Abstract:
A capacitive touchscreen panel and a method for etching an indium tin oxide film on a gap portion of a capacitive touchscreen panel, the method for etching comprises using a laser etching line to cut ITO on the gap portion into a plurality of ITO segments, the ITO segments are independent of each other and are not connected to each other. The method for etching an indium tin oxide film on a capacitive touchscreen panel and a gap portion thereof of the present invention has high production efficiency, and the touchscreen product has a good display effect after etching.
Abstract:
An FPC of a capacitive touchscreen and a method for mounting the FPC. The FPC comprises a sensing circuit and a driving circuit which respectively matches with a sensing circuit layer and a driving circuit layer of a capacitive touchscreen panel and have several contacts for matching the sensing circuit layer and the driving circuit layer for corresponding connection; an IC driving chip, disposed between the sensing circuit and the driving circuit. The sensing circuit and the driving circuit are disposed in parallel or on the same line. The sensing circuit or the driving circuit is provided with a bending area, and the sensing circuit or the driving circuit is able to be turned towards the driving circuit or the sensing circuit, so as to allow the sensing circuit to match the sensing circuit layer and allow the driving circuit to match the driving circuit layer. According to the present invention, the FPCs of the capacitive touchscreen can be compactly arranged on a substrate, so that the utilization rate of the substrate is greatly increased and the cost is reduced.
Abstract:
The present invention discloses a flexible circuit board. The flexible circuit board comprises a base portion and a grounding soft board extending from the base portion, the grounding soft board comprising a board body connected to the base portion and a contact end provided at a free end of the board body, the contact end comprising a bonding region and a windowing copper exposure region arranged inside the bonding region, and the board body being in a curved shape. According to the present invention, by making improvements on the bonding area between the grounding soft board and the shielding layer and on the shape of the soft board, and by increasing the bonding power and dispersing the folding stress, the grounding soft board is prevented from falling off at portions contacting the shielding layer when folded or transported.