公开(公告)号：US20220132231A1

公开(公告)日：2022-04-28

申请号：US17571421

申请日：2022-01-07

Applicant: Knowles Electronics, LLC

Inventor： Janice LoPresti ,  Steve Kearey ,  Usha Murthy

IPC: H04R1/04 ,  H04R19/04

Abstract: A microelectromechanical systems (MEMS) microphone and form-factor adapter can include an adapter housing including an opening and an outer acoustic port and can include a MEMS microphone disposed at least partially within the adapter housing. The MEMS microphone can include a microphone housing, a MEMS motor disposed in the microphone housing and acoustically coupled to the outer acoustic port of the adapter housing via an acoustic port of the microphone housing, and an electrical circuit disposed in the microphone housing and electrically coupled to the MEMS motor and to electrical contacts on an exterior of the microphone housing. The electrical contacts can be physically accessible through the opening of the adapter housing. The adapter housing can change a form-factor of the MEMS microphone.

公开(公告)号：US20210204056A1

公开(公告)日：2021-07-01

申请号：US17137728

申请日：2020-12-30

Applicant: Knowles Electronics, LLC

Inventor： Christopher Bradt ,  Usha Murthy ,  Ben Vondersaar

IPC: H04R1/28 ,  H04R1/04

Abstract: A sensor assembly includes a housing having an external-device interface and a sound port to an interior to the housing. A transducer and an electrical circuit are disposed within the housing. The transducer is acoustically coupled to the sound port while the electrical circuit is electrically coupled to the transducer and the external-device interface. A cavity is formed in a portion of the sensor assembly. In some embodiments, the portion is a base of the housing of the sensor assembly. In other embodiments, the portion is a sound port adapter coupled to the sensor assembly. In any case, the cavity is acoustically coupled to the interior of the housing via the sound port and includes a wall portion structured to modify an acoustic property of the sensor assembly.

公开(公告)号：US20230217154A1

公开(公告)日：2023-07-06

申请号：US17566129

申请日：2021-12-30

Applicant: Knowles Electronics, LLC

Inventor： Alexander Grossman ,  Janice LoPresti ,  Usha Murthy

IPC: H04R1/28 ,  H04R19/04 ,  H04R1/04

CPC classification number: H04R1/2823 ,  H04R19/04 ,  H04R1/04 ,  H04R2201/003

Abstract: An acoustic sensor assembly includes a housing having an external-device interface and a sound port to an interior of the housing. An electro-acoustic transducer and an electrical circuit are disposed within the housing. The electro-acoustic transducer separates the interior into a front volume and a back volume, where the sound port acoustically couples the front volume to an exterior of the housing. The back volume includes a first portion and a second portion. The electrical circuit is electrically coupled to the electro-acoustic transducer and to the external-device interface. One or more apertures acoustically couple the first and second portions of the back volume and are structured to shape a frequency response of the acoustic sensor assembly.

公开(公告)号：US20160309264A1

公开(公告)日：2016-10-20

申请号：US15093025

申请日：2016-04-07

Applicant: Knowles Electronics, LLC

Inventor： Usha Murthy ,  Richard Scheleski ,  Dean Badillo

IPC: H04R19/01 ,  H04R19/00 ,  H04R3/00

CPC classification number: H04R19/016 ,  H04R1/04 ,  H04R1/2807 ,  H04R19/005 ,  H04R19/04

Abstract: A microphone assembly includes a housing having an interior with a front volume and a back volume. The housing has an acoustic input port coupling the front volume to an exterior of the housing. An acoustic sensor is disposed at least partially within the interior of the housing. At least a portion of the acoustic sensor is disposed at an interface between the front volume and the back volume. The acoustic sensor has an electrical signal output. A circuit board is disposed at least partially within the back volume of the housing and has a conductive member and an electrical contact. The circuit board also has a first portion carrying a first portion of the conductive member, and a second portion of the conductive member extending from the first portion of the circuit board toward the acoustic sensor. The second portion of the conductive member is electrically connected to the electrical signal output of the acoustic sensor.

Abstract translation: 麦克风组件包括具有前部体积和后部体积的内部的壳体。 壳体具有将前体积连接到壳体的外部的声输入端口。 声传感器至少部分地设置在壳体的内部。 声传感器的至少一部分设置在前体积和后体积之间的界面处。 声传感器具有电信号输出。 电路板至少部分地设置在壳体的后部体积内，并且具有导电构件和电接触。 电路板还具有承载导电构件的第一部分的第一部分，以及从电路板的第一部分朝向声学传感器延伸的导电构件的第二部分。 导电构件的第二部分电连接到声学传感器的电信号输出端。

公开(公告)号：US11659310B2

公开(公告)日：2023-05-23

申请号：US17571421

申请日：2022-01-07

Applicant: Knowles Electronics, LLC

Inventor： Janice LoPresti ,  Steve Kearey ,  Usha Murthy

IPC: H04R1/04 ,  H04R19/04

CPC classification number: H04R1/04 ,  H04R19/04 ,  H04R2201/003

Abstract: A microelectromechanical systems (MEMS) microphone and form-factor adapter can include an adapter housing including an opening and an outer acoustic port and can include a MEMS microphone disposed at least partially within the adapter housing. The MEMS microphone can include a microphone housing, a MEMS motor disposed in the microphone housing and acoustically coupled to the outer acoustic port of the adapter housing via an acoustic port of the microphone housing, and an electrical circuit disposed in the microphone housing and electrically coupled to the MEMS motor and to electrical contacts on an exterior of the microphone housing. The electrical contacts can be physically accessible through the opening of the adapter housing. The adapter housing can change a form-factor of the MEMS microphone.

公开(公告)号：US11259104B2

公开(公告)日：2022-02-22

申请号：US16909818

申请日：2020-06-23

Applicant: Knowles Electronics, LLC

Inventor： Janice LoPresti ,  Steve Kearey ,  Usha Murthy

IPC: H04R1/04 ,  H04R19/04

Abstract: A microphone can include an adapter housing. The adapter housing can include an opening and an outer acoustic port. The microphone can include an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port. The internal microphone assembly can include a plurality of contacts disposed on the internal housing. The contacts can be accessible through the opening of the adapter housing. An interior of the internal housing can be acoustically coupled to the outer acoustic port via the internal acoustic port.

公开(公告)号：US11968487B2

公开(公告)日：2024-04-23

申请号：US18135148

申请日：2023-04-15

Applicant: Knowles Electronics, LLC

Inventor： Janice LoPresti ,  Steve Kearey ,  Usha Murthy

IPC: H04R1/04 ,  H04R19/04

CPC classification number: H04R1/04 ,  H04R19/04 ,  H04R2201/003

Abstract: A microphone assembly can include a form-factor adapter housing including an interface opening and an external acoustic port, and an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port and electrical interface contacts, a microelectromechanical systems (MEMS) motor disposed in the internal housing, and an integrated circuit disposed in the internal housing, the integrated circuit electrically coupled to the MEMS motor and to the electrical interface contacts. The assembly can include an adapter interface located at the interface opening and comprising external host device interface contacts electrically coupled to the electrical interface contacts, the external host device interface contacts exposed to an exterior of the microphone assembly. The internal acoustic port can be acoustically coupled to the external acoustic port.

公开(公告)号：US20230254619A1

公开(公告)日：2023-08-10

申请号：US18135148

申请日：2023-04-15

Applicant: Knowles Electronics, LLC

Inventor： Janice LoPresti ,  Steve Kearey ,  Usha Murthy

IPC: H04R1/04 ,  H04R19/04

CPC classification number: H04R1/04 ,  H04R19/04 ,  H04R2201/003

Abstract: A microphone assembly can include a form-factor adapter housing including an interface opening and an external acoustic port, and an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port and electrical interface contacts, a MEMS motor disposed in the internal housing, and an integrated circuit disposed in the internal housing, the integrated circuit electrically coupled to the MEMS motor and to the electrical interface contacts. The assembly can include an adapter interface located at the interface opening and comprising external host device interface contacts electrically coupled to the electrical interface contacts, the external host device interface contacts exposed to an exterior of the microphone assembly. The internal acoustic port can be acoustically coupled to the external acoustic port.

公开(公告)号：US11653143B2

公开(公告)日：2023-05-16

申请号：US17137728

申请日：2020-12-30

Applicant: Knowles Electronics, LLC

Inventor： Christopher Bradt ,  Usha Murthy ,  Ben Vondersaar

IPC: H04R1/28 ,  H04R1/04

CPC classification number: H04R1/2884 ,  H04R1/04

Abstract: A sensor assembly includes a housing having an external-device interface and a sound port to an interior to the housing. A transducer and an electrical circuit are disposed within the housing. The transducer is acoustically coupled to the sound port while the electrical circuit is electrically coupled to the transducer and the external-device interface. A cavity is formed in a portion of the sensor assembly. In some embodiments, the portion is a base of the housing of the sensor assembly. In other embodiments, the portion is a sound port adapter coupled to the sensor assembly. In any case, the cavity is acoustically coupled to the interior of the housing via the sound port and includes a wall portion structured to modify an acoustic property of the sensor assembly.

公开(公告)号：US12108204B2

公开(公告)日：2024-10-01

申请号：US17566129

申请日：2021-12-30

Applicant: Knowles Electronics, LLC

Inventor： Alexander Grossman ,  Janice LoPresti ,  Usha Murthy

IPC: H04R1/28 ,  H04R1/04 ,  H04R19/04

CPC classification number: H04R1/2823 ,  H04R1/04 ,  H04R19/04 ,  H04R2201/003

Abstract: An acoustic sensor assembly includes a housing having an external-device interface and a sound port to an interior of the housing. An electro-acoustic transducer and an electrical circuit are disposed within the housing. The electro-acoustic transducer separates the interior into a front volume and a back volume, where the sound port acoustically couples the front volume to an exterior of the housing. The back volume includes a first portion and a second portion. The electrical circuit is electrically coupled to the electro-acoustic transducer and to the external-device interface. One or more apertures acoustically couple the first and second portions of the back volume and are structured to shape a frequency response of the acoustic sensor assembly.