公开(公告)号：US10276383B2

公开(公告)日：2019-04-30

申请号：US15640951

申请日：2017-07-03

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon Park ,  Jeong Joon Lee ,  Ju Ik Hong ,  Sang Chul Lee ,  Jangcheol Kim ,  Ik Hyun Kuon ,  Tagyoung Choi ,  Jinwook Kwak

IPC: H01L21/20 ,  H01L31/18 ,  B24B19/02 ,  B26F1/16 ,  H01L21/02

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

公开(公告)号：US20190189448A1

公开(公告)日：2019-06-20

申请号：US16283392

申请日：2019-02-22

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon PARK ,  Jeong Joon Lee ,  Ju Ik Hong ,  Sang Chul Lee ,  Jangcheol Kim ,  Ik Hyun Kuon ,  Tagyoung CHOI ,  Jinwook Kwak

IPC: H01L21/20 ,  H01L31/18 ,  H01L21/02 ,  B24B19/02 ,  B26F1/16

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

公开(公告)号：US10700047B2

公开(公告)日：2020-06-30

申请号：US14867297

申请日：2015-09-28

Applicant: LG DISPLAY CO., LTD.

Inventor： Ju Ik Hong ,  Jeong Kweon Park ,  Sang Ryeon Park ,  Yong Soo Kim ,  Jang Cheol Kim ,  Ik Hyun Kuon

IPC: H01L25/16 ,  H01L27/12 ,  H01L25/00 ,  G02F1/1333 ,  G02F1/133 ,  G02F1/1339

Abstract: Disclosed are a display apparatus, where a component disposition area facing a component disposed on a lower end of a non-display area of a panel is removed in a lower substrate configuring the panel, and a method of manufacturing the same.

公开(公告)号：US10306178B2

公开(公告)日：2019-05-28

申请号：US14105827

申请日：2013-12-13

Applicant: LG Display Co., Ltd.

Inventor： Sang Ryeon Park ,  Ho Young Jung ,  Kwan Seob Byun ,  Sung Yong Park ,  Ik Hyun Kuon

IPC: H05K7/00 ,  H04N5/64 ,  H05K5/02 ,  F21V8/00

Abstract: Disclosed is a display apparatus that seals a gap space between a display panel and a cover sidewall by an upper optical film attached to an upper surface of the display panel, wherein the display apparatus may include a rear cover with a space; a guide frame received in the space; a display panel supported by the guide frame; a panel connection member for connecting the display panel with the guide frame; and the upper optical film, wherein the cover sidewall covers side surfaces of the display panel and the upper optical film, and an end of the upper optical film is inserted into an optical film insertion groove formed in an inner surface of the cover sidewall so as to cover and seal the gap space between the display panel and the cover sidewall.

公开(公告)号：US10825837B2

公开(公告)日：2020-11-03

申请号：US15674288

申请日：2017-08-10

Applicant: LG DISPLAY CO., LTD.

Inventor： Ik Hyun Kuon ,  Jeong Kweon Park ,  Ju Ik Hong ,  Jangcheol Kim ,  Jinwook Kwak

IPC: B24D5/00 ,  H01L27/12 ,  H01L21/67 ,  B24B9/08 ,  H01L27/32 ,  H01L51/00

Abstract: Various embodiments provide a substrate processing apparatus for grinding a substrate, and a display device including a substrate in which a hole is formed in an edge of the substrate using the substrate processing apparatus. The substrate processing apparatus for processing a display substrate includes a body which, in operation, rotates, a cylindrical grinding part connected to the body, and a lateral groove formed in a surface of the cylindrical grinding part. The lateral groove is configured to accommodate the display substrate. Thus, it is possible to form a hole by grinding an edge of the display substrate so as to be matched with a designed value.

公开(公告)号：US10748771B2

公开(公告)日：2020-08-18

申请号：US16283392

申请日：2019-02-22

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon Park ,  Jeong Joon Lee ,  Ju Ik Hong ,  Sang Chul Lee ,  Jangcheol Kim ,  Ik Hyun Kuon ,  Tagyoung Choi ,  Jinwook Kwak

IPC: H01L21/20 ,  H01L31/18 ,  H01L21/02 ,  B24B19/02 ,  B26F1/16

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.