公开(公告)号：US20230212409A1

公开(公告)日：2023-07-06

申请号：US17703694

申请日：2022-03-24

Applicant: Korea Institute of Science and Technology

Inventor： HeeSuk KIM ,  JeeIn JUNG ,  SeungJun CHUNG ,  JeongGon SON ,  Phillip LEE ,  Youngpyo KO

IPC: C09D5/24 ,  C09D183/04 ,  C09D7/62 ,  C09D7/40 ,  C08J7/044 ,  C08J7/04 ,  H01B1/22

CPC classification number: C09D5/24 ,  C09D183/04 ,  C09D7/62 ,  C09D7/70 ,  C09D7/68 ,  C09D7/69 ,  C08J7/044 ,  C08J7/0427 ,  H01B1/22 ,  C08K9/04

Abstract: Disclosed is a conductive polymer composite according to various embodiments of the present invention in order to implement the above-described object. The conductive polymer composite may include a polymer adhesive which includes a curable polymer and a curing agent, a conductive filler made of a metal having electrical properties, and a substituting agent configured to substitute for or remove a lubricant layer applied on the conductive filler.