公开(公告)号：US20210179839A1

公开(公告)日：2021-06-17

申请号：US16325138

申请日：2017-11-13

Applicant: LG CHEM, LTD.

Inventor： Ju Hyeong LEE ,  Byoung Il KANG ,  Se Jin HAN

IPC: C08L55/02 ,  B29C45/00 ,  C23C18/20 ,  C23C18/16 ,  C25D3/38 ,  C25D3/12 ,  C25D3/04 ,  C25D5/56

Abstract: Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded part manufactured using the same, wherein the thermoplastic resin composition includes a-1) 1 to 30% by weight of a first graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.05 μm or more and less than 0.2 μm; a-2) 5 to 45% by weight of a second graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.2 to 0.5 μm; b) 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer; and c) 1 to 10% by weight of a (meth)acrylic acid alkyl ester polymer.

公开(公告)号：US20180002522A1

公开(公告)日：2018-01-04

申请号：US15542847

申请日：2016-11-30

Applicant: LG CHEM, LTD.

Inventor： Seo Hwa KIM ,  Seong Lyong KIM ,  Tae Hoon KIM ,  Ju Hyeong LEE

IPC: C08L33/20 ,  F25D23/08 ,  C08J5/18

CPC classification number: C08L33/20 ,  C08J5/18 ,  C08J2325/12 ,  C08J2333/20 ,  C08J2451/00 ,  C08J2451/04 ,  C08J2451/06 ,  C08J2467/02 ,  C08L25/12 ,  C08L67/02 ,  C08L75/04 ,  C08L2205/035 ,  F25D23/066 ,  F25D23/08 ,  C08L35/06 ,  C08L51/04 ,  C08L51/003 ,  C08L55/02

Abstract: The present invention relates to a thermoplastic resin composition and a molded article manufactured thereofrom. In accordance with the present invention, a thermoplastic resin composition providing higher chemical resistance with respect to a blowing agent while providing the same impact strength, gloss, and vacuum moldability as existing resin compositions when used to produce an inner case of a refrigerator, and a molded article manufactured from the same are provided.

公开(公告)号：US20170292017A1

公开(公告)日：2017-10-12

申请号：US15508042

申请日：2015-11-26

Applicant: LG CHEM, LTD.

Inventor： Dae San JUNG ,  Seung Hun HAN ,  Seong Lyong KIM ,  Hyun Ho JOO ,  Ju Hyeong LEE ,  Soo Kyeong LEE

IPC: C08L25/12 ,  C08L25/08

CPC classification number: C08L25/12 ,  C08L25/08 ,  C08L25/16 ,  C08L35/00 ,  C08L35/06 ,  C08L55/02 ,  C08L2201/08 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2207/04

Abstract: The present invention relates to a styrene-based thermoplastic resin composition with improved flowability and, more specifically, a thermoplastic resin composition, which retains heat resistance and improved flowability by introducing a low-molecular weight styrene-acrylonitrile (SAN) resin into an acrylonitrile-butadiene-styrene (ABS) resin, which has enhanced heat resistance through the addition of a heat-resistant resin, and to a molded article into which the composition is molded. According to the resin composition, there can be obtained: a thermal resin composition, which has an improvement in the flowability of the heat-resistant ABS resin and retains non-deteriorating or favorable heat resistance and impact resistance; and a molded article.

公开(公告)号：US20200325325A1

公开(公告)日：2020-10-15

申请号：US16758381

申请日：2019-09-06

Applicant: LG CHEM, LTD.

Inventor： Ju Hyeong LEE ,  Byoung Il KANG ,  Seo Hwa KIM ,  Sejin HAN ,  Seongkyun KIM

IPC: C08L55/02 ,  B29C45/00 ,  C08L83/04

Abstract: A thermoplastic resin composition includes 100 parts by weight of a base resin including 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (a) containing conjugated diene rubber having a particle diameter of 0.05 μm to 0.2 μm, 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (b) containing conjugated diene rubber having a particle diameter of greater than 0.2 μm and less than or equal to 0.5 μm, and 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer (c); and more than 0.01 parts by weight and less than 2 parts by weight of a compound having a kinematic viscosity (25° C.) greater than 5 cSt and less than 200 cSt. The resin composition has excellent plating characteristics.