公开(公告)号：US20200350468A1

公开(公告)日：2020-11-05

申请号：US16772867

申请日：2018-12-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun LEE ,  Hui Seong KANG ,  Min Ji JIN

IPC: H01L33/48 ,  H01L33/38 ,  H01L33/64 ,  H01L33/62 ,  H01L33/56

Abstract: An embodiment discloses a semiconductor device package, comprising: a body including a cavity; a plurality of electrodes disposed inside the body; a semiconductor device disposed in the cavity of the body; and a transparent member disposed on the cavity, wherein the body comprises: a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other; a first corner area formed by the first side surface and the third side surface; a second corner area formed by the first side surface and the fourth side surface; a third corner area formed by the second side surface and the fourth side surface; and a fourth corner area formed by the second side surface and the third side surface, and wherein the plurality of electrodes comprises a first electrode on which the semiconductor device is disposed, wherein the first electrode comprises: a fifth side surface and a sixth side surface facing each other; a seventh side surface connecting the fifth side surface and the sixth side surface; a fifth corner area formed by the fifth side surface and the seventh side surface; and a sixth corner area formed by the sixth side surface and the seventh side surface, wherein the fifth corner area is disposed between the second corner area and the third corner area, and the sixth corner area is disposed between the third corner area and the fourth corner area.

公开(公告)号：US20210013378A1

公开(公告)日：2021-01-14

申请号：US16980125

申请日：2019-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Jae LEE ,  Sung Joo SONG ,  Yeong June LEE ,  Koh Eun LEE ,  Hui Seong KANG ,  Min Ji JIN

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/48

Abstract: An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer comprises polymer resin and wavelength conversion particles which absorb the light in the ultraviolet wavelength band and generate light in a visible wavelength band.

公开(公告)号：US20180166612A1

公开(公告)日：2018-06-14

申请号：US15560956

申请日：2016-03-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Ji JIN

IPC: H01L33/50 ,  H01L33/52

CPC classification number: H01L33/50 ,  H01L33/44 ,  H01L33/507 ,  H01L33/52 ,  H01L2224/14 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012

Abstract: A light emitting device package of one embodiment includes a base, a light emitting device disposed on the base and having a first refractive index, a wavelength conversion portion disposed on the light emitting device and having a second refractive index, and a buffering layer disposed between the light emitting device and the wavelength conversion portion and having a third refractive index between the first refractive index and the second refractive index.

公开(公告)号：US20190302573A1

公开(公告)日：2019-10-03

申请号：US16302308

申请日：2017-05-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Beom CHOI ,  Tae Sung LEE ,  Min Ji JIN

IPC: G03B15/05 ,  H01L33/58 ,  H01L33/50

Abstract: An embodiment may have a substrate (110) including a predetermined cavity (C); a plurality of light emitting chips (120) spaced apart from the cavity (C) of the substrate (110); a frame (130), disposed on the substrate (110) including a support portion (132) and a guide portion (134) including a predetermined through hole (H1); and a lens unit (140) disposed in the through hole (H1) of the guide portion (134).

公开(公告)号：US20190074422A1

公开(公告)日：2019-03-07

申请号：US16119469

申请日：2018-08-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun LEE ,  Hui Seong KANG ,  Ga Yeon KIM ,  Yeong June LEE ,  Min Ji JIN ,  Jae Joon YOON

IPC: H01L33/64 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.