公开(公告)号：US20250029968A1

公开(公告)日：2025-01-23

申请号：US18709398

申请日：2022-09-06

Applicant: LG ELECTRONICS INC. ,  LG DISPLAY CO., LTD.

Inventor： Wonseok CHOI ,  Sul LEE ,  Minseok KIM

IPC: H01L25/16 ,  H01L27/12 ,  H01L33/62

Abstract: A display device according to an embodiment includes: a substrate; a plurality of assembly lines disposed on the substrate and including first assembly lines and second assembly lines which are alternately arranged; a planarization layer having a plurality of openings which overlap the plurality of assembly lines respectively; a plurality of light-emitting elements disposed in the plurality of openings respectively; and a plurality of conductive connection members disposed in the plurality of openings respectively to electrically connect the plurality of assembly lines and the plurality of light-emitting elements to each other, wherein the planarization layer protrudes more inwardly of the plurality of openings than one end of the respective assembly lines, and one end of the respective assembly lines is exposed from the planarization layer and comes into contact with the plurality of conductive connection members.

公开(公告)号：US20250006879A1

公开(公告)日：2025-01-02

申请号：US18688172

申请日：2022-09-01

Applicant: LG ELECTRONICS INC. ,  LG DISPLAY CO., LTD.

Inventor： Wonseok CHOI ,  Gisang HONG ,  Eunhye LEE ,  Jungmin KIM ,  Hun JANG ,  Hyeseon EOM ,  Moonsun LEE ,  Juhyun NAM

IPC: H01L33/62 ,  H01L25/16

Abstract: The manufacturing method of the display device according to the embodiment includes a step of self-aligning the light emitting device inside the opening of the planarization layer overlapping the first assembly wiring and the second assembly wiring, a step of sequentially forming a conductive layer and an organic layer on a planarization layer and a light emitting device, a step of ashing the organic layer to remove the second part on the first part of the organic layer, and a step of forming a contact electrode by etching the conductive layer corresponding to the second part, wherein the contact electrode is in contact with the side of the first semiconductor layer below the light emitting device.

公开(公告)号：US20240194844A1

公开(公告)日：2024-06-13

申请号：US18286491

申请日：2022-04-12

Applicant: LG DISPLAY CO., LTD. ,  LG ELECTRONICS INC.

Inventor： Gisang HONG ,  Jaeyoung OH ,  Jungmin KIM ,  Wonseok CHOI

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H01L33/10

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1244 ,  H01L33/10

Abstract: A display device including a semiconductor light emitting device according to an embodiment has a substrate, a first assembly wiring and a second assembly wiring spaced apart from each other on the substrate, a planarization layer having an opening hole and a contact hole on the first assembly wiring and the second assembly wiring, a light emitting device disposed within the opening of the planarization layer, a first electrode thereof overlapping the first assembly wiring and the second assembly wiring, and a first light absorption layer disposed to surround an area where the light emitting device is disposed and having light absorption characteristics.

公开(公告)号：US20240186473A1

公开(公告)日：2024-06-06

申请号：US18285192

申请日：2022-03-31

Applicant: LG DISPLAY CO., LTD. ,  LG ELECTRONICS INC.

Inventor： Hyeseon EOM ,  Doohyun YOON ,  Moonsun LEE ,  Wonseok CHOI

IPC: H01L33/62 ,  H01L25/16 ,  H01L27/12

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L27/124

Abstract: A display device including a semiconductor light emitting device according to an embodiment includes a substrate, first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening, a semiconductor light emitting device disposed inside the first opening and having a first electrode overlapping the first assembled wiring and the second assembled wiring, and an assembly wiring connection pattern that electrically connects the first assembly wiring and the second assembly wiring. And first electrode can be electrically connected to one of the first assembly wiring and the second assembly wiring.

公开(公告)号：US20230215982A1

公开(公告)日：2023-07-06

申请号：US18093700

申请日：2023-01-05

Applicant: LG ELECTRONICS INC. ,  LG Display Co., Ltd.

Inventor： Sunyong SONG ,  Wonseok CHOI ,  Jeonghyo KWON ,  Junoh SHIN ,  Youngdo KIM

IPC: H01L33/38 ,  H01L33/62

CPC classification number: H01L33/382 ,  H01L33/62

Abstract: Discussed is a display device including a semiconductor light emitting device. A display device can include a substrate, first assembly electrodes, second assembly electrodes and the first assembly electrodes spaced apart from each other on the substrate, an insulating layer disposed on the second assembly electrode, an assembly barrier wall including a predetermined assembly hole and disposed on the insulating layer, a plating layer electrically connected to the first assembly electrode and the second assembly electrode, and a semiconductor light emitting device disposed in the assembly hole and electrically connected to the first assembly electrode and the second assembly electrode by the plating layer.

公开(公告)号：US20180175268A1

公开(公告)日：2018-06-21

申请号：US15846563

申请日：2017-12-19

Applicant: LG Display Co., Ltd.

Inventor： JinSu MOON ,  Wonseok CHOI

IPC: H01L33/62 ,  H01L27/12 ,  H01L27/15 ,  H01L33/36

Abstract: A light emitting diode chip and a light emitting diode display apparatus comprising the same, are disclosed in which a screen defect caused by a defect of the light emitting diode chip is minimized. The light emitting diode chip comprises a semiconductor substrate; first and second light emitting diodes provided on the semiconductor substrate in parallel with each other while having first and second pads; a first electrode commonly connected to the first pad of each of the first and second light emitting diodes; and a second electrode commonly connected to the second pad of each of the first and second light emitting diodes, wherein the first and second light emitting diodes are electrically connected to each other in parallel.

公开(公告)号：US20240250065A1

公开(公告)日：2024-07-25

申请号：US18290995

申请日：2021-07-21

Applicant: LG ELECTRONICS INC.

Inventor： Chilkeun PARK ,  Byoungkwon CHO ,  Wonseok CHOI ,  Wonjae CHANG

IPC: H01L25/065 ,  H01L27/12 ,  H01L33/62

CPC classification number: H01L25/0652 ,  H01L27/124 ,  H01L33/62

Abstract: The display device can include a substrate, a barrier rib having an assembly hole on the substrate, a semiconductor light emitting device in the assembly hole, and a first connection part disposed in the assembly hole and on the barrier rib and electrically connected to a side surface of the semiconductor light emitting device. In the embodiment, maximum luminance can always be obtained regardless of whether the assembling wirings disposed on the substrate are disposed on the same layer or different layers, and each pixel has constant luminance, thereby improving image quality due to luminance uniformity.

公开(公告)号：US20230420423A1

公开(公告)日：2023-12-28

申请号：US18247789

申请日：2020-10-06

Applicant: LG ELECTRONICS INC.

Inventor： Soohyun KIM ,  Junoh SHIN ,  Youngdo KIM ,  Wonseok CHOI ,  Dohan KIM

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L2933/0066 ,  H01L33/62

Abstract: A display device according to embodiments of the present invention comprises: a substrate; a plurality of first metal wiring layers formed on the substrate; a first insulating layer stacked on the substrate to cover the first metal wiring; a second metal wiring layer stacked on at least a portion of the first insulating layer so as to be spaced apart therefrom; and a second insulating layer stacked on the second metal wiring. The second metal wiring layer comprises: at least one first metal layer having a first conductivity; and at least one second metal layer having a higher conductivity than the first metal layer, wherein the first metal layer may block diffusion of the second metal layer.

公开(公告)号：US20190355860A1

公开(公告)日：2019-11-21

申请号：US16530701

申请日：2019-08-02

Applicant: LG ELECTRONICS INC.

Inventor： Hyungseok KIM ,  Kwangsun JI ,  Youngjoo EO ,  Heonmin LEE ,  Choul KIM ,  Hojung SYN ,  Wonseok CHOI ,  Kihoon PARK ,  Junghoon CHOI ,  Hyunjin YANG

IPC: H01L31/0747 ,  H01L31/0216

Abstract: A solar cell can include a single crystalline semiconductor substrate; an emitter region positioned on an incident surface of the substrate, forming a p-n junction with the single crystalline semiconductor substrate; a first passivation layer positioned on a rear surface of the substrate and made of an oxide material; a back surface field layer positioned on the first passivation layer and forming a hetero junction with the single crystalline semiconductor substrate; a first electrode electrically connected to the emitter region; and a second electrode electrically connected to the single crystalline semiconductor substrate

公开(公告)号：US20180301580A1

公开(公告)日：2018-10-18

申请号：US15949628

申请日：2018-04-10

Applicant: LG ELECTRONICS INC.

Inventor： Soohyun KIM ,  Hyun LEE ,  Wonseok CHOI ,  Younho HEO

IPC: H01L31/0725 ,  H01L31/0735

Abstract: According to an aspect of the present invention, there is provided a compound semiconductor solar cell, comprising a first cell, the first cell including: a first base layer formed of a gallium indium phosphide (GaInP)-based compound semiconductor; a first emitter layer forming a p-n junction with the first base layer; a first window layer positioned on a front surface of the first base layer or the first emitter layer; and a first back surface field layer positioned on a back surface of the first emitter layer or the first base layer, wherein the first window layer of the first cell is formed of a four-component III-V compound semiconductor.