DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS

    公开(公告)号:US20250029968A1

    公开(公告)日:2025-01-23

    申请号:US18709398

    申请日:2022-09-06

    Abstract: A display device according to an embodiment includes: a substrate; a plurality of assembly lines disposed on the substrate and including first assembly lines and second assembly lines which are alternately arranged; a planarization layer having a plurality of openings which overlap the plurality of assembly lines respectively; a plurality of light-emitting elements disposed in the plurality of openings respectively; and a plurality of conductive connection members disposed in the plurality of openings respectively to electrically connect the plurality of assembly lines and the plurality of light-emitting elements to each other, wherein the planarization layer protrudes more inwardly of the plurality of openings than one end of the respective assembly lines, and one end of the respective assembly lines is exposed from the planarization layer and comes into contact with the plurality of conductive connection members.

    LIGHT EMITTING DIODE CHIP AND LIGHT EMITTING DIODE DSIPLAY APPARATUS COMPRISING THE SAME

    公开(公告)号:US20180175268A1

    公开(公告)日:2018-06-21

    申请号:US15846563

    申请日:2017-12-19

    Abstract: A light emitting diode chip and a light emitting diode display apparatus comprising the same, are disclosed in which a screen defect caused by a defect of the light emitting diode chip is minimized. The light emitting diode chip comprises a semiconductor substrate; first and second light emitting diodes provided on the semiconductor substrate in parallel with each other while having first and second pads; a first electrode commonly connected to the first pad of each of the first and second light emitting diodes; and a second electrode commonly connected to the second pad of each of the first and second light emitting diodes, wherein the first and second light emitting diodes are electrically connected to each other in parallel.

    DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT EMITTING ELEMENT

    公开(公告)号:US20240186473A1

    公开(公告)日:2024-06-06

    申请号:US18285192

    申请日:2022-03-31

    CPC classification number: H01L33/62 H01L25/167 H01L27/124

    Abstract: A display device including a semiconductor light emitting device according to an embodiment includes a substrate, first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening, a semiconductor light emitting device disposed inside the first opening and having a first electrode overlapping the first assembled wiring and the second assembled wiring, and an assembly wiring connection pattern that electrically connects the first assembly wiring and the second assembly wiring. And first electrode can be electrically connected to one of the first assembly wiring and the second assembly wiring.

    DISPLAY DEVICE INCLUDING SEMICONDUCTOR LIGHT EMITTING DEVICE

    公开(公告)号:US20230215982A1

    公开(公告)日:2023-07-06

    申请号:US18093700

    申请日:2023-01-05

    CPC classification number: H01L33/382 H01L33/62

    Abstract: Discussed is a display device including a semiconductor light emitting device. A display device can include a substrate, first assembly electrodes, second assembly electrodes and the first assembly electrodes spaced apart from each other on the substrate, an insulating layer disposed on the second assembly electrode, an assembly barrier wall including a predetermined assembly hole and disposed on the insulating layer, a plating layer electrically connected to the first assembly electrode and the second assembly electrode, and a semiconductor light emitting device disposed in the assembly hole and electrically connected to the first assembly electrode and the second assembly electrode by the plating layer.

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