公开(公告)号：US20200350468A1

公开(公告)日：2020-11-05

申请号：US16772867

申请日：2018-12-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun LEE ,  Hui Seong KANG ,  Min Ji JIN

IPC: H01L33/48 ,  H01L33/38 ,  H01L33/64 ,  H01L33/62 ,  H01L33/56

Abstract: An embodiment discloses a semiconductor device package, comprising: a body including a cavity; a plurality of electrodes disposed inside the body; a semiconductor device disposed in the cavity of the body; and a transparent member disposed on the cavity, wherein the body comprises: a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other; a first corner area formed by the first side surface and the third side surface; a second corner area formed by the first side surface and the fourth side surface; a third corner area formed by the second side surface and the fourth side surface; and a fourth corner area formed by the second side surface and the third side surface, and wherein the plurality of electrodes comprises a first electrode on which the semiconductor device is disposed, wherein the first electrode comprises: a fifth side surface and a sixth side surface facing each other; a seventh side surface connecting the fifth side surface and the sixth side surface; a fifth corner area formed by the fifth side surface and the seventh side surface; and a sixth corner area formed by the sixth side surface and the seventh side surface, wherein the fifth corner area is disposed between the second corner area and the third corner area, and the sixth corner area is disposed between the third corner area and the fourth corner area.

公开(公告)号：US20200036161A1

公开(公告)日：2020-01-30

申请号：US16465461

申请日：2017-12-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Baek Jun KIM ,  Ho Jae KANG ,  Hui Seong KANG ,  Keon Hwa LEE ,  Yong Gyeong LEE

IPC: H01S5/024 ,  H01S5/022 ,  H01S5/183

Abstract: Embodiments pertain to a semiconductor device package, a method of manufacturing the semiconductor device package, and an autofocusing apparatus including the semiconductor device package. The semiconductor device package according to an embodiment may include: a package body; a diffusion unit; and a vertical cavity surface emitting laser (VCSEL) semiconductor device disposed on a support and under the diffusion unit. According to the embodiment, the package body may include the support, a first sidewall protruding to a first thickness from an edge region of an upper surface of the support and having a first upper surface of a first width, and a second sidewall protruding to a second thickness from the first upper surface of the first side wall and having a second upper surface of a second width, wherein the support, the first sidewall, and the second sidewall may be integrally formed with the same material. The diffusion unit may be disposed on the first upper surface of the first sidewall and may be disposed to be surrounded by the second sidewall.

公开(公告)号：US20190074422A1

公开(公告)日：2019-03-07

申请号：US16119469

申请日：2018-08-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun LEE ,  Hui Seong KANG ,  Ga Yeon KIM ,  Yeong June LEE ,  Min Ji JIN ,  Jae Joon YOON

IPC: H01L33/64 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

公开(公告)号：US20210013378A1

公开(公告)日：2021-01-14

申请号：US16980125

申请日：2019-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Jae LEE ,  Sung Joo SONG ,  Yeong June LEE ,  Koh Eun LEE ,  Hui Seong KANG ,  Min Ji JIN

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/48

Abstract: An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer comprises polymer resin and wavelength conversion particles which absorb the light in the ultraviolet wavelength band and generate light in a visible wavelength band.

公开(公告)号：US20170069806A1

公开(公告)日：2017-03-09

申请号：US15123097

申请日：2015-02-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Muyng Gi KIM ,  Hui Seong KANG ,  Yeong June LEE ,  Bong Kul MIN

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L23/3121 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: One embodiment comprises: a body having a cavity which includes a bottom and sides; a light-emitting element arranged within the cavity of the body; a molding part arranged within the cavity so as to seal the light-emitting element; and a lens which includes a light incident surface and a light emitting surface and is arranged on the molding part, wherein the diameter of the light incident surface of the lens is smaller than a maximum diameter of the cavity, and the height of the lens is lower than the diameter of the light incident surface of the lens.

Abstract translation: 一个实施例包括：具有包括底部和侧面的空腔的主体; 布置在所述主体的腔体内的发光元件; 模制部件，其布置在所述腔体内以密封所述发光元件; 以及透镜，其包括光入射面和发光面，并配置在成型部上，其中，所述透镜的光入射面的直径小于所述空腔的最大直径，所述透镜的高度为 低于透镜的光入射面的直径。