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公开(公告)号:US20230047644A1
公开(公告)日:2023-02-16
申请号:US17835180
申请日:2022-06-08
Applicant: Kioxia Corporation
Inventor: Shota KASHIYAMA , Weili CAI
IPC: H01L27/11582 , H01L27/11556
Abstract: A semiconductor storage device according to an embodiment includes a substrate, an interconnection layer region, a multi-layered body, a semiconductor body, and a columnar part. The multi-layered body has an end portion facing the interconnection layer region as an end portion in the first direction. The columnar part includes a first portion and a second portion, the first portion is at the end portion of the multi-layered body, the second portion is closer to the substrate than the first portion is. The first portion has a center. The second portion has a center. The center of the second portion in a second direction is displaced in the second direction with respect to the center of the first portion in the second direction. The second direction crosses the first direction.
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公开(公告)号:US20220085060A1
公开(公告)日:2022-03-17
申请号:US17191217
申请日:2021-03-03
Applicant: Kioxia Corporation
Inventor: Ryota NARASAKI , Weili CAI , Satoshi NAGASHIMA , Takayuki ISHIKAWA , Yusuke SHIMADA , Yefei HAN
IPC: H01L27/11582 , H01L23/522 , H01L27/11556
Abstract: A semiconductor storage device includes a first conductive layer; a first insulating layer between the first and second conductive layers; a second insulating layer between the first conductive layer and the first insulating layer; a third insulating layer between the second conductive layer and the first insulating layer; a fourth insulating layer between the second conductive layer and the third conductive layer; a fifth insulating layer between the second conductive layer and the fourth insulating layer; and a sixth insulating layer between the third conductive layer and the fourth insulating layer. The first conductive layer has a first surface. The second conductive layer has a second surface. A barrier conductive film containing at least one of nitrogen (N) or titanium (Ti) is provided on the first surface and the second surface.
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公开(公告)号:US20210296338A1
公开(公告)日:2021-09-23
申请号:US17018682
申请日:2020-09-11
Applicant: Kioxia Corporation
Inventor: Yefei HAN , Weili CAI , Naoya YOSHIMURA
IPC: H01L27/11556 , G11C5/02 , G11C5/06
Abstract: According to one embodiment, a semiconductor storage device includes a semiconductor pillar including a channel. The channel includes a first channel portion and a second channel portion. A virtual cross section intersecting a first direction and including a first interconnection, a first electrode, the semiconductor pillar, a second electrode, and a second interconnection is determined. Both first end portions of the first channel portion and a first midpoint between both the first end portions are determined in the virtual cross section. Both second end portions of the second channel portion and a second midpoint between both the second end portions are determined in the virtual cross section. In this case, an angle between a second direction and a center line connecting the first midpoint and the second midpoint is an acute angle.
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