公开(公告)号：US20150070909A1

公开(公告)日：2015-03-12

申请号：US14482466

申请日：2014-09-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Kyeoung An JUNG ,  Jung Hun OH

IPC: H01L33/48 ,  F21V29/00 ,  F21V3/04 ,  F21V3/00

CPC classification number: H01L33/48 ,  F21V3/00 ,  F21V3/10 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A light emitting device package includes a package body, and a light emitting device chip provided on a chip mount area of the package body. A molding member is provided on the package body. The package body includes a central area having the chip mount area and a chip non-mount area adjacent to the chip mount area. An upper surface of the light emitting device chip is higher than an upper surface of the package body in the chip non-mount area and an upper surface of the package body in the peripheral area.

Abstract translation: 发光器件封装包括封装体，以及设置在封装体的芯片安装区域上的发光器件芯片。 成型构件设置在包装体上。 封装体包括具有芯片安装区域的中心区域和与芯片安装区域相邻的芯片非安装区域。 发光器件芯片的上表面高于芯片非安装区域中的封装体的上表面和周边区域中的封装体的上表面。