公开(公告)号：US20200243452A1

公开(公告)日：2020-07-30

申请号：US16756552

申请日：2018-10-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Hyung Kyu YOON ,  Sung Min CHAE

IPC: H01L23/538 ,  H01L23/498 ,  H01L25/16 ,  H01L25/18 ,  H01L23/00

Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.

公开(公告)号：US20230282590A1

公开(公告)日：2023-09-07

申请号：US18197245

申请日：2023-05-15

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Hyung Kyu YOON ,  Sung Min CHAE

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L23/5387 ,  H01L23/49866 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/16227

Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.

公开(公告)号：US20230225048A1

公开(公告)日：2023-07-13

申请号：US18151698

申请日：2023-01-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Soo CHO ,  Hyung Kyu YOON ,  Sung Min CHAE

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0296 ,  H05K1/028 ,  H05K1/115

Abstract: A flexible circuit board comprises a substrate on which a chip mounting area is defined, a circuit pattern disposed on the substrate, and a protective layer on the circuit pattern, and the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of dummy patterns, and the first circuit pattern includes a first pad part, a second pad part, and a first wiring part connected to the first pad part and the second pad part, and the second circuit pattern includes a third pad part, a fourth pad part, and a second wiring part connected to the third pad part and the fourth pad part, and a through hole is disposed in an inner region of the first circuit pattern.