公开(公告)号：US20210337703A1

公开(公告)日：2021-10-28

申请号：US17039449

申请日：2020-09-30

Applicant: LG ELECTRONICS INC.

Inventor： Gun LEE ,  Seongmoo CHO ,  Kwangsoo KIM ,  Siho CHOI

IPC: H05K7/20 ,  H05K5/02 ,  H05K5/03

Abstract: The present disclosure relates to a power module assembly, and may include a plurality of cooling fins on an upper cover covering an upper portion of a module housing and a lower cover covering a lower portion of the module housing to cool the power module received inside the module housing, and the plurality of cooling fins may constitute a cooling passage to allow coolant to flows into the module housing, and expand a heat exchange area of the power module, thereby improving the cooling performance of the power module.

公开(公告)号：US20210329815A1

公开(公告)日：2021-10-21

申请号：US17033353

申请日：2020-09-25

Applicant: LG ELECTRONICS INC.

Inventor： Kwangsoo KIM ,  Seongmoo CHO ,  Oksun YU ,  Hyunsi HWANG ,  Siho CHOI ,  Gun LEE

IPC: H05K7/20 ,  H02M1/32 ,  H02M7/537

Abstract: The present disclosure relates to an electric power module and an inverter apparatus having the same. The electric power module of the present disclosure may include a power device that converts the frequency of input power for output; a housing in which a passage of cooling fluid is disposed to accommodate the power device therein, and a cooling member, one side of which is in direct heat exchange with the power device, and the other side of which is in direct heat exchange with the cooling fluid, wherein the cooling member is made of a metal foam having a multi-porous structure. As a result, it may be possible to increase a heat transfer area of the heat conductor, and suppress the occurrence of pressure loss in the cooling fluid.

公开(公告)号：US20210243923A1

公开(公告)日：2021-08-05

申请号：US17035263

申请日：2020-09-28

Applicant: LG ELECTRONICS INC.

Inventor： Hyunsi HWANG ,  Seongmoo CHO ,  Kwangsoo KIM ,  Siho CHOI ,  Gun LEE

IPC: H05K7/20

Abstract: A power module assembly is disclosed. A power module assembly according to an embodiment includes a module housing part having a power module, and an upper cover part and a lower cover part disposed to cover upper and lower sides of the module housing part, respectively, and defining a flow path part, through which cooling water flows, in spaces apart from the module housing part. The module housing part exposes a part of the power module on the flow path part. With the configuration, the cooling water can flow in direct contact with the power module, thereby more improving heat dissipation performance of the power module assembly.

公开(公告)号：US20210305193A1

公开(公告)日：2021-09-30

申请号：US17207086

申请日：2021-03-19

Applicant: LG Electronics Inc.

Inventor： Siho CHOI ,  Seongmoo CHO ,  Kwangsoo KIM ,  Gun LEE

IPC: H01L23/00 ,  H01L23/373 ,  H01L25/065

Abstract: A power module according implementations of the present disclosure includes a bonding layer for bonding two adjacent members. The bonding layer is formed by melting, applying, and solidifying a bonding material that has excellent thermal conductivity and electrical conductivity. The melted bonding material includes a plurality of anti-tilting members. The two members bonded during the process of solidifying the melted bonding material are supported by the plurality of anti-tilting members. This may allow tilting caused during the formation of the bonding layer to be suppressed.

公开(公告)号：US20210257280A1

公开(公告)日：2021-08-19

申请号：US17038429

申请日：2020-09-30

Applicant: LG ELECTRONICS INC.

Inventor： Siho CHOI ,  Seongmoo Cho ,  Oksun Yu ,  Kwangsoo Kim ,  Gun Lee

IPC: H01L23/495 ,  H05K7/02

Abstract: A power module is disclosed. A power module according to an embodiment of the present disclosure may include a first substrate and a second substrate spaced apart from each other, an electronic device unit provided on at least either one of the first and second substrates, and a lead frame unit provided between the first and second substrates. One side of the lead frame unit may be connected to an external circuit, and the other side thereof may be configured to electrically connect the first and second substrates. Accordingly, the lead frame unit may perform a function of electrically connecting the first and second substrates instead of a via spacer in the related art.