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公开(公告)号:US20250029968A1
公开(公告)日:2025-01-23
申请号:US18709398
申请日:2022-09-06
Applicant: LG ELECTRONICS INC. , LG DISPLAY CO., LTD.
Inventor: Wonseok CHOI , Sul LEE , Minseok KIM
Abstract: A display device according to an embodiment includes: a substrate; a plurality of assembly lines disposed on the substrate and including first assembly lines and second assembly lines which are alternately arranged; a planarization layer having a plurality of openings which overlap the plurality of assembly lines respectively; a plurality of light-emitting elements disposed in the plurality of openings respectively; and a plurality of conductive connection members disposed in the plurality of openings respectively to electrically connect the plurality of assembly lines and the plurality of light-emitting elements to each other, wherein the planarization layer protrudes more inwardly of the plurality of openings than one end of the respective assembly lines, and one end of the respective assembly lines is exposed from the planarization layer and comes into contact with the plurality of conductive connection members.
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2.
公开(公告)号:US20250006879A1
公开(公告)日:2025-01-02
申请号:US18688172
申请日:2022-09-01
Applicant: LG ELECTRONICS INC. , LG DISPLAY CO., LTD.
Inventor: Wonseok CHOI , Gisang HONG , Eunhye LEE , Jungmin KIM , Hun JANG , Hyeseon EOM , Moonsun LEE , Juhyun NAM
Abstract: The manufacturing method of the display device according to the embodiment includes a step of self-aligning the light emitting device inside the opening of the planarization layer overlapping the first assembly wiring and the second assembly wiring, a step of sequentially forming a conductive layer and an organic layer on a planarization layer and a light emitting device, a step of ashing the organic layer to remove the second part on the first part of the organic layer, and a step of forming a contact electrode by etching the conductive layer corresponding to the second part, wherein the contact electrode is in contact with the side of the first semiconductor layer below the light emitting device.
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公开(公告)号:US20240194844A1
公开(公告)日:2024-06-13
申请号:US18286491
申请日:2022-04-12
Applicant: LG DISPLAY CO., LTD. , LG ELECTRONICS INC.
Inventor: Gisang HONG , Jaeyoung OH , Jungmin KIM , Wonseok CHOI
IPC: H01L33/62 , H01L25/075 , H01L25/16 , H01L27/12 , H01L33/10
CPC classification number: H01L33/62 , H01L25/0753 , H01L25/167 , H01L27/1244 , H01L33/10
Abstract: A display device including a semiconductor light emitting device according to an embodiment has a substrate, a first assembly wiring and a second assembly wiring spaced apart from each other on the substrate, a planarization layer having an opening hole and a contact hole on the first assembly wiring and the second assembly wiring, a light emitting device disposed within the opening of the planarization layer, a first electrode thereof overlapping the first assembly wiring and the second assembly wiring, and a first light absorption layer disposed to surround an area where the light emitting device is disposed and having light absorption characteristics.
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4.
公开(公告)号:US20180175268A1
公开(公告)日:2018-06-21
申请号:US15846563
申请日:2017-12-19
Applicant: LG Display Co., Ltd.
Inventor: JinSu MOON , Wonseok CHOI
Abstract: A light emitting diode chip and a light emitting diode display apparatus comprising the same, are disclosed in which a screen defect caused by a defect of the light emitting diode chip is minimized. The light emitting diode chip comprises a semiconductor substrate; first and second light emitting diodes provided on the semiconductor substrate in parallel with each other while having first and second pads; a first electrode commonly connected to the first pad of each of the first and second light emitting diodes; and a second electrode commonly connected to the second pad of each of the first and second light emitting diodes, wherein the first and second light emitting diodes are electrically connected to each other in parallel.
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公开(公告)号:US20240186473A1
公开(公告)日:2024-06-06
申请号:US18285192
申请日:2022-03-31
Applicant: LG DISPLAY CO., LTD. , LG ELECTRONICS INC.
Inventor: Hyeseon EOM , Doohyun YOON , Moonsun LEE , Wonseok CHOI
CPC classification number: H01L33/62 , H01L25/167 , H01L27/124
Abstract: A display device including a semiconductor light emitting device according to an embodiment includes a substrate, first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening, a semiconductor light emitting device disposed inside the first opening and having a first electrode overlapping the first assembled wiring and the second assembled wiring, and an assembly wiring connection pattern that electrically connects the first assembly wiring and the second assembly wiring. And first electrode can be electrically connected to one of the first assembly wiring and the second assembly wiring.
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公开(公告)号:US20230215982A1
公开(公告)日:2023-07-06
申请号:US18093700
申请日:2023-01-05
Applicant: LG ELECTRONICS INC. , LG Display Co., Ltd.
Inventor: Sunyong SONG , Wonseok CHOI , Jeonghyo KWON , Junoh SHIN , Youngdo KIM
CPC classification number: H01L33/382 , H01L33/62
Abstract: Discussed is a display device including a semiconductor light emitting device. A display device can include a substrate, first assembly electrodes, second assembly electrodes and the first assembly electrodes spaced apart from each other on the substrate, an insulating layer disposed on the second assembly electrode, an assembly barrier wall including a predetermined assembly hole and disposed on the insulating layer, a plating layer electrically connected to the first assembly electrode and the second assembly electrode, and a semiconductor light emitting device disposed in the assembly hole and electrically connected to the first assembly electrode and the second assembly electrode by the plating layer.
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