公开(公告)号：US20220359257A1

公开(公告)日：2022-11-10

申请号：US17620533

申请日：2019-07-02

Applicant: LG ELECTRONICS INC.

Inventor： Donghae OH ,  Changseo PARK ,  Jin Hyung LEE ,  Changhyun JEONG

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

Abstract: Discussed is an assembly substrate used in a display manufacturing method for placing semiconductor light-emitting devices to predetermined positions thereof using an electric field and a magnetic field, the assembly substrate including a base part; a plurality of assembly electrodes extending in one direction and disposed in parallel on the base part; a dielectric layer disposed on the base part to cover the plurality of assembly electrodes; and partition walls disposed on the dielectric layer and defining cells at predetermined intervals along the one direction of the plurality of assembly electrodes so as to overlap portions of the plurality of assembly electrodes, and the semiconductor light-emitting devices being placed into the cells, respectively, wherein a protrusion part protrudes inward from at least one of inner surfaces of each of the cells.

公开(公告)号：US20180301577A1

公开(公告)日：2018-10-18

申请号：US15951379

申请日：2018-04-12

Applicant: LG Electronics Inc.

Inventor： Younho HEO ,  Soohyun KIM ,  Hyun LEE ,  Changhyun JEONG

IPC: H01L31/0224 ,  H01L31/02 ,  H01L31/18 ,  H01L31/0216

CPC classification number: H01L31/022441 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/0304 ,  H01L31/1868 ,  H01L31/1888 ,  H01L31/1892 ,  Y02E10/50

Abstract: According to an aspect of the present invention, there is provided a method for manufacturing a compound semiconductor solar cell, comprising: forming a sacrificial layer on one surface of a mother substrate; forming a compound semiconductor layer on the sacrificial layer; forming a first protective layer formed of a compound semiconductor on the compound semiconductor layer; depositing a second passivation layer on the first passivation layer; attaching a first lamination film on the second protective layer; separating the compound semiconductor layer, the first and second protective layers, and the first lamination film from the mother substrate by performing an ELO process to remove the sacrificial layer; forming a back electrode on the compound semiconductor layer; attaching a second lamination film on the back electrode; removing the first lamination film; removing the second protective layer; removing the first protective layer; and forming a front electrode on the compound semiconductor layer.

公开(公告)号：US20220351993A1

公开(公告)日：2022-11-03

申请号：US17621107

申请日：2019-07-09

Applicant: LG ELECTRONICS INC.

Inventor： Changhyun JEONG ,  Seongmin MOON ,  Changseo PARK ,  Donghae OH

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075

Abstract: Discussed is an assembly board including: a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; and barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes, wherein the plurality of assembly electrodes include first electrodes and second electrodes disposed on different planes on the base portion, and wherein the first electrodes are disposed on one surface of the base portion, and the second electrodes are disposed on one surface of the dielectric layer.