Abstract:
A digital data recording and/or reproducing apparatus and a control method thereof, In particular, the digital data recording and/or reproducing apparatus and method are capable of recording and reproducing an incoming digital broadcasting program in compressed format. The digital data recording and/or reproducing apparatus includes a controller for counting the number of forward motion compensation interpolated macro blocks and backward motion compensation interpolated macro blocks of a bidirectionally-predictive coded picture of a group of picture of the digital data, and detecting a point where a scene change occurs based on the counted number, and a video index generator for generating a video index by decoding an intraframe coded picture nearest to the detected point of scene change of each GOP, reproducing images and arranging the reproduced images. The navigation function is provided without requiring all the frames of the compressed broadcasting program to be decoded, but by detecting scene changes in the compressed region of the broadcasting program, and generates a video index of images of detected scene change points. Accordingly, a vast amount of multimedia data can be efficiently stored, and user friendliness is increased.
Abstract:
Semiconductor devices that provide improved wire-bonding reliability are provided. A semiconductor device includes a substrate, an insulating film, a lower protective film, a plurality of bonding pads, and an upper protective film. The insulating film is formed on the substrate and includes a multilayer wiring structure embedded therein. The lower protective film is formed on the insulating film and has a plurality of lower bonding pad openings that are aligned with an uppermost wiring layer of the multilayer wiring structure and are spaced apart from each other in a first direction. The lower protective film has trenches defined therein between adjacent pairs of the lower bonding pad openings. The plurality of bonding pads are in the lower bonding pad openings, are spaced apart from each other in the first direction, and are connected to the uppermost wiring layer of the multilayer wiring structure. An upper protective film fills the trenches in the lower protective film and has a plurality of spaced apart upper bonding pad openings defined therein that expose at least a portion of an upper surface of the bonding pads.