公开(公告)号：US08336660B2

公开(公告)日：2012-12-25

申请号：US12630926

申请日：2009-12-04

申请人： Kotaro Ogura ,  Shinobu Amano ,  Masanori Yoshihara

发明人： Kotaro Ogura ,  Shinobu Amano ,  Masanori Yoshihara

IPC分类号： B62M27/02

CPC分类号： B62M27/02 ,  B62M2027/025 ,  B62M2027/026 ,  B62M2027/027

摘要： A snowmobile includes a vehicle body, a track belt, an engine, a left-and-right pair of skis, a suspension mechanism, and a steering mechanism. The track belt is located on a lower portion of the vehicle body. The engine drives the track belt. The suspension mechanism is a mechanism arranged to support the pair of skis so as to move in a vertical direction with respect to the vehicle body, and to support the pair of skis in an associated manner so that one of the skis moves downwards relative to the vehicle body when the other ski moves upwards relative to the vehicle body. The steering mechanism is a mechanism arranged to steer the pair of skis.

摘要翻译： 雪地车包括车体，履带，发动机，左右一对滑雪板，悬架机构和转向机构。 轨道带位于车体的下部。 发动机驱动履带。 悬架机构是一种机构，被布置成支撑一对滑雪板，以相对于车身在垂直方向上移动，并以相关联的方式支撑一对滑雪板，使得滑雪板中的一个相对于该滑雪板向下移动 当另一个滑雪板相对于车身向上移动时，车体。 转向机构是用于转向一对滑雪板的机构。

公开(公告)号：US06395572B1

公开(公告)日：2002-05-28

申请号：US09518504

申请日：2000-03-03

申请人： Tsuyoshi Tsutsui ,  Kotaro Ogura

发明人： Tsuyoshi Tsutsui ,  Kotaro Ogura

IPC分类号： H01L2100

CPC分类号： H01L33/22

摘要： Semiconductor light-emitting elements are produced by providing a wafer substrate of GaP, epitaxially growing on this substrate a semiconductor layered structure including an n-type layer and a p-type layer of GaP for providing a light-emitting layer, forming top electrodes on the semiconductor layered structure each over a portion of the area corresponding to one of the chips into which the substrate is to be later divided, forming a bottom electrode on the bottom surface of the substrate, dicing the wafer substrate into the individual chips, and thereafter carrying out a surface-roughening process on externally exposed portions of the semiconductor structure by means of hydrochloric acid. Each of the top electrodes is of a three-layer structure with a contact metal layer which may be of an alloy of Au and makes an ohmic contact with the GaP of the semiconductor layered structure, a Mo layer on the contact metal layer and an Au layer on the Mo layer.

摘要翻译： 半导体发光元件是通过提供GaP晶片衬底，在该衬底上外延生长的半导体层状结构，包括n型层和用于提供发光层的GaP的p型层，形成顶部电极 将半导体分层结构分别与对应于要分离基板的芯片之一对应的区域的一部分上，在基板的底面上形成底部电极，将晶片基板切割成各个芯片，之后 通过盐酸对半导体结构的外露部分进行表面粗糙化处理。 每个顶电极具有三层结构，其接触金属层可以是Au的合金，并与半导体层状结构的GaP，欧姆接触，接触金属层上的Mo层和Au Mo层上。

公开(公告)号：US08408560B2

公开(公告)日：2013-04-02

申请号：US12952379

申请日：2010-11-23

申请人： Takamasa Kamioka ,  Kotaro Ogura

发明人： Takamasa Kamioka ,  Kotaro Ogura

IPC分类号： B60G17/016 ,  B60G17/02 ,  B60G11/27

CPC分类号： B62B17/062

摘要： A saddle riding vehicle that allows the amount of roll to be reduced includes a vehicle body, a handle, and a suspension mechanism. The suspension mechanism is provided at a front portion of the vehicle body and supports a pair of left and right front wheels or a pair of left and right skis. The suspension mechanism includes a pair of left and right arm members and a pair of left and right air shock absorbers. The pair of left and right arm members supports the pair of front wheels or the pair of skis in a vertically movable manner. The pair of left and right air shock absorbers is coupled to the pair of arm members. The pair of left and right air shock absorbers each includes a cylinder, a piston, a piston rod, a first gas chamber, and a second gas chamber.

摘要翻译： 允许减少滚动量的骑乘车辆包括车身，手柄和悬挂机构。 悬架机构设置在车身的前部，并且支撑一对左右前轮或一对左右滑雪板。 悬架机构包括一对左右臂构件和一对左右空气减震器。 一对左右臂构件以可垂直移动的方式支撑一对前轮或一对滑雪板。 一对左右的空气减震器与一对臂部件联接。 一对左右的空气减振器各自包括缸体，活塞，活塞杆，第一气体室和第二气体室。

公开(公告)号：US5712758A

公开(公告)日：1998-01-27

申请号：US632115

申请日：1996-04-15

申请人： Koshi Amano ,  Kotaro Ogura

发明人： Koshi Amano ,  Kotaro Ogura

IPC分类号： H01G4/12 ,  H01G4/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/252 ,  H01G4/30

CPC分类号： H01G4/2325

摘要： The multilayer ceramic chip capacitor includes a multilayer ceramic capacitor chip having internal electrodes and an external electrode that is formed of a sintered layer of a paste containing both an electroconductive metal powder and a glass frit on both end faces of the multilayer ceramic capacitor chip and having an electric connection to the internal electrodes. A coating of plated metal is deposited on the surface of the external electrode. The multilayer ceramic capacitor chip is chamfered to a radius of curvature (R) of 0.10 mm or more on the periphery of each of the end faces at which the internal electrodes are to be connected to the external electrode and/or the external electrode has a dual structure consisting of an undercoat in contact with the internal electrodes and a topcoat in superposition on the surface of the undercoat. The undercoat is being formed of a paste containing unmolten glass frit in an amount from 22 to 40 wt % of the electroconductive metal powder and the topcoat is formed of a paste containing unmolten glass frit in an amount from more than 0 to 7 wt % of the electroconductive metal powder. Both the topcoat and the undercoat are formed by sintering the applied pastes at temperatures that cause only the surfaces of the particles in the glass frit to melt. This capacitor and other types of ceramic multilayer chip electronic components manufactured by this inventive process have high resistance to cyclic thermal impacts.

摘要翻译： 多层陶瓷片状电容器包括具有内部电极的多层陶瓷电容器芯片和由多层陶瓷电容器芯片的两个端面上均包含导电金属粉末和玻璃料的糊料烧结层形成的外部电极，并且具有 与内部电极的电连接。 电镀金属的涂层沉积在外部电极的表面上。 多层陶瓷电容器芯片在要连接到外部电极的内部电极的每个端面的周边和/或外部电极具有的边缘上被倒角到0.10mm以上的曲率半径（R） 双层结构由与内部电极接触的底涂层和叠层在底涂层表面上的顶涂层组成。 底涂层由含有导电金属粉末的22〜40重量％的未熔玻璃料的糊料形成，并且面漆由含有大于0〜7重量％以下的未熔融玻璃料的糊料形成 导电金属粉末。 顶涂层和底涂层都是通过在仅导致玻璃料中的颗粒表面熔化的温度下烧结所施加的糊料而形成的。 本发明方法制造的这种电容器和其它类型的陶瓷多层芯片电子部件具有高的抗循环热冲击性。