公开(公告)号：US5283947A

公开(公告)日：1994-02-08

申请号：US16082

申请日：1993-02-10

申请人： Kouichi Santo ,  Kouji Tanabe ,  Naohiro Nishioka ,  Kenji Ootomo ,  Yoshihito Okazaki

发明人： Kouichi Santo ,  Kouji Tanabe ,  Naohiro Nishioka ,  Kenji Ootomo ,  Yoshihito Okazaki

IPC分类号： B23K1/00 ,  B23K20/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K13/04 ,  H05K3/34

CPC分类号： H05K13/046 ,  B23K1/0016 ,  B23K20/023 ,  H05K3/284 ,  H05K3/323 ,  H05K1/181 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/1311 ,  H05K3/305 ,  Y10T29/4913 ,  Y10T29/49144

摘要： Anisotropic conductive material is employed instead of solder for connecting between the terminal of a component and a printed circuit board. In addition to the printed circuit board, a printed circuit sheet is provided and the terminal of the component is sandwiched between both anisotropic materials on the printed circuit board and beneath the printed circuit sheet. From both outside surfaces of the printed circuit board and the sheet, heat and pressure are simultaneously applied to the terminal part (i.e. thermocompression bonding).

摘要翻译： 使用各向异性导电材料代替用于在部件的端子和印刷电路板之间连接的焊料。 除了印刷电路板之外，还提供了印刷电路板，并且该部件的端子被夹在印刷电路板上的两个各向异性材料之间以及印刷电路板之下。 从印刷电路板和片材的两个外表面，热和压力同时施加到端子部分（即热压接）。