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公开(公告)号：US20210013378A1
公开(公告)日：2021-01-14
申请号：US16980125
申请日：2019-03-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Seung Jae LEE , Sung Joo SONG , Yeong June LEE , Koh Eun LEE , Hui Seong KANG , Min Ji JIN
Abstract: An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer comprises polymer resin and wavelength conversion particles which absorb the light in the ultraviolet wavelength band and generate light in a visible wavelength band.
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