes applying an adhesive onto at least a portion of a component of an inkjet print cartridge at an application temperature, Tα, and heating the adhesive from an initial temperature, Ti, to a cure temperature for the adhesive, Tc. The adhesive has a rheology cure profile characterized by at least one of the following parameters: a) a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1, b) a temperature of the adhesive is approximately equal to a minimum viscosity temperature for the adhesive, Tηmin, within less than about 10 minutes from the start of the cure cycle, and c) viscosity of the adhesive increases within less than about 5 minutes from the start of the cure cycle.
摘要翻译： 公开了一种用于制造由此制造的喷墨打印墨盒和喷墨墨盒的方法。 根据一个方面的喷墨打印墨盒包括喷墨打印墨盒的组件和在组件的至少一部分上的涂布的粘合剂，其中涂布的粘合剂由具有流变粘度比η的粘合剂形成， /小于/小于2.1。 根据一个方面的方法包括在施加温度Tαα下将粘合剂施加到喷墨打印盒的部件的至少一部分上，并从初始温度T 1加热粘合剂， 将粘合剂的固化温度提高到粘合剂的固化温度。 粘合剂具有流变学固化分布，其特征在于以下参数中的至少一个：a）1.0至小于2.1的流变粘度比ηη/ηmin / b）粘合剂的温度近似等于粘合剂T et et在从固化循环开始后不到约10分钟内的最低粘度温度，c）粘合剂的粘度 在治愈周期开始后不到5分钟内就会增加。
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公开(公告)号：US06550893B2
公开(公告)日：2003-04-22
申请号：US10047055
申请日：2002-01-14
IPC分类号： B41J2135
CPC分类号： B41J2/1645 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , H01L21/312
摘要： The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.
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公开(公告)号：US07273266B2
公开(公告)日：2007-09-25
申请号：US10823939
申请日：2004-04-14
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628
摘要： A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.
摘要翻译： 一种微流体喷射组件，包括其中具有精确形成的流体路径的硅衬底。 流体路径是通过在具有不超过约5000埃的电介质层厚度的蚀刻之前在具有蚀刻前的表面特性的基底上进行的深反应离子蚀刻工艺形成的，以及基本上不含介质材料的凹坑表面，其中a 表面点蚀的均方根深度小于约500埃，最大表面点蚀深度不超过约2500埃。 这种衬底中的流体路径具有改进的流动特性以便更可靠的流体喷射操作。
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公开(公告)号：US06902867B2
公开(公告)日：2005-06-07
申请号：US10262827
申请日：2002-10-02
申请人： Eric Spencer Hall , Shauna Marie Leis , Andrew Lee McNees , James Michael Mrvos , James Harold Powers , Carl Edmond Sullivan
发明人： Eric Spencer Hall , Shauna Marie Leis , Andrew Lee McNees , James Michael Mrvos , James Harold Powers , Carl Edmond Sullivan
CPC分类号： B41J2/1623 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1635 , B41J2/1645
摘要： The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.
摘要翻译： 本发明提供了一种在用于喷墨打印头的半导体硅衬底芯片中制造墨水供给通孔的方法，以及通过该方法制造的含有硅芯片的喷墨打印头。 该方法包括将第一光致抗蚀剂材料施加到芯片的第一表面侧。 第一光致抗蚀剂材料被图案化和显影以在其中限定至少一个墨通孔位置。 将蚀刻停止材料施加到芯片的第二表面侧。 通过干法蚀刻工艺将至少一个墨通孔从芯片的第一表面侧通过硅片的厚度直到蚀刻停止层。 与传统的油墨通孔形成技术相反，该方法显着提高了硅芯片的生产量，并减少了由于断屑和破裂造成的损耗。 所得到的芯片对于长期的打印头使用更可靠。
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公开(公告)号：US06623103B2
公开(公告)日：2003-09-23
申请号：US09829526
申请日：2001-04-10
IPC分类号： B41J216
CPC分类号： B41J2/1634 , B23K26/066 , B23K26/389 , B23K2103/42 , B23K2103/50 , B41J2/16 , B41J2/162 , Y10T29/49401
摘要： The invention provides a method for forming ink jet nozzle structures in an ablatable material. More particularly, the invention provides uniform nozzle structure by ablating an ablatable material with a laser beam while setting a field lens unit to various locations relative to a projection lens. The resulting ink jet nozzle structures have substantially orthogonal ink delivery trajectory paths relative to a plane defined by the length and width of the ablatable material regardless of the nozzles hole position relative to the edges of the ablatable material.
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公开(公告)号：US07531047B1
公开(公告)日：2009-05-12
申请号：US11954929
申请日：2007-12-12
IPC分类号： B08B3/04
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1646 , H01L21/67069 , H01L21/6708 , Y10S134/902 , Y10S438/906
摘要： The present disclosure provides a method of cleaning a semiconductor substrate after a DRIE etch process, wherein residue from the DRIE process is removed without damaging the substrate. The process may include contacting the micro-fluid ejection head with an aqueous solution of TMAH, stripping a photoresist etch mask from the micro-fluid ejection head, and dissolving a passivating coating from the substrate. Then the substrate may be contacted with an acidic solution. The method may further include rinsing and drying the substrate.
摘要翻译： 本公开提供了在DRIE蚀刻工艺之后清洁半导体衬底的方法，其中去除DRIE工艺的残留物而不损坏衬底。 该方法可以包括使微流体喷射头与TMAH的水溶液接触，从微流体喷射头剥离光致抗蚀剂蚀刻掩模，以及从基底中溶解钝化涂层。 然后可以将基底与酸性溶液接触。 该方法还可以包括冲洗和干燥基底。
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公开(公告)号：US06668445B1
公开(公告)日：2003-12-30
申请号：US09481254
申请日：2000-01-11
IPC分类号： H05B300
CPC分类号： G03G9/0821 , H05K3/3489 , H05K3/361 , Y10S438/906 , Y10T29/49083 , Y10T29/49169 , Y10T29/49401
摘要： A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.
摘要翻译： 将喷墨打印机的加热器芯片自动粘合到柔性电路的带的方法包括将导电焊盘附接到加热器芯片的表面的第一部分的步骤。 将掩模施加到加热器芯片的表面的第二部分。 接合焊盘的暴露表面被化学干蚀刻预定的时间段，从而从蚀刻的暴露表面去除污染物。 化学干蚀刻在预定时间段结束时终止，使得基本上没有去除焊盘。 最后，柔性电路电连接到蚀刻的暴露表面。
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