公开(公告)号：US20220157759A1

公开(公告)日：2022-05-19

申请号：US17431854

申请日：2020-02-06

申请人： LG ELECTRONICS INC.

发明人： Seongmin MOON ,  Changseo PARK ,  Kiseong JEON

IPC分类号： H01L23/00 ,  H01L25/075 ,  H01L33/44

摘要： A display device and a method of making the display device are discussed. The display device includes a substrate, a plurality of partition walls disposed on the substrate, a plurality of semiconductor light emitting elements disposed on the substrate and disposed between the plurality of partition walls, and a passivation layer covering at least parts of the plurality of semiconductor light emitting elements and at least parts of the plurality of partition walls, wherein the passivation layer extends from side surfaces of the plurality of partition walls in a direction toward the plurality of semiconductor light emitting elements, so as to cover at least parts of the side surfaces of the plurality of partition walls and at least the parts of the plurality of semiconductor light emitting elements.

公开(公告)号：US20220367757A1

公开(公告)日：2022-11-17

申请号：US17765763

申请日：2019-10-02

申请人： LG ELECTRONICS INC.

发明人： Seongmin MOON ,  Changseo PARK

IPC分类号： H01L33/38 ,  H01L33/62 ,  H01L27/15 ,  H01L33/00

摘要： The present disclosure provides a display device using semiconductor light-emitting elements mounted on an assembly substrate in fluid, and a method for manufacturing same. The assembly substrate on which semiconductor light-emitting elements are mounted (assembled) comprises first assembly electrodes and second assembly electrodes intersecting the first assembly electrodes. By a dielectrophoretic force generated by applying a voltage to the assembly electrodes, semiconductor light-emitting elements may be mounted at the intersections of the assembly electrodes. In addition, by using the assembly substrate as a repair substrate, a region of the substrate in which assembly defects have occurred can be repaired, after assembly or transfer of the semiconductor light-emitting elements.

公开(公告)号：US20220077122A1

公开(公告)日：2022-03-10

申请号：US17530155

申请日：2021-11-18

申请人： LG ELECTRONICS INC.

发明人： Changseo PARK ,  Jinhyung LEE ,  Jungsub KIM ,  Seongmin MOON ,  Younho HEO

IPC分类号： H01L25/075 ,  H01L33/00 ,  H01L21/683 ,  H01L33/62

摘要： Discussed is an assembly substrate used for a display device manufacturing method of mounting semiconductor light-emitting diodes on the assembly substrate at preset positions using electric field and magnetic field. The assembly substrate includes a base portion, a plurality of assembly electrodes on the base portion, a dielectric layer on the base portion to cover the assembly electrodes, a barrier wall on the base portion, and a metal shielding layer on the base portion, wherein the metal shielding layer overlaps the barrier wall.

公开(公告)号：US20230079059A1

公开(公告)日：2023-03-16

申请号：US17798664

申请日：2020-02-13

申请人： LG ELECTRONICS INC.

发明人： Younho HEO ,  Jinhyung LEE ,  Seongmin MOON ,  Changseo PARK

IPC分类号： H01L21/673 ,  H01L33/00

摘要： A substrate for manufacturing a display device according to the present invention includes a base part; assembly electrodes extending in one direction and disposed on the base part at predetermined intervals; an etch stop layer formed on at least a portion of the base part; a barrier wall part formed on the etch stop layer while forming a cell on which a semiconductor light emitting device is mounted along an extension direction of the assembly electrodes. The etch stop layer is formed on at least a first region in which the assembly electrodes are formed among the entire region of the base part.

公开(公告)号：US20230015395A1

公开(公告)日：2023-01-19

申请号：US17780880

申请日：2019-12-18

申请人： LG ELECTRONICS INC.

发明人： Jinhyung LEE ,  Changseo PARK ,  Younho HEO ,  Kisu KIM ,  Seongmin MOON

IPC分类号： H01L33/38 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

摘要： Discussed is a display device including a base portion; a first electrode formed on the base portion; a barrier rib portion stacked on the first electrode while forming a plurality of cells; a second electrode formed on the barrier rib portion; and semiconductor light emitting diodes seated in the plurality of cells, wherein the first electrode and the second electrode are spaced apart from each other with the barrier rib portion disposed therebetween.

公开(公告)号：US20220351993A1

公开(公告)日：2022-11-03

申请号：US17621107

申请日：2019-07-09

申请人： LG ELECTRONICS INC.

发明人： Changhyun JEONG ,  Seongmin MOON ,  Changseo PARK ,  Donghae OH

IPC分类号： H01L21/67 ,  H01L21/683 ,  H01L25/075

摘要： Discussed is an assembly board including: a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; and barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes, wherein the plurality of assembly electrodes include first electrodes and second electrodes disposed on different planes on the base portion, and wherein the first electrodes are disposed on one surface of the base portion, and the second electrodes are disposed on one surface of the dielectric layer.

公开(公告)号：US20240063327A1

公开(公告)日：2024-02-22

申请号：US18271395

申请日：2021-01-08

申请人： LG ELECTRONICS INC.

发明人： Jinsung KIM ,  Sungyun PARK ,  Seongmin MOON ,  Junghoon KIM

IPC分类号： H01L33/00 ,  H01L27/15

CPC分类号： H01L33/005 ,  H01L27/156

摘要： A self-assembly device comprises a chamber configured to accommodate a fluid in which a plurality of light emitting devices are floated on a surface thereof, the fluid having a first height, a mounting part disposed on a bottom portion of the chamber to mount a substrate, a fluid level adjuster configured to adjust a height of the fluid, and a voltage supplier configured to apply a voltage to the substrate to assemble the floated plurality of light emitting devices when the height of the fluid decreases from the first height to a second height.

公开(公告)号：US20230138336A1

公开(公告)日：2023-05-04

申请号：US17978781

申请日：2022-11-01

申请人： LG ELECTRONICS INC.

发明人： Seongmin MOON ,  Yangwoo BYUN ,  Kiseong JEON ,  Jinhyung LEE

IPC分类号： H01L33/54 ,  H01L33/38 ,  H01L25/16

摘要： A display device according to an embodiment can include a first assembly electrode and a second assembly electrode disposed to be spaced apart from each other on a substrate, a first insulating layer disposed on the first assembly electrode and the second assembly electrode, a semiconductor light emitting device having an assembly barrier wall including a predetermined assembly hole and disposed on the first insulating layer, a side electrode electrically connected to a first side surface of the semiconductor light emitting device, and a second panel electrode electrically connected to the second conductivity type semiconductor layer.

公开(公告)号：US20220246583A1

公开(公告)日：2022-08-04

申请号：US17430537

申请日：2019-09-02

申请人： LG ELECTRONICS INC.

发明人： Changseo PARK ,  Seongmin MOON ,  Kiseong JEON

IPC分类号： H01L25/075 ,  H01L33/38 ,  H01L33/62 ,  H01L33/44

摘要： A method for manufacturing a display device according to an embodiment of the present invention has a step for assembling semiconductor light-emitting devices on a substrate; a step for applying a photosensitive organic insulator onto the semiconductor light-emitting devices and the substrate; a step for removing the photosensitive organic insulator from the regions other than a space between the substrate and bottoms of the semiconductor light-emitting devices; and a step for curing the photosensitive organic insulator filled in the space.

公开(公告)号：US20200184859A1

公开(公告)日：2020-06-11

申请号：US16789053

申请日：2020-02-12

申请人： LG ELECTRONICS INC.

发明人： Changseo PARK ,  Seongmin MOON ,  Bongchu SHIM ,  Kiseong JEON ,  Hyunwoo CHO

IPC分类号： G09F9/33 ,  H01L33/44 ,  H01L33/62 ,  H01L27/15

摘要： Discussed in a method of fabricating a display device, the method including transferring a substrate to an assembly position, and placing a plurality of semiconductor light emitting devices each having a first conductive semiconductor layer and a second conductive semiconductor layer into a fluid chamber, guiding a movement of the plurality of semiconductor light emitting devices in the fluid chamber to assemble the plurality of semiconductor light emitting devices at preset positions of the substrate, etching at least one of the first conductive semiconductor layer and the second conductive semiconductor layer while the plurality of semiconductor light emitting devices are placed at the preset positions of the substrate and connecting a first wiring electrode and a second wiring electrode respectively to each of the plurality of semiconductor light emitting devices.