公开(公告)号：US20200350468A1

公开(公告)日：2020-11-05

申请号：US16772867

申请日：2018-12-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun LEE ,  Hui Seong KANG ,  Min Ji JIN

IPC: H01L33/48 ,  H01L33/38 ,  H01L33/64 ,  H01L33/62 ,  H01L33/56

Abstract: An embodiment discloses a semiconductor device package, comprising: a body including a cavity; a plurality of electrodes disposed inside the body; a semiconductor device disposed in the cavity of the body; and a transparent member disposed on the cavity, wherein the body comprises: a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other; a first corner area formed by the first side surface and the third side surface; a second corner area formed by the first side surface and the fourth side surface; a third corner area formed by the second side surface and the fourth side surface; and a fourth corner area formed by the second side surface and the third side surface, and wherein the plurality of electrodes comprises a first electrode on which the semiconductor device is disposed, wherein the first electrode comprises: a fifth side surface and a sixth side surface facing each other; a seventh side surface connecting the fifth side surface and the sixth side surface; a fifth corner area formed by the fifth side surface and the seventh side surface; and a sixth corner area formed by the sixth side surface and the seventh side surface, wherein the fifth corner area is disposed between the second corner area and the third corner area, and the sixth corner area is disposed between the third corner area and the fourth corner area.

公开(公告)号：US20190074422A1

公开(公告)日：2019-03-07

申请号：US16119469

申请日：2018-08-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun LEE ,  Hui Seong KANG ,  Ga Yeon KIM ,  Yeong June LEE ,  Min Ji JIN ,  Jae Joon YOON

IPC: H01L33/64 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

公开(公告)号：US20210217932A1

公开(公告)日：2021-07-15

申请号：US17059889

申请日：2019-05-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun LEE

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60

Abstract: Disclosed in an embodiment is a semiconductor device package comprising: a body comprising a cavity; a semiconductor device disposed within the cavity; and a light transmission member disposed on an upper portion of the cavity, wherein the body comprises a first conductive part and a second conductive part disposed to be spaced apart from each other in a first direction, a first insulating part disposed between the first conductive part and the second conductive part, and a second insulating part disclosed in an edge region where a lower surface and side surfaces of the body meet, wherein the cavity comprises a stepped portion on which the light transmission member is disposed, and wherein the second insulating part overlaps with the stepped portion in a vertical direction of the body.

公开(公告)号：US20180315908A1

公开(公告)日：2018-11-01

申请号：US15770862

申请日：2016-11-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun LEE ,  Yon Tae MOON ,  Ga Yeon KIM ,  Yun Soo SONG ,  Hwan Hee JEONG

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L33/36 ,  H01L33/486 ,  H01L33/50 ,  H01L33/505 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/644

Abstract: According to an embodiment, a light-emitting device is disclosed. The disclosed light-emitting device comprises: a substrate having a body and first and second lead electrodes on the body; a light-emitting chip arranged on the second lead electrode and electrically connected to the first and second lead electrodes; a phosphor film arranged on the light-emitting chip; a reflective member arranged on the outer peripheries of the light-emitting chip and the phosphor film, respectively; and an optical lens, which is arranged on the phosphor film and on the reflective member, and which has a lens portion that has an aspherical shape.

公开(公告)号：US20210013378A1

公开(公告)日：2021-01-14

申请号：US16980125

申请日：2019-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Jae LEE ,  Sung Joo SONG ,  Yeong June LEE ,  Koh Eun LEE ,  Hui Seong KANG ,  Min Ji JIN

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/48

Abstract: An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer comprises polymer resin and wavelength conversion particles which absorb the light in the ultraviolet wavelength band and generate light in a visible wavelength band.

公开(公告)号：US20170077354A1

公开(公告)日：2017-03-16

申请号：US15125500

申请日：2014-11-14

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun LEE ,  Ga Yeon KIM ,  Hwan Hee JEONG

IPC: H01L33/38 ,  H01L33/46 ,  H01L33/62 ,  H01L33/14

CPC classification number: H01L33/382 ,  H01L33/145 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62

Abstract: One embodiment provides a light emitting device comprising: a substrate; a first electrode arranged on the substrate; a light emitting structure arranged on the first electrode and including a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers; and a second electrode arranged on the second semiconductor layer, wherein the second electrode includes: a pad electrode; and a branch electrode extending from the pad electrode and having a hexagonal structure for enabling an upper surface of the second semiconductor layer to be exposed in a hexagonal shape.

Abstract translation: 一个实施例提供一种发光器件，包括：衬底; 布置在所述基板上的第一电极; 发光结构，其布置在所述第一电极上并且包括第一半导体层，第二半导体层和所述第一和第二半导体层之间的有源层; 以及布置在所述第二半导体层上的第二电极，其中所述第二电极包括：焊盘电极; 以及从所述焊盘电极延伸并具有六边形结构的分支电极，以使所述第二半导体层的上表面能够以六边形的形式露出。