公开(公告)号：US20210057241A1

公开(公告)日：2021-02-25

申请号：US16941661

申请日：2020-07-29

Applicant: Kioxia Corporation

Inventor： Yuji HASHIMOTO ,  Shinsuke Muraki ,  Hiroaki Yamada

IPC: H01L21/67 ,  B08B3/08 ,  B08B13/00 ,  B08B3/10

Abstract: According to one embodiment, a semiconductor manufacturing device includes a chemical solution preparation tank configured to prepare a solution; a chamber configured to discharge the chemical solution prepared at the chemical solution preparation tank to a substrate; a pressure sensor configured to measure a pressure inside the chemical solution preparation tank; and a variable opening valve arranged between the chemical solution preparation tank and an exhaust pipe.

公开(公告)号：US11728188B2

公开(公告)日：2023-08-15

申请号：US16941661

申请日：2020-07-29

Applicant: Kioxia Corporation

Inventor： Yuji Hashimoto ,  Shinsuke Muraki ,  Hiroaki Yamada

IPC: H01L21/67 ,  B08B3/08 ,  B08B13/00 ,  B08B3/10

CPC classification number: H01L21/67126 ,  B08B3/08 ,  B08B3/106 ,  B08B13/00 ,  H01L21/6708 ,  H01L21/67051 ,  H01L21/67242 ,  H01L21/67248 ,  B08B2203/007 ,  H01L21/67017 ,  H01L21/67086 ,  H01L21/67253

Abstract: According to one embodiment, a semiconductor manufacturing device includes a chemical solution preparation tank configured to prepare a solution; a chamber configured to discharge the chemical solution prepared at the chemical solution preparation tank to a substrate; a pressure sensor configured to measure a pressure inside the chemical solution preparation tank; and a variable opening valve arranged between the chemical solution preparation tank and an exhaust pipe.

公开(公告)号：US11676828B2

公开(公告)日：2023-06-13

申请号：US17119431

申请日：2020-12-11

Applicant: Kioxia Corporation

Inventor： Shinsuke Muraki ,  Satoshi Nakaoka

IPC: H01L21/67 ,  H01L21/311 ,  H01L21/66

CPC classification number: H01L21/67086 ,  H01L21/31111 ,  H01L21/67253 ,  H01L22/20

Abstract: A semiconductor manufacturing apparatus according to the present embodiment includes a tank, a heater, a bubble supplier, a sensor and a controller. The tank stores a chemical solution for processing a substrate. The heater heats the chemical solution. The bubble supplier supplies bubbles to the chemical solution in the tank. The sensor detects at least one of a concentration of the chemical solution, a water concentration of the chemical solution, specific gravity of the chemical solution and a vapor concentration of a gas discharged from the tank. The controller controls the supply of bubbles by the bubble supplier based on a detection result of the sensor.