-
1.
公开(公告)号:US20050009214A1
公开(公告)日:2005-01-13
申请号:US10883711
申请日:2004-07-06
申请人: Kyu-Hong Lim , Byung-Am Lee , Joo-Woo Kim , Chang-Hoon Lee
发明人: Kyu-Hong Lim , Byung-Am Lee , Joo-Woo Kim , Chang-Hoon Lee
IPC分类号: H01L21/027 , G03F7/20 , G03F9/00 , H01L21/00 , H01L21/76
CPC分类号: G03F9/7092 , G03F7/70616
摘要: In a method of aligning a wafer, which is capable of precisely and rapidly aligning the wafer, and a wafer alignment apparatus using the method of aligning the wafer, a first wafer is aligned to form a first template pattern corresponding to an image of the first wafer. Image data of a second wafer is inputted. A kind of the second wafer is different from that of the first wafer. A second template pattern is formed by transforming the first template pattern in response to the image data of the second wafer. The second wafer is then aligned in response to the second template pattern. Accordingly, the template pattern is formed using the image data to align the wafer although wafers having different images are inspected, thereby rapidly forming the template pattern.
摘要翻译: 在使用能够精确且快速地对准晶片的晶片和使用对准晶片的方法的晶片对准装置的对准方法中,对准第一晶片以形成对应于第一晶片的图像的第一模板图案 晶圆。 输入第二晶片的图像数据。 一种第二晶片与第一晶片不同。 通过响应于第二晶片的图像数据变换第一模板图案来形成第二模板图案。 然后响应于第二模板图案对准第二晶片。 因此,使用图像数据形成模板图案,以对晶片进行对准,尽管检查具有不同图像的晶片,从而快速形成模板图案。
-
公开(公告)号:US20070252993A1
公开(公告)日:2007-11-01
申请号:US11819168
申请日:2007-06-25
申请人: Kyu-Hong Lim , Byung-Am Lee , Joo-Woo Kim , Chang-Hoon Lee
发明人: Kyu-Hong Lim , Byung-Am Lee , Joo-Woo Kim , Chang-Hoon Lee
IPC分类号: G01B11/00
CPC分类号: G03F9/7092 , G03F7/70616
摘要: In a method of aligning a wafer, which is capable of precisely and rapidly aligning the wafer, and a wafer alignment apparatus using the method of aligning the wafer, a first wafer is aligned to form a first template pattern corresponding to an image of the first wafer. Image data of a second wafer is inputted. A kind of the second wafer is different from that of the first wafer. A second template pattern is formed by transforming the first template pattern in response to the image data of the second wafer. The second wafer is then aligned in response to the second template pattern. Accordingly, the template pattern is formed using the image data to align the wafer although wafers having different images are inspected, thereby rapidly forming the template pattern.
摘要翻译: 在使用能够精确且快速地对准晶片的晶片和使用对准晶片的方法的晶片对准装置的对准方法中,对准第一晶片以形成对应于第一晶片的图像的第一模板图案 晶圆。 输入第二晶片的图像数据。 一种第二晶片与第一晶片不同。 通过响应于第二晶片的图像数据变换第一模板图案来形成第二模板图案。 然后响应于第二模板图案对准第二晶片。 因此,使用图像数据形成模板图案,以对晶片进行对准,尽管检查具有不同图像的晶片,从而快速形成模板图案。
-
3.
公开(公告)号:US07235411B2
公开(公告)日:2007-06-26
申请号:US10883711
申请日:2004-07-06
申请人: Kyu-Hong Lim , Byung-Am Lee , Joo-Woo Kim , Chang-Hoon Lee
发明人: Kyu-Hong Lim , Byung-Am Lee , Joo-Woo Kim , Chang-Hoon Lee
IPC分类号: H01L21/00
CPC分类号: G03F9/7092 , G03F7/70616
摘要: In a method of aligning a wafer, which is capable of precisely and rapidly aligning the wafer, and a wafer alignment apparatus using the method of aligning the wafer, a first wafer is aligned to form a first template pattern corresponding to an image of the first wafer. Image data of a second wafer is inputted. A kind of the second wafer is different from that of the first wafer. A second template pattern is formed by transforming the first template pattern in response to the image data of the second wafer. The second wafer is then aligned in response to the second template pattern. Accordingly, the template pattern is formed using the image data to align the wafer although wafers having different images are inspected, thereby rapidly forming the template pattern.
摘要翻译: 在使用能够精确且快速地对准晶片的晶片和使用对准晶片的方法的晶片对准装置的对准方法中,对准第一晶片以形成对应于第一晶片的图像的第一模板图案 晶圆。 输入第二晶片的图像数据。 一种第二晶片与第一晶片不同。 通过响应于第二晶片的图像数据变换第一模板图案来形成第二模板图案。 然后响应于第二模板图案对准第二晶片。 因此,使用图像数据形成模板图案,以对晶片进行对准,尽管检查具有不同图像的晶片,从而快速形成模板图案。
-
公开(公告)号:US07155366B2
公开(公告)日:2006-12-26
申请号:US10999066
申请日:2004-11-30
申请人: Chang-Hoon Lee , Byung-Am Lee , Byung-Seol Ahn , Jae-Sun Cho , Joo-Woo Kim , Sung-Man Lee
发明人: Chang-Hoon Lee , Byung-Am Lee , Byung-Seol Ahn , Jae-Sun Cho , Joo-Woo Kim , Sung-Man Lee
IPC分类号: G06F3/00
CPC分类号: G01N21/95607
摘要: A wafer pattern inspecting apparatus and method are disclosed. The apparatus comprises an image sensor to acquire image data from a reference die and a sample die, an external memory to store the image data, an encoder to compress the data, a decoder to decompress the data, an internal memory device to store the compressed image data of the reference die, an arithmetic module to process the image data for the reference dies to extract a reference image data, a reference storage memory to store compressed reference image data, and a comparison module to compare the sample die image data with the reference image data to an extract defect data for the sample die.
摘要翻译: 公开了一种晶片图案检查装置和方法。 该装置包括:图像传感器,用于从参考管芯和样品管芯获取图像数据;存储图像数据的外部存储器;压缩数据的编码器;解压缩数据的解码器;存储压缩的内部存储器件; 参考管芯的图像数据,用于处理参考管芯的图像数据以提取参考图像数据的运算模块,用于存储压缩参考图像数据的参考存储存储器和比较模块,以将样本管芯图像数据与 将参考图像数据提取给样品管芯的提取缺陷数据。
-
公开(公告)号:US20050119844A1
公开(公告)日:2005-06-02
申请号:US10999066
申请日:2004-11-30
申请人: Chang-Hoon Lee , Byung-Am Lee , Byung-Seol Ahn , Jae-Sun Cho , Joo-Woo Kim , Sung-Man Lee
发明人: Chang-Hoon Lee , Byung-Am Lee , Byung-Seol Ahn , Jae-Sun Cho , Joo-Woo Kim , Sung-Man Lee
IPC分类号: H01L21/66 , G01N21/956 , G06F15/00
CPC分类号: G01N21/95607
摘要: A wafer pattern inspecting apparatus and method are disclosed. The apparatus comprises an image sensor to acquire image data from a reference die and a sample die, an external memory to store the image data, an encoder to compress the data, a decoder to decompress the data, an internal memory device to store the compressed image data of the reference die, an arithmetic module to process the image data for the reference dies to extract a reference image data, a reference storage memory to store compressed reference image data, and a comparison module to compare the sample die image data with the reference image data to an extract defect data for the sample die.
摘要翻译: 公开了一种晶片图案检查装置和方法。 该装置包括:图像传感器,用于从参考管芯和样品管芯获取图像数据;存储图像数据的外部存储器;压缩数据的编码器;解压缩数据的解码器;存储压缩的内部存储器件; 参考管芯的图像数据,用于处理参考管芯的图像数据以提取参考图像数据的运算模块,用于存储压缩参考图像数据的参考存储存储器和比较模块,以将样本管芯图像数据与 将参考图像数据提取给样品管芯的提取缺陷数据。
-
公开(公告)号:US07289661B2
公开(公告)日:2007-10-30
申请号:US10661633
申请日:2003-09-15
申请人: Chung-Sam Jun , Sun-Yong Choi , Kwang-Soo Kim , Joo-Woo Kim , Jeong-Hyun Choi , Dong-Jin Park
发明人: Chung-Sam Jun , Sun-Yong Choi , Kwang-Soo Kim , Joo-Woo Kim , Jeong-Hyun Choi , Dong-Jin Park
IPC分类号: G06K9/00
CPC分类号: H01L21/67253 , G01N21/9503 , G01N21/95607 , G01N2021/0162 , G01N2021/0187 , G01N2021/1736 , G01N2021/1772 , G01N2021/8411 , G01N2021/8896 , G01N2021/95615 , G01N2201/103 , G01N2201/1087
摘要: An automated and integrated substrate inspecting apparatus for performing an EBR/EEW inspection, a defect inspection of patterns and reticle error inspection of a substrate includes a first stage for supporting a substrate; a first image acquisition unit for acquiring a first image of a peripheral portion of the substrate supported by the first stage; a second stage for supporting the substrate; a second image acquisition unit for acquiring a second image of the substrate supported by the second stage; a transfer robot for transferring the substrate between the first stage and the second stage; and a data processing unit, connected to the first image acquisition unit and the second image acquisition unit, for inspecting results of an edge bead removal process and an edge exposure process performed on the substrate using the first image, and for inspecting for defects of patterns formed on the substrate using the second image.
摘要翻译: 用于执行EBR / EEW检查的自动化和一体化的基板检查装置,对基板的图案和掩模版错误检查的缺陷检查包括用于支撑基板的第一阶段; 第一图像获取单元,用于获取由所述第一平台支撑的所述基板的周边部分的第一图像; 用于支撑衬底的第二阶段; 第二图像获取单元,用于获取由第二平台支撑的基板的第二图像; 用于在第一阶段和第二阶段之间转移衬底的传送机器人; 以及数据处理单元,连接到第一图像获取单元和第二图像获取单元,用于检查使用第一图像在基板上执行的边缘珠去除处理和边缘曝光处理的结果,并且用于检查图案的缺陷 使用第二图像在基板上形成。
-
-
-
-
-