公开(公告)号：US20050046973A1

公开(公告)日：2005-03-03

申请号：US10895012

申请日：2004-07-19

Applicant: Pierangelo Magni ,  Remi Brechignac ,  Chek Kho ,  Kum Weng Loo

Inventor： Pierangelo Magni ,  Remi Brechignac ,  Chek Kho ,  Kum Weng Loo

IPC: G02B7/02 ,  G02B27/62 ,  H04N5/225

CPC classification number: G02B13/001 ,  G02B7/02 ,  G02B27/62 ,  H01L2224/48227 ,  H04N5/2254

Abstract: A method is described for fixing a lens of an optical group with respect to an optical sensor in an image acquisition device comprising the steps of housing the optical sensor in a housing, fixing a lower holder of the optical group to the housing, aligning an upper holder of the optical group, wherein the lens is placed, with the sensor so as to align a focusing point of the lens with respect to the sensor, welding the upper holder to the lower holder. The welding step may be performed by means of ultrasounds.

Abstract translation: 描述了一种用于在图像采集装置中固定相对于光学传感器的光学组的透镜的方法，包括以下步骤：将光学传感器容纳在壳体中，将光学组的下部固定器固定到壳体上， 将光学组的保持器放置在传感器上，以便使透镜的聚焦点相对于传感器对准，将上支架焊接到下支架。 焊接步骤可以通过超声波进行。

公开(公告)号：US08338943B2

公开(公告)日：2012-12-25

申请号：US12873068

申请日：2010-08-31

Applicant: Kum Weng Loo

Inventor： Kum Weng Loo

IPC: H01L23/10 ,  H01L23/34

CPC classification number: H01L23/367 ,  H01L21/50 ,  H01L23/16 ,  H01L23/42 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83 ,  H01L2924/0001 ,  H01L2924/14 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A semiconductor package includes a substrate, a stiffener ring coupled to the substrate and configured to form a well with the substrate, and a die positioned in the well. A thermal interface is positioned on the die. A heat spreader is coupled to the stiffener ring so that a portion of the heat spreader is positioned in the well and the thermal interface thermally couples the heat spreader to the die. The portion of the heat spreader positioned in the well adds rigidity to the semiconductor package and facilitates the use of thin dies.

Abstract translation: 半导体封装包括衬底，耦合到衬底并且被配置为与衬底形成阱的加强环和定位在阱中的管芯。 热界面位于模具上。 散热器耦合到加强环，使得散热器的一部分定位在井中，并且热界面将散热器热耦合到管芯。 定位在井中的散热器部分增加了半导体封装的刚性，并且便于使用薄模。

公开(公告)号：US20120050996A1

公开(公告)日：2012-03-01

申请号：US12873068

申请日：2010-08-31

Applicant: Kum Weng Loo

Inventor： Kum Weng Loo

IPC: H05K7/20 ,  H01L21/50 ,  H01L23/34

CPC classification number: H01L23/367 ,  H01L21/50 ,  H01L23/16 ,  H01L23/42 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83 ,  H01L2924/0001 ,  H01L2924/14 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A semiconductor package includes a substrate, a stiffener ring coupled to the substrate and configured to form a well with the substrate, and a die positioned in the well. A thermal interface is positioned on the die. A heat spreader is coupled to the stiffener ring so that a portion of the heat spreader is positioned in the well and the thermal interface thermally couples the heat spreader to the die. The portion of the heat spreader positioned in the well adds rigidity to the semiconductor package and facilitates the use of thin dies.

Abstract translation: 半导体封装包括衬底，耦合到衬底并被配置成与衬底形成阱的加强环以及定位在阱中的管芯。 热界面位于模具上。 散热器耦合到加强环，使得散热器的一部分定位在井中，并且热界面将散热器热耦合到管芯。 定位在井中的散热器部分增加了半导体封装的刚性，并且便于使用薄模。

公开(公告)号：US07880132B2

公开(公告)日：2011-02-01

申请号：US11872226

申请日：2007-10-15

Applicant: Stuart Brodie ,  Hazel McInnes ,  Kum Weng Loo ,  Mickael Miglietti ,  Eric Saugier

Inventor： Stuart Brodie ,  Hazel McInnes ,  Kum Weng Loo ,  Mickael Miglietti ,  Eric Saugier

IPC: H01J5/02 ,  H04N5/225 ,  G03B17/00 ,  G02B7/02

CPC classification number: G03B11/00 ,  H04N5/2257

Abstract: A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module.

Abstract translation: 提供相机模块透镜盖，以保护相机模块暴露在的移动设备中的相机模块。 相机模块透镜盖包括用于定位在相机镜头附近的光学透明构件和用于承载光学透明构件的壳体。 壳体包括用于接合摄像机模块的基座的突出唇缘。

公开(公告)号：US20090057544A1

公开(公告)日：2009-03-05

申请号：US11872226

申请日：2007-10-15

Applicant: Stuart Brodie ,  Hazel McInnes ,  Kum Weng Loo ,  Mickael Miglietti ,  Eric Saugier

Inventor： Stuart Brodie ,  Hazel McInnes ,  Kum Weng Loo ,  Mickael Miglietti ,  Eric Saugier

IPC: G03B17/02

CPC classification number: G03B11/00 ,  H04N5/2257

Abstract: A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module.

Abstract translation: 提供相机模块透镜盖，以保护相机模块暴露在的移动设备中的相机模块。 相机模块透镜盖包括用于定位在相机镜头附近的光学透明构件和用于承载光学透明构件的壳体。 壳体包括用于接合摄像机模块的基座的突出唇缘。

公开(公告)号：US07061697B2

公开(公告)日：2006-06-13

申请号：US10895012

申请日：2004-07-19

Applicant: Pierangelo Magni ,  Remi Brechignac ,  Chek Lim Kho ,  Kum Weng Loo

Inventor： Pierangelo Magni ,  Remi Brechignac ,  Chek Lim Kho ,  Kum Weng Loo

IPC: G02B7/02 ,  H01J40/14 ,  H01L27/00 ,  H01L21/00

CPC classification number: G02B13/001 ,  G02B7/02 ,  G02B27/62 ,  H01L2224/48227 ,  H04N5/2254

Abstract: A method is described for fixing a lens of an optical group with respect to an optical sensor in an image acquisition device comprising the steps of housing the optical sensor in a housing, fixing a lower holder of the optical group to the housing, aligning an upper holder of the optical group, wherein the lens is placed, with the sensor so as to align a focusing point of the lens with respect to the sensor, welding the upper holder to the lower holder. The welding step may be performed by means of ultrasounds.

Abstract translation: 描述了一种用于在图像采集装置中固定相对于光学传感器的光学组的透镜的方法，包括以下步骤：将光学传感器容纳在壳体中，将光学组的下部固定器固定到壳体上， 将光学组的保持器放置在传感器上，以便使透镜的聚焦点相对于传感器对准，将上支架焊接到下支架。 焊接步骤可以通过超声波进行。