Method for forming capacitor of semiconductor device

    公开(公告)号:US06410381B1

    公开(公告)日:2002-06-25

    申请号:US09867658

    申请日:2001-05-31

    IPC分类号: H01L218242

    摘要: The present invention discloses a method for forming a capacitor of a semiconductor device which can increase a capacitance and prevent a leakage current at the same time. The method includes the steps of depositing a cap oxide film on a semiconductor substrate, patterning the cap oxide film to expose a capacitor region of the semiconductor substrate, consecutively depositing an Ru film for a lower electrode on the patterned cap oxide film and the semiconductor substrate in in-situ according to a low pressure chemical vapor deposition(LPCVD) and a plasma enhanced chemical vapor deposition(PECVD), forming a cylindrical lower electrode, by performing a chemical mechanical polishing process on the Ru film and removing the cap oxide film, forming an amorphous TaON film having a high dielectric constant on the lower electrode, crystallizing the amorphous TaON film according to a thermal treatment, and forming a metal film for an upper electrode on the crystallized TaON film.

    Gas distribution system and method for chemical vapor deposition
apparatus
    2.
    发明授权
    Gas distribution system and method for chemical vapor deposition apparatus 失效
    化学气相沉积装置的气体分配系统和方法

    公开(公告)号:US5853484A

    公开(公告)日:1998-12-29

    申请号:US727903

    申请日:1996-10-09

    申请人: Kyung Cheol Jeong

    发明人: Kyung Cheol Jeong

    CPC分类号: C23C16/45565 C23C16/44

    摘要: A gas distribution system for a chemical vapor deposition (CVD) apparatus includes a main gas supply pipe for receiving gas from a gas supply, a manifold communicated to the main gas supply pipe and having a plurality of sub-pipes, a plurality of gas metering valves provided at each of the sub-pipes so as to control gas amount flowing therein from each of the sub-pipes, a gas distribution head communicating with each of the sub-pipes so as to collectively jet gas therefrom, a control unit for outputting control signals to each of the gas control valves, and an N-point scanner electrically connected to input terminals of the control unit. The gas distribution system improves deposition uniformity by adjusting the thickness of a film deposited on a wafer in accordance with scanning information from the N-point scanner.

    摘要翻译: 一种用于化学气相沉积(CVD)装置的气体分配系统包括:用于接收来自气体供应源的气体的主气体供应管,与主气体供应管连通并具有多个子管的歧管,多个气体计量 设置在每个子管上的阀,以便控制从每个子管流出的气体量,与每个子管连通以从其中共同喷射气体的气体分配头,用于输出 控制信号到每个气体控制阀,以及N点扫描器,电连接到控制单元的输入端。 通过根据来自N点扫描器的扫描信息调节沉积在晶片上的膜的厚度,气体分配系统改善了沉积均匀性。