公开(公告)号：US20130059071A1

公开(公告)日：2013-03-07

申请号：US13667911

申请日：2012-11-02

Applicant: LAM RESEARCH CORPORATION

Inventor： Robert J. O'Donnell

IPC: C01F17/00 ,  C04B35/64 ,  B05D1/12 ,  B05D3/12 ,  B05D1/36

CPC classification number: H01J37/32495 ,  C23C4/02 ,  C23C4/10 ,  C23C14/564 ,  C23C16/4404 ,  C23C28/00 ,  C23C28/042 ,  C23C28/044 ,  C23C28/322 ,  C23C28/34 ,  C23C28/341 ,  C23C28/345 ,  C23C28/3455 ,  C23C28/347 ,  C23C30/00 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265

Abstract: Components of semiconductor processing apparatus are formed at least partially of erosion, corrosion and/or corrosion-erosion resistant ceramic materials. Exemplary ceramic materials can include at least one oxide, nitride, boride, carbide and/or fluoride of hafnium, strontium, lanthanum oxide and/or dysprosium. The ceramic materials can be applied as coatings over substrates to form composite components, or formed into monolithic bodies. The coatings can protect substrates from physical and/or chemical attack. The ceramic materials can be used to form plasma exposed components of semiconductor processing apparatus to provide extended service lives.

Abstract translation: 半导体处理装置的部件至少部分地形成有侵蚀，腐蚀和/或耐腐蚀腐蚀的陶瓷材料。 示例性陶瓷材料可以包括铪，锶，氧化镧和/或镝中的至少一种氧化物，氮化物，硼化物，碳化物和/或氟化物。 陶瓷材料可以作为涂层涂覆在基材上以形成复合材料部件，或者形成单块体。 涂层可以保护基材免受物理和/或化学侵蚀。 陶瓷材料可用于形成半导体加工设备的等离子体暴露部件，以延长使用寿命。