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公开(公告)号:US08040286B2
公开(公告)日:2011-10-18
申请号:US12158088
申请日:2007-02-01
申请人: Koichi Matsuo , Kazuyoshi Inami , Mamoru Yoshida , Takeshi Sueda , Shigeo Udagawa , Susumu Sato , Tsutomu Tamaki , Takuya Suzuki , Kousuke Yasooka , Minoru Hashimoto
发明人: Koichi Matsuo , Kazuyoshi Inami , Mamoru Yoshida , Takeshi Sueda , Shigeo Udagawa , Susumu Sato , Tsutomu Tamaki , Takuya Suzuki , Kousuke Yasooka , Minoru Hashimoto
IPC分类号: H01Q13/10
CPC分类号: H01P1/2135 , H01L2224/48091 , H01L2224/48227 , H01L2924/15184 , H01L2924/15311 , H01L2924/16195 , H01P5/02 , H01P5/1007 , H01Q21/0068 , H01Q21/0087 , H01Q21/064 , H01L2924/00014
摘要: A high-frequency module has an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.
摘要翻译: 高频模块具有通过使用扩散接合将布置有辐射狭缝的槽板一体地连接到具有形成有多个形成有用于向槽板供电的波导的薄板的板的天线。 天线的波导通过设置在树脂基板上的波导与高频封装的介质波导连接,从而以低成本配置缝隙天线,并将缝隙天线的电源槽连接到波导端子 的高频封装具有低损耗。
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公开(公告)号:US20090079648A1
公开(公告)日:2009-03-26
申请号:US12158088
申请日:2007-02-01
申请人: Koichi Matsuo , Kazuyoshi Inami , Mamoru Yoshida , Takeshi Sueda , Shigeo Udagawa , Susumu Sato , Tsutomu Tamaki , Takuya Suzuki , Kousuke Yasooka , Minoru Hashimoto
发明人: Koichi Matsuo , Kazuyoshi Inami , Mamoru Yoshida , Takeshi Sueda , Shigeo Udagawa , Susumu Sato , Tsutomu Tamaki , Takuya Suzuki , Kousuke Yasooka , Minoru Hashimoto
IPC分类号: H01Q13/10
CPC分类号: H01P1/2135 , H01L2224/48091 , H01L2224/48227 , H01L2924/15184 , H01L2924/15311 , H01L2924/16195 , H01P5/02 , H01P5/1007 , H01Q21/0068 , H01Q21/0087 , H01Q21/064 , H01L2924/00014
摘要: To provide a high-frequency module having an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.
摘要翻译: 为了提供一种高频模块,其具有通过使用扩散接合将通过将布置有辐射狭缝的槽板整体连接到具有多个形成有用于向槽板供电的波导的薄板的板构成的天线。 天线的波导通过设置在树脂基板上的波导与高频封装的介质波导连接,从而以低成本配置缝隙天线,并将缝隙天线的电源槽连接到波导端子 的高频封装具有低损耗。
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