公开(公告)号：US20190235351A1

公开(公告)日：2019-08-01

申请号：US16377098

申请日：2019-04-05

Applicant: LG ELECTRONICS INC.

Inventor： Changhwan LEE ,  Jinwon KANG ,  Hangtae KIM ,  Yunsup SHIN ,  Minyoung LEE ,  Ayoung CHO

IPC: G03B15/05 ,  H05K1/18 ,  H05K1/02 ,  H01S5/022 ,  H05K1/14 ,  H01S5/42 ,  H01S5/024

Abstract: A lighting device includes a printed circuit board (PCB), a submount mounted on the PCB, a die mounted on the submount and including a plurality of light emitting devices, and a pad inserted into a hole formed in the submount such that the die and the PCB are electrically connected through the submount, connected to the die by a wire bonding, and electrically connected to the PCB.

公开(公告)号：US20180209616A1

公开(公告)日：2018-07-26

申请号：US15877317

申请日：2018-01-22

Applicant: LG ELECTRONICS INC.

Inventor： Changhwan LEE ,  Jinwon KANG ,  Hangtae KIM ,  Yunsup SHIN ,  Minyoung LEE ,  Ayoung CHO

IPC: F21V19/00 ,  H05K1/18 ,  H05K1/02 ,  F21V29/70 ,  F21K9/69

CPC classification number: F21V19/0025 ,  F21K9/69 ,  F21V29/70 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H04N13/254 ,  H05K1/0203 ,  H05K1/181 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A lighting device includes a printed circuit board (PCB), a submount mounted on the PCB, a die mounted on the submount and including a plurality of light emitting devices, and a pad inserted into a hole formed in the submount such that the die and the PCB are electrically connected through the submount, connected to the die by a wire bonding, and electrically connected to the PCB.