公开(公告)号：US11292084B2

公开(公告)日：2022-04-05

申请号：US16097778

申请日：2017-04-26

Applicant: LASER ENGINEERING APPLICATIONS

Inventor： Anne Henrottin ,  Jose Antonio Ramos de Campos ,  Axel Kupisiewicz ,  Gabriel Morales Cid ,  Rafael González Higueras ,  Francisco Javier Navas Martos

IPC: B23K26/062 ,  B23K26/08 ,  B23K26/32 ,  B23K26/21 ,  B23K26/324 ,  B23K26/323 ,  B23K26/082 ,  B23K26/0622 ,  B23K26/60 ,  B23K26/352 ,  B23K26/364 ,  B23K37/02 ,  B23K26/359 ,  B23K26/361 ,  B23K103/18

Abstract: A method of assembling a substrate with a part is provided. The method includes a step of structuring the substrate by a pulsed laser. In one example, the substrate is metallic and the part is polymer-based. The structuring step engraves grooves into the substrate in a pattern determined by the relative motion of the beam and the substrate. The pattern is configured to provide improved adhesion between the structured substrate and a part after assembling the substrate and the part by laser welding. The method of assembling may further include a pre-treatment step of the structured surface to allow improve laser absorption during the welding assembling.