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    Semiconductor device
    1.
    发明申请
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US20050104189A1

    公开(公告)日：2005-05-19

    申请号：US10963024

    申请日：2004-10-12

    申请人： Koichi Akagawa ,  Toshiaki Nagase ,  Hiroyuki Onishi ,  Jun Ishikawa

    发明人： Koichi Akagawa ,  Toshiaki Nagase ,  Hiroyuki Onishi ,  Jun Ishikawa

    IPC分类号： H01L25/00 ,  H01L23/12 ,  H01L23/24 ,  H01L23/495 ,  H01L23/48

    CPC分类号： H01L23/24 ,  H01L23/495 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： When a silicone gel is injected into a case, since the gel is liquid before curing, the gel attempts to rise along a minute gap formed between a front face of a first electrode and a rear face of a resin member due to capillary action. However, since the gap becomes larger at a cavity in the first electrode, the rising motion of the gel stops at the level of the cavity. More specifically, the gel is prevented from reaching portions of the first electrode and a second electrode for connection with external terminals. Further, since the rising motion of the gel can be prevented by the cavity, the first electrode and the second electrode can be arranged in a close relationship with each other.

    摘要翻译： 当将硅胶注射到壳体中时，由于凝胶在固化之前是液体，所以凝胶试图通过毛细管作用沿着形成在第一电极的前表面和树脂构件的后表面之间的微小间隙升高。 然而，由于在第一电极中的空腔处的间隙变大，所以凝胶的上升运动停止在空腔的高度。 更具体地，防止凝胶到达第一电极的部分和用于与外部端子连接的第二电极。 此外，由于可以通过空腔来防止凝胶的上升运动，所以第一电极和第二电极可以彼此紧密地布置。

    Semiconductor apparatus
    5.
    发明授权
    Semiconductor apparatus 失效
    半导体装置

    公开(公告)号：US07256489B2

    公开(公告)日：2007-08-14

    申请号：US10979563

    申请日：2004-11-02

    申请人： Jun Ishikawa ,  Toshiaki Nagase ,  Hiroyuki Onishi ,  Koichi Akagawa

    发明人： Jun Ishikawa ,  Toshiaki Nagase ,  Hiroyuki Onishi ,  Koichi Akagawa

    IPC分类号： H01L23/48

    CPC分类号： H01L25/072 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014

    摘要： In a semiconductor apparatus in which a main current of a semiconductor device flows through a wiring pattern formed on an insulation circuit board, the rise in temperature of the wiring pattern is suppressed and the increase in cost of parts can be minimized. On the insulation circuit board, a copper pattern is formed. A heat spreader is soldered to the copper pattern, and the heat spreader is loaded with a semiconductor chip. An external electrode and the heat spreader are arranged to shorten the distance between the side of the external electrode and the side of the heat spreader.

    摘要翻译： 在半导体器件的主电流流过形成在绝缘电路板上的布线图案的半导体装置中，能够抑制布线图案的温度升高，能够最大限度地减少部件成本的上升。 在绝缘电路板上形成铜图案。 散热器焊接到铜图案，散热器装载有半导体芯片。 布置外部电极和散热器以缩短外部电极的侧面与散热器的侧面之间的距离。

    Semiconductor device
    6.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US07091580B2

    公开(公告)日：2006-08-15

    申请号：US10963024

    申请日：2004-10-12

    申请人： Koichi Akagawa ,  Toshiaki Nagase ,  Hiroyuki Onishi ,  Jun Ishikawa

    发明人： Koichi Akagawa ,  Toshiaki Nagase ,  Hiroyuki Onishi ,  Jun Ishikawa

    IPC分类号： H01L23/495

    CPC分类号： H01L23/24 ,  H01L23/495 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： When a silicone gel is injected into a case, since the gel is liquid before curing, the gel attempts to rise along a minute gap formed between a front face of a first electrode and a rear face of a resin member due to capillary action. However, since the gap becomes larger at a cavity in the first electrode, the rising motion of the gel stops at the level of the cavity. More specifically, the gel is prevented from reaching portions of the first electrode and a second electrode for connection with external terminals. Further, since the rising motion of the gel can be prevented by the cavity, the first electrode and the second electrode can be arranged in a close relationship with each other.

    摘要翻译： 当将硅胶注射到壳体中时，由于凝胶在固化之前是液体，所以凝胶试图通过毛细管作用沿着形成在第一电极的前表面和树脂构件的后表面之间的微小间隙升高。 然而，由于在第一电极中的空腔处的间隙变大，所以凝胶的上升运动停止在空腔的高度。 更具体地，防止凝胶到达第一电极的部分和用于与外部端子连接的第二电极。 此外，由于可以通过空腔来防止凝胶的上升运动，所以第一电极和第二电极可以彼此紧密地布置。