Abstract:
Provided are an olefin composition, filler and an optoelectronic device. One illustrative olefin composition may be effectively used as a filling material for various optoelectronic devices.
Abstract:
The present application relates to an encapsulation composition and a photovoltaic cell module comprising the same, which may provide an encapsulation composition having excellent adhesivity of glass and modules with other members as well as excellent transparency, heat stability, ultraviolet stability and impact resistance. Therefore, the present application may provide a photovoltaic cell module that no peeling-off among elements, and the like, is caused, even when the module is used for a long time.
Abstract:
The present application relates to an olefin-based ionomer resin composition, to an encapsulant, and to an optoelectronic device. The resin composition according to the present application may be used as an encapsulant for a variety of optoelectronic devices, and may exhibit superior adhesion to the substrates of the optoelectronic devices. In addition, according to the present application, an olefin-based ionomer resin composition, which can provide good workability and economic advantages in the manufacture of devices without negatively affecting components such as encapsulated optoelectronic elements or the wired electrodes of optoelectronic devices, may be provided.
Abstract:
The present application relates to an olefin-based ionomer resin composition, to an encapsulant, and to an optoelectronic device. The resin composition according to the present application may be used as an encapsulant for a variety of optoelectronic devices, and may exhibit superior adhesion to the substrates of the optoelectronic devices. In addition, according to the present application, an olefin-based ionomer resin composition, which can provide good workability and economic advantages in the manufacture of devices without negatively affecting components such as encapsulated optoelectronic elements or the wired electrodes of optoelectronic devices, may be provided.
Abstract:
The present application relates to an olefin-based ionomer resin composition, to an encapsulant, and to an optoelectronic device. The resin composition according to the present application may be used as an encapsulant for a variety of optoelectronic devices, and may exhibit superior adhesion to the substrates of the optoelectronic devices. In addition, according to the present application, an olefin-based ionomer resin composition, which can provide good workability and economic advantages in the manufacture of devices without negatively affecting components such as encapsulated optoelectronic elements or the wired electrodes of optoelectronic devices, may be provided.
Abstract:
Provided are an olefin composition, filler and an optoelectronic device. One illustrative olefin composition may be effectively used as a filling material for various optoelectronic devices.