公开(公告)号：US06818538B2

公开(公告)日：2004-11-16

申请号：US10418838

申请日：2003-04-18

申请人： Kuo-Chu Chiang ,  Yu-Ting Lai ,  Chin Te Chen

发明人： Kuo-Chu Chiang ,  Yu-Ting Lai ,  Chin Te Chen

IPC分类号： H01L2144

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A ball grid array semiconductor packaging technology is provided, which is characterized in that openings of a solder mask are formed on a given edge of a die attachment area, and entire or partial width of each opening is disposed outside the die attachment area. Accordingly, air within the opening of the solder mask is sufficiently eliminated during die bonding process, so as to prevent void formation as adhesive is filled into the opening. Therefore, in the follow-up steps, high temperature in reflowing process will not cause popcorn as in the prior-art, so as to remain good quality of the semiconductor package.