公开(公告)号：US20170341351A1

公开(公告)日：2017-11-30

申请号：US15520985

申请日：2015-10-23

申请人： Kyodo Printing Co., Ltd.

发明人： Nobuhisa IWASAKI ,  Midori KATO ,  Tatsuya OGAWA ,  Masayuki HOSOI

IPC分类号： B32B27/18 ,  B32B15/085 ,  B32B7/12 ,  B32B27/32 ,  B65D75/36 ,  B65D65/40

CPC分类号： B32B27/18 ,  B32B1/02 ,  B32B7/12 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/30 ,  B32B27/302 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/732 ,  B32B2307/74 ,  B32B2307/758 ,  B32B2439/40 ,  B32B2439/80 ,  B65D65/40 ,  B65D75/34 ,  B65D75/36 ,  B65D75/366

摘要： The present invention provides a laminate for blister packs which is not susceptible to molding failures even if a pocket is formed to a certain depth in order to pack the contents of large drug or the like. The present invention provides a laminate for blister packs, the laminate having a substrate film, an adhesive resin layer having a thickness of 25-100 μm, and an absorption film in this order. The absorption film comprises an absorption layer including a thermoplastic resin and an inorganic absorbent.